Ultra-Thin 0.30mm High-Frequency PCB | 2-Layer Rogers R04003 Board with ENIG | UGPCB

Ultra-Thin High-Frequency PCB: 0.30mm Thick 2-Layer Rogers R04003 Descripción general del producto & Definición

Este Ultra-Thin High-Frequency PCB de UGPCB is a double-sided printed circuit board manufactured using Rogers R04003 high-frequency laminate. Engineered for electronic devices with stringent demands on size, peso, and RF performance, this board excels in radio frequency (RF), microwave communication, and high-speed digital applications. Its core advantage lies in the combination of an extremely thin profile (0.30milímetros) y superior dielectric properties, making it a critical component for device miniaturization and enhanced performance.

Especificaciones técnicas & Clasificación

• Clasificación: High-Frequency/Microwave tarjeta de circuito impreso, Ultra-Thin PCB

• capas: 2 capas (PCB de doble cara)

• Grosor del tablero: 0.30 milímetros

• Materia prima: Rogers R04003 Laminate (0.2mm core, built up to final thickness)

• Peso del cobre (Finished): 1onz / 1onz (approx. 35μm per side)

• Acabado superficial: Oro de inmersión de níquel químico (ACEPTAR), 2metro”

• Dimensiones: 124.45 mm x 39.69 milímetros

Materiales & Características de rendimiento

• Laminado: ROGERS RO4003C laminate is used, featuring a stable dielectric constant (Dk ~3.0) and a very low dissipation factor (df). This is essential for Tableros de circuito de alta frecuencia to minimize signal loss and ensure signal integrity.

• Lámina de cobre: Standard 1oz (35μm) electro-deposited copper, offering excellent conductivity and current-carrying capacity.

• Acabado superficial: ACEPTAR (2metro”) provides a flat, solderable, and oxidation-resistant surface. The thin gold layer is particularly suitable for RF and microwave PCBs, minimizing signal attenuation due to the skin effect at high frequencies.

Estructura, Diseño & Manufacturing Key Points

1. Estructura: Standard 2-layer board structure with plated through-holes (PTH) para conectividad entre capas.

2. Consideraciones críticas de diseño:

   • Control de impedancia: Precise controlled impedance PCB design is crucial. Trace width/spacing must be carefully calculated based on the Dk of RO4003 and the 0.30mm dielectric thickness to achieve target impedance values (p.ej., 50Oh).

   • Gestión Térmica: The thin profile offers a short path for heat dissipation. Layout of high-power components must be planned accordingly.

   • Mechanical Handling: The 0.30mm thickness offers flexibility but requires careful handling and support during assembly to prevent bending or damage.

3. Production Process Flow:
   Material Preparation → Inner Layer Imaging → Lamination (RO4003 core with prepreg) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging & Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Profiling to 124.45x39.69mm → Electrical Testing (Flying Probe) → Final Inspection & Packaging

How It Works & Características clave

A PCB de alta frecuencia acts as a “highway” for signal transmission, ensuring minimal loss, distorsión, and delay. El Rogers RO4003 material y precision impedance-controlled design are fundamental to this performance.

Características clave del producto:

• Excellent High-Frequency Performance: The low-loss characteristics of RO4003 laminate enhance RF circuit efficiency and Integridad de señal.

• Extremely Thin and Lightweight: The 0.30mm thin core PCB profile saves critical space and aids in product lightweighting.

• Alta fiabilidad & Solderability: The ENIG finish ensures long-term shelf life, excellent solder joint reliability, and a flat surface for fine-pitch components.

• Precision Manufacturing: Fabricated to exact dimensions (124.45×39.69milímetros) for reliable integration into compact assemblies.

Aplicaciones primarias & Casos de uso

Este ultra-thin Rogers PCB is ideal for:

• RFID Modules: Antenna and tablas de circuito in compact readers.

• Satellite Communication & GPS Devices: Miniaturized receiver modules.

• Automotive Radar Sensors: Antenna boards for 77GHz radar systems.

• High-End Test & Equipo de medición: Probes and signal acquisition boards.

• Portable Communication Devices & UAV: RF front-end modules where size and weight are critical.

Why Choose UGPCB for Your Ultra-Thin High-Frequency PCB?

Succeeding in competitive RF and high-speed markets requires a PCB partner with deep expertise. UGPCB provides a complete solution, de de alta frecuencia diseño de PCB apoyo a high-reliability manufacturing compliant with IPC standards. Every 0.30mm thin PCB we produce undergoes rigorous impedance testing and quality checks, guaranteeing performance in real-world applications.

For your microwave antenna board o high-speed transmission module, trust UGPCB to deliver superior Integridad de señal and power efficiency. We specialize in RF circuit board fabrication y microwave PCB manufacturing.

Contact us today for a quote on your high-frequency PCB project.