RO4350B 세라믹 하이브리드 고주파 PCB 제조업체 | 4L RF 마이크로파 회로 기판

Engineer Superior RF Performance: The UGPCB RO4350B Ceramic Hybrid High Frequency PCB Solution

In the era of 5G, 레이더, 위성 통신, the performance of your 고주파 PCB is critical to system success. Selecting a PCB laminate that offers exceptional RF characteristics, 신뢰할 수 있음, and cost-effectiveness is paramount for every RF engineer and procurement specialist. UGPCB, 선도 PCB 제조업체 그리고 PCBA service provider, presents its advanced Ceramic Hybrid High Frequency PCB utilizing Rogers RO4350B and FR4 lamination technology. We deliver a complete solution from PCB 설계 에게 PCB 조립 (PCB).

4-Layer Rogers Ceramic Hybrid High-Frequency PCB Layer Stack-up

1. 제품개요 & 정의

그만큼 RO4350B Ceramic Hybrid High Frequency PCB is a high-performance 인쇄 회로 기판 engineered for radio frequency (RF) and microwave applications. It innovatively combines Rogers RO4350B ceramic-filled hydrocarbon laminate with standard FR4 epoxy glass material through 다층 PCB lamination technology. 이것 “hybrid” approach allows critical RF circuits (예를 들어, 안테나, 필터, amplifiers) to be routed on the low-loss RO4350B areas, while cost-sensitive digital control and power management circuits reside on the FR4 areas, achieving an optimal balance between performance and cost.

2. 핵심 자료 & 건설

재료: This product features a 로저스 RO4350B + FR4 mixed laminate 건설. RO4350B is a ceramic-filled thermoset polymer material known for its stable dielectric constant (DK) 낮은 소산 인자 (Df). FR4 is a standard epoxy glass weave laminate, valued for its economy and versatility.
건설: This model is a standard 4-레이어 PCB. 일반적으로, the outer layers (L1 & L4), which host RF circuitry, use RO4350B dielectric, bonded to the inner FR4 core using prepreg. This structure ensures signal integrity in RF paths while reducing overall material cost.
주요 사양 & 규정 준수:
- 유전 상수 (DK): 3.48 @ 10 GHz. This stable value minimizes phase shift and impedance variance, 결정적인 controlled impedance PCB design.
- 열전도율: 0.69 w/m · k. Superior to standard FR4, aiding heat dissipation from active RF components and improving long-term reliability.
- 가연성 등급: UL 94 다섯-0. Meets the highest standard for flame retardancy.
- 표면 마감: 이머젼 골드 (동의하다). Provides a flat, 납땜 가능한 표면, 우수한 내산화성, and long shelf life, 이상적입니다 high-frequency SMT assembly 그리고 PCBA 공정.
- 완성된 두께: 1.0 mm
- 구리 무게: 1 온스 (35 μm)

3. 중요한 설계 고려 사항 & 작동원리

임피던스 제어: RF transmission lines (예를 들어, microstrip, stripline) require precise impedance control (typically 50Ω or 75Ω). Designers must calculate trace width using the stable Dk of RO4350B (3.48) and dielectric thickness (0.762mm) to ensure minimal signal reflection.
Hybrid Zone Transition: Signal transitions between RO4350B and FR4 areas cause impedance discontinuities due to Dk mismatch. 최적 PCB 레이아웃 requires mitigation techniques like tapered traces, matching networks, or optimized via transitions.
열 관리: Despite its improved thermal conductivity (0.69 w/m · k), high-power RF designs may still require thermal vias, heatsinks, or metal-core substrates for effective PCB thermal management.
작동원리: 이것 회로 기판 acts as the physical substrate and transmission medium for RF signals. Its core function is to utilize the low-loss, low-dispersion properties of RO4350B to transmit electromagnetic signals with high efficiency and minimal distortion across target frequency bands (from hundreds of MHz to tens of GHz), while integrating control logic via the hybrid structure for complete system functionality.

4. 주요 특징 & 장점

Exceptional High-Frequency Performance: Low loss and stable Dk/Df ensure superior 신호 무결성.
Optimized System Cost: Hybrid construction significantly reduces the use of premium material, offering a cost-effective PCB solution.
높은 신뢰성 & 내구성: 다섯-0 flammability rating and robust thermal performance ensure stability in demanding environments.
설계 & Assembly Friendly: Compatible with standard PCB 제작 그리고 SMT assembly processes, streamlining PCBA 생산.

5. 제조공정

UGPCB adheres to a strict 품질 관리 regime for high frequency PCB manufacturing:
재료 준비 & Inner Layer Imaging → Hybrid Lamination & Registration → Precision Drilling & Plating → Pattern Imaging & Etching → Impedance Control Testing → Solder Mask & 표면 마감 (동의하다) → Electrical Testing & Final Audit → Shipping. Each step is specially controlled for high-frequency characteristics.

PCB Production Process

6. 기본 응용 프로그램 & 사용 사례

This product is ideal for applications demanding high frequency and signal fidelity:

무선 통신: 5G base station antennas/RF modules, microwave backhaul, satellite communication terminals.
자동차 전자: Millimeter-wave radar (77 GHz), V2X telematics modules.
항공우주 & 방어: Radar systems, electronic warfare (EW) 장비, guidance systems.
시험 & 측정: 핵심 RF circuit boards in network analyzers, 스펙트럼 분석기, and high-frequency signal sources.

Partner with UGPCB for Your High-Frequency Projects

Whether you are an engineer engaged in RF PCB layout or a sourcing professional seeking a reliable circuit board supplier, UGPCB’s RO4350B Hybrid High Frequency PCB is your ideal solution. We provide not only high-quality PCB 제작 but also full-spectrum support from PCB 설계 검토 to end-to-end PCBA services, accelerating your time-to-market.