PCB 설계, 조작, PCB, PECVD, 원 스톱 서비스를 사용한 구성 요소 선택

다운로드 | 에 대한 | 연락하다 | 사이트맵

LCD Liquid Crystal Display PCB | 2-Layer ENIG FR-4 Display PCB Manufacturer - UGPCB

표준 PCB 보드/

LCD Liquid Crystal Display PCB | 2-Layer ENIG FR-4 Display PCB Manufacturer

이름: LCD 액정 디스플레이 PCB 회로 기판

그릇: KB6165F Plate

두께: 1.6mm

레이어: 2엘

구리 포일: 1.0 온스

프로세스: 이머젼 골드 2U

크기: 147.2*65mm

최소 조리개: 0.22mm

선폭/모멘트: 0.3*0.27mm

동박 두께: 1/1온스

표면 처리: 무연 스프레이 틴

  • 제품 세부정보

제품개요: A High-Reliability PCB Solution for LCD Display Driving

UGPCB는 다음을 소개합니다.LCD Liquid Crystal Display PCB Circuit Board (모델: UGPCB-LCD-001), 고성능2-layer rigid FR-4 printed circuit board engineered specifically for liquid crystal display driving applications. This product uses Kingboard KB6165F high-end copper-clad laminate as the base material, with a board thickness of 1.6 MM과 1 oz copper foil (약 35 μm). The surface finish employs the동의하다 (전기 니켈/침지 금) process at 2U . The board measures 147.2 × 65 mm, with a minimum hole diameter of 0.22 mm and minimum line width/spacing of 0.3 mm/0.27 mm.

이것LCD display PCB serves as the critical circuit carrier that connects display driver chips to liquid crystal glass panels. It finds extensive applications in small to medium-sized LCD display modules, industrial control panel displays, automotive infotainment system displays, and smart home human-machine interaction interfaces.

2-Layer ENIG FR-4 Display PCB

제품 정의: What Is an LCD Liquid Crystal Display PCB?

LCD Liquid Crystal Display PCB (인쇄 회로 기판) is a specialized circuit board designed for liquid crystal display driving systems. It performs three core functions: driving signal transmission, 전력 분배, and timing control signal routing. 표준과 달리 PCB circuit boards, an LCD display PCB demands tighter tolerances in line width precision, 임피던스 제어, and surface flatness.

This product belongs to therigid double-sided PCB category with 2 레이어 (2엘). It uses FR-4 grade flame-retardant material (UL 94 다섯-0 등급) and supports both SMT (표면 실장 기술) and through-hole component hybrid assembly processes. The board meets IPC-6012 Class 2 성능 요구 사항, making it suitable for industrial electronics and consumer electronics applications.

Design Specifications: Critical Parameters for LCD PCB Engineering

기판 재료: The KB6165F Advantage

This product uses Kingboard KB6165F copper-clad laminate, which delivers the following key performance characteristics:

  • 유리전이온도 (Tg): ≥150°C, ensuring dimensional stability during lead-free reflow soldering processes
  • 열분해 온도 (Td): 325℃, providing excellent thermal reliability
  • 가연성 등급: UL 94 다섯-0, with flame self-extinguishing within 10 seconds in vertical burn tests
  • CTE (열 팽창 계수): 12–15 ppm/°C in X-Y direction, 40–230 ppm/°C in Z direction, offering good thermal matching with LCD driver ICs
  • CAF (전도성 양극 필라멘트) 저항: Excellent anti-CAF performance ensuring long-term reliability
  • Lead-Free Compatible: Meets RoHS environmental requirements

According to IPC-2221 design standards, materials with Tg ≥150°C are suitable for lead-free assembly processes, capable of maintaining structural integrity under reflow soldering peak temperatures reaching 245–260°C.

Layer Count and Stack-up Design

The product features 2 레이어 (2엘) with a standard 1.6 mm 보드 두께. IPC-2221의 경우, 1.6 mm represents the most commonly used thickness specification for rigid PCB, balancing mechanical strength with assembly convenience.

Line Width and Spacing Design

The minimum line width of 0.3 mm and minimum line spacing of 0.27 mm are carefully selected parameters forLCD driver PCB 신호 무결성. Under IPC-2221 standards, the minimum spacing requirement for conventional voltage (≤30V) digital signal traces is 0.1 mm (4 밀). This product’s 0.27 mm (약 10.6 밀) spacing far exceeds the IPC minimum requirement, providing ample margin for signal quality.

Design Calculation Reference (based on IPC-2221 outer layer conductor current-carrying capacity simplified formula):

Outer layer trace current-carrying capacity ≈ k × ΔT^0.448 × W^0.725 × T^0.725

Where k = 0.048 (for outer layer). At a 10°C temperature rise, 에이 0.3 mm trace with 1 oz copper thickness delivers a theoretical current-carrying capacity of approximately 1.2–1.5 A—sufficient for the power and signal trace requirements of conventional LCD driver boards.

최소 구멍 직경

The minimum hole diameter of 0.22 mm (약 8.7 밀) falls within the precision drilling category. Under IPC-6012, the standard drilled hole diameter tolerance is ±0.08 mm (approximately ±3 mil) . 을 위한 0.22 mm 마이크로 비아, manufacturing tolerances are typically controlled within ±0.05 mm.

표면 마감: ENIG at 2U

그만큼동의하다 (전기 니켈/침지 금) surface finish with 2Ugold thickness (약 0.05 μm) complies with IPC-4552 requirements. IPC-4552 Revision A (issued in 2017) specifies gold deposit thickness of 0.04 μm ~ 0.10 μm (1.6 μin to 4.0 μin) and nickel thickness of 3 μm ~ 6 μm.

ENIG Surface Finish Advantages:

  • Excellent solderability supporting multiple reflow cycles
  • Strong wire bonding capability
  • Superior oxidation and corrosion resistance
  • Flat surface suitable for fine-pitch component mounting
  • Extended shelf life

작동 원리: Signal Transmission Mechanisms of the LCD Display PCB

그만큼LCD liquid crystal display PCB operates on two core functions신호 전송 그리고전력 분배.

1. Display Driver Signal Transmission: Display data from the main controller chip (MCU/SoC) travels through thePCB 회로 기판 via microstrip or stripline traces to the LCD driver IC. The driver IC converts digital signals into analog grayscale voltages, which are then output through thePCB‘s fine traces to the ITO electrodes on the liquid crystal glass panel, controlling the twist angle of liquid crystal molecules to produce the displayed image.

2. Timing Control Signal Routing: 그만큼LCD display PCB carries critical timing signals including VSYNC (Vertical Sync), HSYNC (Horizontal Sync), DCLK (Pixel Clock), and DE (Data Enable). The transmission delay and impedance matching of these signals directly affect display quality.

3. Power Management Distribution: 그만큼LCD circuit board converts the input power (일반적으로 3.3 V or 5 다섯) through DC-DC conversion circuits to generate the multiple voltage levels required by the LCD panel, including VGH (gate-on voltage, 일반적으로 +15 V to +30 다섯), VGL (gate-off voltage, typically −5 V to −15 V), and AVDD (analog power voltage).

제품 분류: LCD PCB Categories

LCD liquid crystal display PCBs can be classified along the following dimensions:

레이어 수에 의해

  • Single-sided boards: Used for simple segment-code LCD displays
  • Double-sided boards (2엘): This product’s category, used for small to medium-sized TFT-LCD display drivers
  • Multilayer boards (4L and above): Used for high-resolution, large-format display modules

표면 마감별

  • ENIG boards: This product’s category, offering the best overall performance
  • OSP boards: Lower cost, suitable for short-lifecycle consumer electronics
  • HASL boards: Suitable for LCD driver boards with wider pin pitches

응용 프로그램에 의해

  • Consumer Electronics LCD PCBs: Smartphone secondary displays, smartwatch displays, e-reader screens
  • Industrial Control LCD PCBs: Industrial HMI, instrument panel displays, CNC operation panel display drivers
  • Automotive LCD PCBs: In-vehicle infotainment systems, digital instrument clusters, HUD display control boards
  • Medical Device LCD PCBs: Patient monitors, ultrasound diagnostic equipment, medical imaging system display driver boards

Core Performance Specifications

매개 변수사양Reference Standard
Laminate MaterialKB6165F (Kingboard)-
라미네이트 유형FR-4 Glass Fabric Copper-Clad LaminateUL 94 다섯-0 
레이어 수2 레이어 (2엘)-
보드 두께1.6 mmIPC-2221
외층 구리 두께1 온스 (35 μm)IPC-6012 Class 2
표면 마감2U만” (0.05 μm Au)IPC-4552
Nickel Layer Thickness3–6 μm (underlayer)IPC-4552 Rev A
최소 구멍 직경0.22 mmIPC-6012
최소 선 너비0.3 mmIPC-2221
Minimum Line Spacing0.27 mmIPC-2221
보드 크기147.2 × 65 mm-
Tg (유리전이온도)≥150°C-
Td (열분해 온도)325℃-
CTE (X-Y Direction)12–15 ppm/°C-
가연성 등급UL 94 다섯-0UL 94
아크 저항≥60 seconds-
표면 저항≥2.6 × 10⁸ MΩ-
부피 저항성≥3.4 × 10⁹ MΩ·cm-

Product Structure Analysis

그만큼LCD liquid crystal display PCB structure comprises the following layers from outside to inside:

1. Outer Layer – ENIG Surface Finish: Gold layer at 2U” (약 0.05 μm) protects the underlying nickel layer from oxidation. The bottom nickel layer at 3–6 μm serves as a diffusion barrier between copper and gold.

2. Copper Foil Layer: 1 온스 (약 35 μm) electrodeposited copper foil, etched to form the circuit pattern.

3. Dielectric Layer: FR-4 grade glass fabric impregnated with epoxy resin, 약 0.7 mm thick (single layer), providing electrical insulation and mechanical support.

4. Copper Foil Layer: Bottom layer 1 oz copper forming the bottom circuit pattern.

5. Outer Layer – ENIG Surface Finish: Symmetrical ENIG treatment matching the top layer.

제품 기능: Why Choose UGPCB’s LCD Display PCB?

① High-Precision Manufacturing: Minimum hole diameter of 0.22 mm and minimum line width/spacing of 0.3 mm/0.27 mm support the routing requirements of high-density LCD driver boards.

② Premium Substrate Materials: Kingboard KB6165F high-end FR-4 material with Tg ≥150°C and UL 94 다섯-0 flammability rating ensures lead-free process compatibility and long-term reliability.

③ Standardized Surface Finish: 2U만” process complies with IPC-4552, delivering excellent solderability, 내산화성, and extended shelf life.

④ Rigorous Quality Control: Products undergo full-process quality control per IPC-6012 Class 2 표준, covering hole diameter tolerance (±0.08 mm), hole copper thickness (≥20 μm), solder mask integrity, 그리고 전기 테스트.

⑤ LCD-Optimized Design: 임피던스 제어, 신호 무결성, and power integrity are optimized specifically for liquid crystal display driving applications.

제조공정: From Raw Material to Finished Product

UGPCB follows a rigorous standard manufacturing process forLCD display PCBs:

1. 재료 절단 →2. Inner Layer Pattern Transfer (drill positioning and registration marks) →3. 교련 (minimum hole diameter 0.22 mm ± 0.08 mm) →4. Electroless Copper Deposition/Electroplating (홀 금속화, hole copper thickness ≥20 μm) →5. Outer Layer Pattern Transfer (선 너비 0.3 mm / 간격 0.27 mm) →6. 패턴 도금 (copper build-up to 1 온스) →7. 에칭 →8. Solder Mask Printing →9. ENIG Surface Finish (동의하다, gold thickness 2U”) →10. 프로파일링 (치수 147.2 × 65 mm) →11. 전기 테스트 (100% 전기 테스트) →12. 최종검사 (AOI + 육안 검사) →13. Packaging and Shipping

일반적인 응용 프로그램 시나리오

📱 Consumer Electronics: Smartphone secondary displays, smartwatch displays, e-reader screen driver PCBs.

🏭 Industrial Control: PLC human-machine interfaces (HMI), industrial instrument displays, CNC operation panel display driver boards.

LCD display PCB industrial control display application

🚗 Automotive Electronics: In-vehicle infotainment systems, digital instrument clusters, head-up display (HUD) display control PCBs.

🏥 Medical Devices: Patient monitors, ultrasound diagnostic equipment, medical imaging system display driver circuit boards.

🏠 Smart Home: Smart access control system displays, smart appliance control panels, building intercom system display module PCBs.

UGPCB를 선택하는 이유는 무엇입니까??

UGPCB brings years of LCD display PCB manufacturing experience to every project. We use premium raw materials like Kingboard KB6165F, strictly enforce IPC-6012 Class 2 품질 기준, and operate high-precision drilling and circuit patterning equipment. 당신이 필요 여부 LCD PCB 프로토 타이핑 or volume production, UGPCB delivers high-precision, high-reliability product solutions.

📞 Get Your LCD Display PCB Solution Today

UGPCB LCD liquid crystal display PCBs have been successfully deployed in numerous industrial, 자동차, and consumer electronics display projects. 당신이 필요 여부 LCD PCB prototyping for design validation or PCB turnkey assembly services, UGPCB provides full-process support from PCB fabrication to PCB SMT 어셈블리.

Contact UGPCB’s professional team today for your custom LCD display PCB solution!

📧 Email: [info@ugpcb.com]
📞 Phone: [+86-755-XXXXXXXX]
🌐 Website: [www.ugpcb.com]

Data Source Attribution

The technical standards and data cited in this document are derived from the following authoritative sources:

  1. IPC-6012 -경질 인쇄 기판의 자격 및 성능 사양 – Defines PCB hole diameter tolerances (standard ±0.08 mm), hole copper thickness (수업 2 ≥20 μm), and performance class requirements
  2. IPC-2221 -인쇄 기판 설계에 대한 일반 표준 – Specifies line width/spacing design requirements and current-carrying capacity calculation formulas
  3. IPC-4552 Revision A (issued 2017) -Performance Specification for Electroless Nickel/Immersion Gold (동의하다) Plating for Printed Boards – Specifies ENIG deposit thickness requirements: nickel 3–6 μm, gold 0.04–0.10 μm
  4. UL 94 -Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances – V-0 rating requires flame self-extinguishing within 10 초
  5. Kingboard KB6165F Product Datasheet – Substrate technical parameters (Tg ≥150°C, Td 325°C, UL 94 다섯-0, 등.) 
  6. GB/T 4677 -Test Methods for Printed Boards – Used in conjunction with IPC standards as inspection references

이전:

다음:

답장을 남겨주세요

메시지를 남겨주세요