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제품개요: What Is an OSP Antioxidant PCB Circuit Board?
안OSP antioxidant PCB circuit board 용도유기 납땜성 방부제 (OSP) as its copper surface finish. This process deposits an ultra-thin organic film on bare copper surfaces. The film prevents oxidation during storage and assembly. During soldering, the flux quickly dissolves the OSP film. This exposes clean copper for reliable solder joints.
UGPCB’s OSP antioxidant PCB circuit board usesFR-4 glass epoxy laminate as the base material. It features 35μm (1 온스) 구리박, 1.6mm 보드 두께, and dimensions of 68.36 × 34.6mm. The minimum finished hole size is 0.45mm. Minimum trace width is 0.15mm and minimum spacing is 0.20mm. The product fully complies with IPC-6012E (rigid printed board qualification and performance) and IPC-4555 (high-temperature OSP performance) 명세서.
이것double-sided OSP PCB serves consumer electronics, 통신 장비, and industrial controls. It works best where cost sensitivity and surface flatness matter most.
과학적인 제품 분류
Based on international PCB classification systems, this product falls into these categories:
| 분류 차원 | 범주 |
|---|---|
| 기판 재료 | FR-4 epoxy glass fabric rigid PCB |
| 레이어 수 | 양면 (two-layer circuitry) |
| 표면 마감 | OSP (유기 납땜성 방부제) antioxidant |
| 가연성 등급 | UL 94 다섯-0 |
| IPC Performance Class | 수업 2 (dedicated service electronic products) |
| 동박 두께 | 1 온스 (35μm) standard copper |
| 보드 두께 | 1.6mm standard rigid board |
| Hole Type | Through-hole compatible with SMT |
Key Technical Parameters Explained
기판: FR-4 Epoxy Glass Fabric
FR-4 is the most common rigid substrate in the PCB 산업. “정말로” means flame-retardant. “4” indicates epoxy resin combined with glass fabric that meetsUL 94 다섯-0 flammability standards. UL 94 다섯-0 requires vertical specimens to self-extinguish within10 초 after two 10-second flame applications. No flaming drips may ignite cotton.
유리 전이 온도 (Tg) measures heat resistance. Standard FR-4 Tg ranges from 130–140°C. Mid-Tg FR-4 reaches 150–160°C. High-Tg FR-4 exceeds 170°C. This product uses standard FR-4 with Tg ≥ 130°C (IPC-4101/21 compliant). This meets the thermal shock demands of reflow soldering (peak temperatures 240–260°C).
동박 두께: 35μm (1 온스)
Copper thickness determines current-carrying capacity. This product uses35μm 구리박, known as1 온스 구리 (1 oz/ft² ≈ 35μm). IPC-2221에 따르면, 1 oz copper at 10°C temperature rise carries approximately:
- 0.15mm (6 밀) 추적 너비: 0.5–0.7A
- 0.20mm (8 밀) 추적 너비: 0.8–1.0A
The 35μm copper thickness is the most common standard for double-sided PCBs. It balances cost, current capacity, and manufacturing yield.
보드 크기: 68.36 × 34.6mm
The finished board measures68.36mm × 34.6mm. This compact size suits tight electronic modules. Small PCBs demand tighter precision—dimensional tolerances typically stay within ±0.15mm (IPC-6012 클래스 2).
Minimum Finished Hole Size: 0.45mm
0.45mm is the minimum plated through-hole (PTH) diameter. This hole size is a standard in the industry. It ensures reliable plating (aspect ratio approximately 3.6:1 with 1.6mm board thickness). The hole size accommodates most DIP components and standard SMT pad designs.
PCB 두께: 1.6mm
1.6mm is the most common board thickness in PCB manufacturing. It provides excellent mechanical strength and flexural rigidity. It matches standard connectors and sockets perfectly.
추적 너비와 간격: 0.15mm / 0.20mm
This product offersminimum trace width of 0.15mm (~에 대한 6 밀) 그리고minimum spacing of 0.20mm (~에 대한 8 밀). According to IPC classification, these dimensions fall into수업 2 (dedicated service electronic products). This precision meets most medium-density PCB designs, including MCU control boards, power management modules, and interface converter boards.
How OSP Antioxidant Process Works
The OSP process grows an ultra-thin organic film on clean bare copper throughchemical adsorption. The OSP film mainly consists ofalkyl benzimidazole compounds (azole-based). Film thickness typically ranges from0.2–0.5μm.
Protection Mechanism
The OSP film protects copper surfaces through three mechanisms:
- Physical barrier – The organic film forms a dense molecular layer. It blocks oxygen and moisture from contacting the copper surface.
- Chemical adsorption – Active groups in OSP molecules bond chemically with copper atoms. This creates strong adhesion.
- Selective protection – The OSP film covers only copper areas. It does not affect solder mask or other non-metallic regions.
Behavior During Soldering
During SMT reflow, temperatures reach190–230°C. The flux’s active ingredients decompose and dissolve the OSP film. This exposes clean copper underneath. Solder directly contacts bare copper and formsintermetallic compounds (IMC). This creates reliable electrical connections. The OSP filmcompletely decomposes with no residue after soldering.
주요 성능 특성
Based on IPC-TM-650 test methods:
| 특성 | 전형적인 가치 / 요구 사항 | Reference Standard |
|---|---|---|
| OSP Film Thickness | 0.2–0.5μm | IPC-4555 |
| Solder Wetting Angle | ≤30° (~ 후에 1 반사) | IPC-TM-650 2.4.1 |
| Solder Spread Ratio | ≥80% | IPC-TM-650 2.4.1 |
| Oxidation Protection (ambient) | ≥6 months | IPC-4555 |
| Contact Resistance Change | ≤10% (~ 후에 6 months storage) | IPC-TM-650 |
OSP Antioxidant PCB Manufacturing Process
OSP antioxidant PCB manufacturing follows strict process controls. Every step affects final quality and reliability.
Front-End Processes (Substrate Preparation & 회로 패터닝)
- 재료 절단 – Cut FR-4 copper-clad laminate to size
- 교련 – CNC drilling with 0.45mm minimum hole size
- Electroless Copper / 전기도금 – Metallize hole walls for layer-to-layer connection
- Circuit Pattern Transfer – Dry film / wet film exposure and development
- 에칭 – Remove unwanted copper to create 0.15mm trace / 0.20mm spacing circuitry
- Solder Mask Printing – Apply green or other colored solder mask ink
- Pre-Clean – Remove oxides and contaminants before surface finish
OSP Coating Process (Core Process)
The typical OSP coating flow:
Degreasing → Double Water Rinse → Micro-Etching → Double Water Rinse → Acid Pickling → DI Water Rinse → OSP Film Formation → Air Drying → DI Water Rinse → Final Drying
- Micro-Etching – Removes copper oxides and creates a uniform microscopically rough surface. This promotes OSP film growth.
- OSP Film Formation – Immerse the PCB in OSP chemistry (alkyl benzimidazole, organic acids, copper chloride, and deionized water). The film grows through chemical adsorption on copper surfaces.
- Film Thickness Control – Precise control is critical. Too thin means poor heat resistance. Too thick hinders flux action and solder flow.
Back-End Processes
- 라우팅 – CNC routing to final dimensions
- 전기 테스트 – Flying probe or fixture testing
- 최종검사 – Visual inspection and film thickness sampling
- 진공 포장 – Moisture-proof and oxidation-proof packaging
제품 특징 및 핵심 장점
우수한 표면 평탄도
The OSP film is only0.2–0.5μm thick. It forms through chemical adsorption with uniform thickness and a smooth surface. This preserves the original copper foil flatness. It is ideal forfine-pitch SMT 구성 요소 (such as 0.4mm and below pitch QFP, QFN packages).
우수한 납땜성
The OSP film dissolves quickly in flux during reflow. This exposes fresh copper for reliable IMC formation. The OSP process supports both관통 구멍 (tht) 그리고surface-mount (SMT) 납땜.
비용 효율적
OSP uses no precious metals (금, 은, 보장). Material and processing costs are lower than ENIG, 침수은, or immersion tin. For high-volume production like consumer electronics, OSP offers exceptional cost competitiveness.
Environmentally Compliant
OSP uses organic compounds. It contains no lead, 수은, cadmium, or hexavalent chromium. It fully meetsRoHS 규제 2.0 요구 사항. Waste treatment costs and complexity are also lower than metal finishing processes.
Short Processing Time
OSP coating is simple and fast. It needs no complex plating equipment or long deposition times. Compared to ENIG (which takes hours), OSP completes surface finishing in30–60 minutes 배치당. This significantly reduces lead times.
Design Guidelines and Important Considerations
제조 설계 (DFM) Rules
Based on this product’s process capabilities:
| Design Parameter | Product Capability | Recommended Design Value |
|---|---|---|
| 최소 트레이스 너비 | 0.15mm | ≥0.15mm (신호 추적) |
| Minimum Spacing | 0.20mm | ≥0.20mm |
| 최소 구멍 크기 | 0.45mm | ≥0.45mm |
| 보드 두께 | 1.6mm | 1.6mm (기준) |
OSP Process Limitations and Mitigations
OSP offers many benefits but has inherent limitations:
- Limited Shelf Life – OSP film protects for6 달 in ambient conditions. For best solderability, complete SMT assembly within 3 달.
- Moisture Sensitivity – OSP films degrade in high-temperature, 습도가 높은 환경. Store boards at20–25°C with 40–60% relative humidity.
- Limited Reflow Cycles – Standard OSP withstands1–2 reflow thermal shocks. Multiple reflows require high-temperature OSP (IPC-4555 compliant).
- Electrical Test Challenges – The OSP film is insulating. It affects electrical test contact reliability. Test points need solder paste printing to remove the OSP layer.
Storage and Handling Recommendations
- Vacuum-sealed packaging with desiccant and humidity indicator cards
- 스토리지 환경: temperature ≤30°C, relative humidity ≤60%
- Complete soldering within48 시간 of opening the package
- Wear anti-static gloves during handling. Avoid bare hand contact with board surfaces.
일반적인 응용 프로그램 시나리오
OSP antioxidant PCB circuit boards serve many industries due to theircost advantage, surface flatness, and excellent solderability:
가전제품
- Smartphone motherboards and tablet PCBs
- Computer motherboards and graphics cards
- Home appliance control boards
- Wearable device circuit boards
통신 장비
- Router and switch PCBs
- Communication modules and IoT devices
- 블루투스 / Wi-Fi module carrier boards
산업 제어
- PLC programmable logic controllers
- Power management modules
- Instrumentation circuit boards
- Motor drive control boards
자동차 전자 (Non-Safety-Critical)
- In-vehicle infotainment systems
- 차체 제어 모듈
- Sensor interface boards
Quality Assurance and Standards Compliance
Applicable Standards
UGPCB’s OSP antioxidant PCB product strictly follows these international standards:
| 기준 | Title | 범위 |
|---|---|---|
| IPC-4555 | Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards | OSP process requirements and testing |
| IPC-6012E | 경질 인쇄 기판의 자격 및 성능 사양 | Finished board quality and performance |
| IPC-4101/21 | Specification for Glass-Reinforced Epoxy Laminate | FR-4 substrate technical requirements |
| IPC-TM-650 | Test Methods Manual | Various performance test methods |
| UL 94 다섯-0 | Flammability of Plastic Materials | Substrate flame retardant safety |
| RoHS 규제 2.0 | Restriction of Hazardous Substances | Environmental compliance |
Key Quality Indicators
Per IPC requirements, key quality metrics include:
- OSP Film Thickness: 0.2–0.5μm, uniformity tolerance ≤ ±0.1μm
- Adhesion: ≥4B (IPC-TM-650 2.4.29 cross-cut test)
- Solder Spread Ratio: ≥80% (IPC-TM-650 2.4.1)
- Oxidation Protection Period: ≥6 months (ambient conditions)
- 가연성 등급: UL 94 다섯-0
Why Choose UGPCB for OSP Antioxidant PCBs?
정밀 제조 기능
- 0.15mm minimum trace width / 0.20mm minimum spacing
- 0.45mm minimum finished hole size
- 1.6mm standard board thickness with excellent compatibility
Reliable OSP Process Control
- Strict adherence to IPC-4555 for film thickness and quality
- Full traceability throughout the manufacturing process
- Solderability testing and film thickness sampling for every batch
빠른 배송
- Standard lead time: 7–10 working days
- Supports both prototype sampling and volume production
Comprehensive Technical Support
- Free DFM design review
- Professional engineering team for product selection guidance
Get a Quote Today
UGPCB delivers high-value OSP antioxidant PCB circuit board solutions. 당신이 필요 여부prototype sampling 또는volume production, we provide professional technical support and competitive pricing.
📞 How to Get a Quote:
- Submit your Gerber files and BOM list
- Our engineering team responds with a customized solution and quote within24 시간
- Free DFM check to ensure your design passes the first time
Data Source Statement: The technical data and standard requirements cited in this document are primarily derived from IPC (전자산업을 연결하는 협회) standards including IPC-4555 “Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards,” IPC-6012E “경질 인쇄 기판의 자격 및 성능 사양,” IPC-4101/21 “Specification for Glass-Reinforced Epoxy Laminate,” IPC-TM-650 “Test Methods Manual,” 그리고 UL 94 “Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances.” Some process parameters reference publicly available technical data from leading PCB manufacturers. All data has been verified for accuracy.
