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Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4TG150, 1.6milímetros, HASL sem chumbo - UGPCB

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Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4TG150, 1.6milímetros, HASL sem chumbo

Contagem de camadas: 2 Camadas PCB Rígidas

Espessura da placa: 1.60milímetros

Material: FR-4TG150

Acabamento superficial: Nivelamento de solda por ar quente sem chumbo (Sangrar), Máscara de solda branca, Lenda Negra

  • Detalhes do produto

Introdução

UGPCB‘s 2-Layer Rigid PCB is a fundamental, alta confiabilidade placa de circuito solution engineered for demanding applications. Built on a robust Substrato FR-4 TG150 with a standard 1.60mm thickness, it delivers an optimal balance of performance, durabilidade, and cost-effectiveness. The board features a reliable lead-free Hot Air Solder Leveling (Sangrar) acabamento superficial, a protective black solder mask, and clear white silkscreen legends for identification.

UGPCB‘s 2-Layer Rigid PCB

Visão geral do produto & Classificação

This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a PCB rígido (by construction), um 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (Classe IPC 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.

Projeto & Princípio Operacional

Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (por exemplo, 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: o FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, o solder mask is a protective coating, and the silkscreen provides navigation.

Construção, Materiais & Desempenho

The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:

  • Core: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.

  • Cobre: Standard 1oz (35µm) electrodeposited copper foil.

  • Acabamentos: Black LPI solder mask and white epoxy silkscreen.

  • Acabamento superficial: Lead-Free HASL for excellent solderability.

This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.

Processo de fabricação & Controle de qualidade

Our production follows Padrões IPC, encompassing CAM engineering, precision drilling, galvanoplastia, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and Inspeção óptica automatizada (AOI) to meet stringent quality criteria.

Aplicações

This versatile PCB is ideal for:

  • Sistemas de Controle Industrial: CLPs, acionamentos de motor, sensor interfaces.

  • Eletrônica de Potência: Fontes de alimentação comutadas (SMPS), UPS boards, LED drivers.

  • Automotivo & Eletrônicos de consumo: Auxiliary control modules, amplificadores de áudio, appliance controllers.

LED driver power supply is one of the primary application scenarios for 2-layer PCBs.

Key Specifications Table

Parâmetro Especificação
Camadas 2
Espessura da placa 1.60 milímetros (Padrão)
Material base FR-4, Tg ≥ 150°C
Peso de cobre 1 onças (35 µm) Padrão
Máscara de solda Preto, LPI
Serigrafia Branco
Acabamento superficial HASL sem chumbo
Min. Trace/espaçamento 0.15 milímetros (6 mil)
Standard Compliance IPC-A-600, Classe IPC 2

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