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10-layer 3+N+3 HDI PCB - UGPCB

PCB HDI/

10-layer 3+N+3 HDI PCB

Nume: 10-layer 3-stage HDI PCB

Straturi: 3+N+3

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 126*118mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.25mm

Line width and spacing: 2.8/3.2mil

  • Detalii despre produs

Technical Features and Applications of HDI PCBs

Impedance Specifications

  • 50 Ω Antenna
  • 90Oh & 100Ω Differential Impedance

Aplicații

Electronica de consum

  • Cell Phones
  • Tablets
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

Interconectare de înaltă densitate (HDI) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile Phones
  • Touch Screen Devices
  • Laptops
  • Digital Cameras
  • 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

  • Echipament medical
  • Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.

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