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F4BME-2-A Teflon PCB Glass Fabric Copper-Clad Laminates
F4BME-2-A Teflon PCB glass fabric copper-clad laminates are manufactured using imported woven glass fabric, Teflon PCB resin, and filler with a Nano-ceramic membrane. This product adheres to scientific formulations and stringent technological processes, utilizing low roughness copper foil. It surpasses the F4BM series in electrical performance and surface insulation resistance stability, boasting a higher intermodulation index than F4BME-1/2.
Technical Specifications
Aspect: Meets the specification requirements for microwave PCB laminates according to National and Military Standards.
Types:
- F4BME-2-A255
- F4BME-2-A262
- F4BME-2-A275
- F4BME-2-A285
- F4BME-2-A294
- F4BME-2-A300
Dimensiuni (mm):
- 550*440
- 500*500
- 600*500
- 650*500
- 1000*850
- 1100*1000
- 1220*1000
- 1500*1000
Custom dimensions are available upon request.
Grosime și toleranță (mm):
| Laminate Thickness | Toleranţă |
|---|---|
| 0.254 | ±0.025 |
| 0.508 | ± 0,05 |
| 0.762 | ± 0,05 |
| 0.787 | ± 0,05 |
| 1.016 | ± 0,05 |
| 1.27 | ± 0,05 |
| 1.524 | ± 0,05 |
| 2.0 | ±0.075 |
| 3.0 | ±0.09 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 9.0 | ±0.18 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Rezistență mecanică:
- Cutting/Punching:
- Grosime <1mm: No burrs after cutting; minimum space between two punching holes is 0.55mm, Fără delaminare.
- Grosime >1mm: No burrs after cutting; minimum space between two punching holes is 1.10mm, Fără delaminare.
- Coajă de rezistență (1oz copper):
- Normal state: ≥14N/cm; No bubble or delamination peel strength: ≥12N/cm (under constant humidity and temperature, kept in melting solder at 265°C ±2°C for 20 secunde).
Chemical Property: The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment.
Electrical Property:
| Nume | Test Condition | Unitate | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.1～2.35 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 ore | % | ≤0.07 |
| Operating Temperature | High-low temperature chamber | ° C. | -50°C～+260°C |
| Conductivitate termică | W/m/k | 0.45~0.55 | |
| Cte (typical) | -55～288°C (εr :2.5~2.9) | PPM/° C. | X: 16, Y: 20, Z.: 170 |
| Cte (typical) | -55～288°C (εr :2.9~3.0) | PPM/° C. | X: 12 Y: 15 Z.: 90 |
| Shrinkage Factor | 2 hours in boiling water | % | <0.0002 |
| Rezistivitatea suprafeței | DC, 500V, Normal state | MΩ | ≥4*10^5 |
| Rezistivitatea volumului | Normal state | MΩ · cm | ≥6*10^6 |
| Surface dielectric strength | d=1mm(Kv/mm) | ≥1.2 | |
| Constanta dielectrică | 10GHz | See table below | |
| Factor de disipare | 10GHz | See table below | |
| PIMD (2.5GHz) | db | -160 |
UL rating de inflamabilitate: 94 V-0
For more information or to place an order, please visit our website www.ugpcb.com or contact us via email at sales@ipcb.com.
UGPCB Products:
UGPCB offers a wide range of products including:
- Radio/Microwave/Hybrid High Frequency FR4 Double/Multi-Layer 1~3+N+3 HDI, Anylayer HDI, Rigid-Flex, Blind Buried Slotted, Backdrilled IC Heavy Copper Board, și mai mult.
If you have any questions or need further assistance, please do not hesitate to contact us through our website or send an inquiry directly to sales@ugpcb.com.
