Dekodierung von PCB -Fertigungsplänen: Eine umfassende Anleitung zu Gerber -Dateischichten

Einführung: Gerber Files – The DNA of PCB Manufacturing

In Hochgeschwindigkeits-PCB-Design, Gerber files encapsulate over 90% of manufacturing data. According to IPC-2581 standards, 85% of global PCB manufacturers rely on Gerber as primary production documentation. Als die “industrial blueprint” of electronics, Gerber files precisely describe a circuit board’s physical structure through layered encoding. This guide decodes each layer’s engineering significance to help you master Leiterplattenfertigung.

Section 1: Complete Gerber File Export Workflow

1.1 Pre-Export Verification

• DRC Validation: Ensure spacing compliance with IPC-2221 standards (Min. trace/space = 0.1mm @ 6-layer Leiterplatten)

• Stackup Confirmation: Impedance control must satisfy:

  

  Wo H = dielectric thickness, W = trace width, T = copper thickness (1 oz = 35µm).

1.2 Export Mode Comparison

Section 2: Gerber Layer Structure Deep Dive

2.1 Conductive Layers Explained

Copper Layers:

• Top/Bottom Layer: Surface routing (Typ. 1 oz copper)

• Innere Schichten: 6-layer PCB stackup: Top-GND-Signal-Power-Signal-Bottom

Drill Layers:

2.2 Process-Supporting Layers

Lötmaskenschicht:

• Negative image output (Exposes copper openings)

• Min. Freigabe: 0.07mm (Prevents solder mask bridging failure)

Paste Mask Layer:

• Stencil aperture = Pad size × 90%

• QFN packages require cross-bridge anti-solder bead design

Seidenschicht:

• Text height ≥0.8mm, line width ≥0.15mm

• Bottom layer silkscreen requires mirroring

Section 3: Gerber Features in Multilayer PCBs

3.1 Layer Count vs. Gerber Files

3.2 Advanced Process Implementation

VIPPO (Via-in-Pad):

• Hole diameter ≤0.15mm, pad size ≥0.3mm

• Label as “μVia” in drill layers

Stepped Slot Design:

• MechanicalLayer annotation:
  SLOT:3.0x1.2mm @ Layer2-4

Section 4: DFM Rules Driven by Gerber Data

4.1 Manufacturability Checks

4.2 High-Speed Design Markers

• Differentialpaare: IMPEDANCE:100Ω±10%

• RF traces: NO_SOLDERMASK (Reduces Dk variation)

Section 5: From Layout Engineer to PCB Architect

True PCBA design experts master:

5.1 Signalintegrität (UND)

• Delay control: ΔL ≤ 0.05√ε_r (ps/inch)

• Crosstalk prevention: 3W rule (Spacing ≥ 3×trace width)

5.2 Power Integrity (PI)

• Target Impedanz:

  

• Decoupling capacitor layout: Radial placement by capacitance

5.3 Thermalmanagement

• Copper current capacity:
  I=0.048⋅ΔT0.44⋅A0.725
  (ΔT = temperature rise, A = cross-section)

Abschluss: The Engineering Philosophy of Gerber Files

When exporting Gerber data, remember: These “cold” layers represent precision dialogues between electronics and materials science. From 0.05mm laser drills to 10μm solder mask tolerances, each Gerber layer narrates the engineering philosophy of signal isolation and conductive pathways.

Industry data reveals: Using Gerber+ODB++ dual-file delivery increases first-pass yield by 40%. In the 5G/AI era, mastering Gerber semantics means controlling the core of intelligent hardware manufacturing.