12-Layer-Hochgeschwindigkeits-Leiterplatte mit hoher Zuverlässigkeit | 2.4mm dick | Nanya NY6300S | Rückenbohrungen & RTF-Folie

Professional Product Overview: The 12-Layer High-Speed, High-Density PCB

In the era of high-speed data transmission and complex system integration, conventional printed circuit boards (Leiterplatten) fall short of meeting the performance demands of advanced electronics. Der 12-layer high-speed, high-density PCB is the engineered solution. Featuring up to 12 precisely aligned conductive layers, it enables intricate interconnections and efficient signal transmission within a compact footprint, serving as the “central nervous system” for high-end networking gear, data center servers, Hochleistungsrechnen (HPC), and AI hardware.

As an expert Leiterplattenhersteller Und PCB supplier, UGPCB leverages advanced processes to deliver reliable 12-Schicht Leiterplatte Produktion, ensuring your products maintain a competitive performance edge.

In-Depth Parameter Analysis: The Foundation of Performance

The capability of a high-quality Multilayer Printed Circuit Board is defined by its specifications. Below is an analysis of this product’s core parameters:

• Schichtzahl & Stack-up: 12 Schichten. Das multilayer PCB design offers superior signal integrity (UND), Machtintegrität (PI), and EMC performance compared to boards with fewer layers. It allows for dedicated power and ground planes, providing clear return paths for high-speed signals.

• Brettdicke & Toleranz: 2.4mm ±10%. This robust thickness offers excellent mechanical strength for backplanes and large-form-factor applications, ensuring reliability during mating and installation. The tight tolerance guarantees consistency in assembly.

• Finished Copper Weight: Unique distribution: 1/1/1/1/1/2/2/1/1/1/1/1 oz. This indicates that the inner layers (L6 & L7) utilize 2oz heavy copper, designed specifically for high-current power delivery. The outer and other signal layers use 1oz copper, optimized for fine-line etching. This hybrid construction is a hallmark of Hochzuverlässige Leiterplattenfertigung.

• Critical Process Capabilities:

  • Minimum Drilled Hole Size: 0.2mm. Supports high-density BGA fan-out, enhancing routing flexibility.

  • Minimum Line Width/Space: 0.076mm / 0.09mm (3Mil / 3.5Mil). Erreicht Hochdichte Interconnect (HDI)-level routing, essential for high-speed signal propagation.

• Oberflächenbeschaffung: OSP (Bio -Lötlichkeitsschutz). Compatible with both leaded and lead-free soldering, it protects copper pads from oxidation, offers excellent surface planarity, and is cost-effective—ideal for boards with dense SMT Komponenten.

Kernmaterialien & Key Technologies: Enabling Superior Signal Integrity

1. High-Performance Laminate: Utilizes Nanya NY6300S high-speed laminate. Its high glass transition temperature (Tg >150°C) ensures dimensional stability and reliability during high-temperature reflow soldering. Its optimized dielectric constant (Dk) and dissipation factor (Df) significantly reduce signal loss at high frequencies, forming the material foundation for Hochfrequenz-Leiterplatten.

2. Advanced Copper Foil: Employs RTF (Reverse Treated Foil) Kupfer. Compared to standard electrodeposited (Ed) foil, RTF foil features a smoother, low-profile surface on the treated side. This reduces signal loss due to the “skin effect” at high frequencies, critically enhancing the performance of differential signals exceeding 10 Gbps.

3. Critical Process: Controlled-Depth Drilling (Rückenbohrungen): In 12-layer or higher Mehrschichtige PCBs, the unused portion (stub) of a through-hole via can cause significant signal reflection, degrading integrity. Der back drilling process precisely removes this non-functional via stub, eliminating its negative impact—a key technology for high-speed multilayer PCB Leistung.

Production Flow & Qualitätssicherung

UGPCB 12-Layer -PCB -Herstellungsprozess strictly adheres to IPC -Standards and includes Design für die Herstellung (DFM) Rezension, inner layer imaging, Laminierung, Bohren (including back drilling), Überzug, outer layer imaging, solder mask application, Oberflächenbeschaffung (OSP), Routenführung, electrical testing, und Endinspektion. Each stage is supported by precision measurement equipment (AOI, Impedance Testing, Flying Probe Test), Gewährleistung aller Leiterplatte delivered meets design specifications and our high-quality standards.

Typische Anwendungen & Product Classification

This high-performance Leiterplatte is designed for demanding electrical environments and complex systems, primarily used in:

• High-End Network & Kommunikationsausrüstung: Core motherboards for 400G/800G optical modules, high-end routers, and switches.

• Data Center & Cloud Computing: Server motherboards, accelerator cards, storage backplanes.

• Hochleistungs-Computing: Workstation motherboards, GPU computing cards, AI accelerator hardware.

• Advanced Test & Measurement Instruments: Internal boards for instruments processing very high-frequency signals.

Scientific Product Classification:

• Für Schichtzahl: Mehrschichtige Leiterplatte (>8 Schichten)

• By Technology Type: High-Speed/High-Frequency PCB, HDI PCB, Schwere Kupferplatine (partial)

• Durch Anwendung: Telecom Infrastructure PCB, Data Center/Server PCB

Why Choose UGPCB for Your 12-Layer High-Speed PCB?

• Technisches Know -how: Proven mastery of back drilling Und RTF copper foil application to tackle high-speed design challenges.

• Precision Manufacturing: Capable of 3/3.5 mil line/space, meeting stringent high-density interconnect requirements.

• Material Integrity: Core use of reputable high-speed laminates like Nanya NY6300S ensures foundational performance.

• Entwurfsunterstützung: Expert PCB-Design Und DFM review services to de-risk your project from the start.

• Consistent Quality: A fully controlled Leiterplattenfertigung and inspection system delivers reliable products you can trust.

Ready to elevate your hardware? Contact UGPCB’s engineers for a free PCB quote Und DFM -Analyse on your next 12-layer high-speed board project.