High-Reliability 8-Layer Heavy Copper PCB | 2.0mm Thick FR-4 TG170

High-Reliability 8-Layer Rigid PCB Produktübersicht & Definition

In the realm of high-speed, high-density electronic design, Mehrschichtige PCBs (Leiterplatten) are indispensable. UGPCB 8-layer rigid PCB, built with a substantial 2.0mm board thickness Und 3OZ heavy copper foil, is engineered to withstand demanding electrical and physical environments. It serves not only as the foundation for electrical connectivity but as a critical component ensuring device stability and enhanced product reliability. For applications in industrial controls, power systems, oder Automobilelektronik, this high-specification board is the optimal solution for complex, high-performance designs.

Kernspezifikationen

• Schichtzahl: 8-Layer Rigid PCB

• Finished Board Thickness: 2.0mm ±10%

• Grundmaterial: FR-4, Glasübergangstemperatur (Tg) ≥ 170°C

• Oberflächenbeschaffung: Lead-Free Hot Air Solder Leveling (HASL-LF)

• Kupfergewicht: 3 Unzen pro Quadratfuß (≈105μm) for both inner and outer layers

• Lötmaske & Siebdruck: Green LPI Solder Mask, White Silkscreen Legend

Überlegungen zum kritischen Design

When designing with this high-specification PCB, engineers must prioritize:

1. Thermalmanagement: Leverage the high current-carrying capacity of 3OZ heavy copper to optimize power and ground planes, reducing impedance and heat rise. Use thermal simulation in conjunction with the high heat resistance of FR-4 TG170 material.

2. Impedanzkontrolle & Signalintegrität: The 8-layer stack-up allows effective separation of signal, Leistung, and ground layers. Precise calculation and control of trace impedance (z.B., 50Ω single-ended, 100Ω differential) is essential to minimize reflection and crosstalk.

3. Mechanisch & Electrical Reliability: Der 2.0mm thick board enhances overall rigidity, suitable for applications with vibration or insertion stress. For high-voltage or high-current nodes, adjust trace width and clearance according to IPC-2221 standards and the 3OZ copper weight to ensure safety margins.

4. DFM (Design für die Herstellung): Collaborate with UGPCB’s engineering team early to address specific requirements for heavy copper PCB Und thick board PCB Verarbeitung, such as drilling parameters and plating uniformity, ensuring a high-yield manufacturing process.

Wie es funktioniert & Struktur

An 8-Schichtplatine is fabricated by laminating multiple conductive layers into a single unit using precise processes including inner-layer imaging, Laminierung, Bohren, and plating. Electrical connections between layers are established via plated through-holes (PTHS), blind vias, or buried vias. A typical stack-up example is:

Oberschicht (Signal) — Prepreg — L2 (Boden) — Core — L3 (Signal) — Core — L4 (Leistung) — Core — L5 (Signal) — Prepreg — Bottom Layer (Signal)

Das “Sandwich” structure effectively isolates high-speed signals, provides solid reference planes, and ensures efficient power distribution.

Leistung & Schlüsselmerkmale

1. Superior Electrical Performance: 3OZ heavy copper provides extremely low conductor resistance and excellent current-carrying capacity (over 3x that of standard 1OZ copper), reducing power loss and voltage drop.

2. Exceptional Thermal Reliability: FR-4 TG170 high Tg material withstands higher operating and soldering temperatures. Combined with the thermal conductivity of heavy copper, it significantly improves long-term reliability in high-temperature environments.

3. Enhanced Mechanical Stability: Der 2.0mm thick board combined with rigid FR-4 offers superior resistance to bending and vibration, ideal for harsh operating conditions.

4. High Solder Joint Reliability: Der HASL-LF surface finish bietet eine Wohnung, coplanar pad surface with excellent solderability and extended shelf life, compliant with RoHS directives.

5. Hochdichte Interconnect (HDI) Capability: The 8-layer design offers ample routing space for complex circuits, facilitating device miniaturization and functional integration.

Überblick über den Produktionsprozess

Engineering Review → Material Cutting (FR-4 TG170) → Inner Layer Imaging & Radierung (3OZ) → Oxide Treatment & Lamination → Mechanical Drilling & Copper Plating → Outer Layer Patterning & Überzug (to 3OZ) → Solder Mask Application (Green LPI) & Siebdruck (Weiß) → Lead-Free HASL Surface Finish → Electrical Testing & Endinspektion (per IPC standards)

Each stage incorporates stringent quality control checkpoints to ensure every high-reliability multilayer PCB meets exact customer specifications.

Primäranwendungen & Anwendungsfälle

This PCB is designed for high-power, high-stability applications:

• Industrial Control Systems: PLCs, motor drives, and industrial power supplies requiring heavy copper PCBs for high current.

• Erneuerbare Energie & Power Systems: Solar inverters, UPS systems, and EV charging modules relying on high current capacity and thermal endurance.

• Kfz -Elektronik: On-Board Chargers (OBC), Battery Management Systems (BMS), and DC-DC converters, Wo high Tg PCBs are essential for under-hood temperatures.

• Telecommunications Infrastructure: Base station power amplifier units and network backup power systems.

• High-End Test & Messgeräte: Instruments requiring stable power delivery and low-noise performance.

Product Classification (Per IPC Standards)

1. Für Schichtzahl: Mehrschichtige Leiterplatte (>4 Schichten), specifically an 8-layer circuit board.

2. By Rigidity: Starre PCB.

3. Nach Basismaterial: FR-4 PCB, subset: High TG PCB (Tg ≥ 170°C).

4. By Special Process: Schwere Kupferplatine (per IPC-2152), Thick Board PCB.

5. By Application Class: Geeignet für IPC-Klasse 2 (Dedicated Service Electronic Products) Und Klasse 3 (High-Reliability Electronic Products) Anwendungen, einschließlich Industrial Grade PCB, Power Electronics PCB, Und Automotive Grade PCB.