UGPCB

22-Hersteller von Layer-Server-PCBs | Schwere Kupferplatine mit kontrollierter Tiefenbohrung | UGPCB-Expertenlösungen

Ultimin

Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, künstliche Intelligenz, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server Leiterplatten (Leiterplatten) is paramount. Leveraging deep technical expertise, UGPCB bietet professionelle, angepasst, high-performance server PCB manufacturing and Leiterplatte (Montage von Leiterplatten) one-stop solutions.

1. Produktübersicht & Definition

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, Erinnerung, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, Machtintegrität, and thermal performance.

The specifications you provide (Brettdicke: 2.8mm ±10%, 22 Schichten, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, hohe dichte, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

High-layer-count server PCB manufactured by UGPCB, installed inside a high-performance data center server

2. Design-Grundlagen & Key Technologies

The success of such advanced PCB -Designs hinges on mastering a range of cutting-edge technologies:

  1. Stack-up & Impedanzkontrolle: The complex 22-layer stack-up requires precise calculation to achieve strict Impedanzkontrolle (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of Hochgeschwindigkeits-PCB-Design.

  2. Rückenbohrungen: This critical process removes the unused copper stub from high-speed signal vias (z.B., for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

  3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (Df) and stable dielectric constant (Dk) ensure signal purity and low latency. A high Glass Transition Temperature (Tg >170°C) guarantees material reliability under the prolonged high-temperature operation of servers.

  4. RTF (Reverse Treated Foil) Kupfer: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

  5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (z.B., high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. Leistung & Strukturelle Merkmale

4. Produktionsprozess & Qualitätskontrolle

UGPCB’s server Leiterplattenfertigung folgt einer stringenten, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (ZUSTIMMEN) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, AOI (Automatisierte optische Inspektion), und mehr, ensuring every delivered PCB meets design specifications.

5. Anwendungsszenarien & Technical Classification

This high-performance server PCB is widely used in:

Scientific Classification:

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