22 Layer-Hochleistungs-Megtron-6-Leiterplatte | 2.0mm dick mit ENIG-Finish | Hohe Geschwindigkeit & RF-Lösung – UGPCB

In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (Leiterplatte) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, low loss, and complex interconnectivity.

1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB Produktübersicht & Definition

This product is a 22-layer High-Density Interconnect (HDI) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, hohe Geschwindigkeit, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.

2. Überlegungen zum kritischen Design

Designing such an advanced mehrschichtige Leiterplatte requires focus on:

1. Impedanzkontrolle: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.

2. Stapeloptimierung: The intelligent arrangement of the 22 conductive layers (22Schichten)—including signal, Leistung, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.

3. Thermalmanagement: The 2.0mm board thickness and multilayer structure aid heat distribution. Jedoch, strategic use of thermal vias remains essential for high-power IC areas.

4. High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.

3. Wie es funktioniert & Struktur

A PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. Das 22-Layer -PCB -Platine structure resembles a precise “multi-layer sandwich”:

• Innere Schichten: Use H/HOZ (etwa 1/1 oz or 35µm) copper for core power, ground planes, and some internal signal routing.

• Außenschichten: Verwenden 1/1 oz copper for mounting primary components and routing critical signal traces.

• Dielectric Layers: All insulating prepreg materials are Panasonic Megtron-6 R-5775G, whose low Dielectric Constant (Dk) und Dissipationsfaktor (Df) ensure superior high-speed signal transmission.

• Oberflächenbeschaffung: Elektrololes Nickel -Eintauchgold (ZUSTIMMEN) bei 2 Mikrozoll (2u”). This provides a flat, solderable surface, excellent oxidation resistance, and good wire-bonding capability, ideal for high-density BGA packages and RF connectors.

4. Kernmaterial: Panasonic Megtron-6 R-5775G

This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, hohe Geschwindigkeit, low-loss circuit board material series.

• Key Performance: Features an extremely low Dielectric Constant (Dk~3.5) and ultra-low Dissipation Factor (Df~0.0015 @ 10GHz), significantly outperforming standard FR-4. Its high Glass Transition Temperature (Tg) ensures superior thermal stability and dimensional consistency during high-temperature reflow soldering processes.

• Application Fit: Optimized for high-speed digital signals (10Gbps+ to 56/112Gbps) and millimeter-wave RF applications.

Artikel		Testmethode	Zustand	Einheit	Megtron6 R-5775(N) Low DK Glass Tuch	Megtron6 R-5775 Normales Glas Tuch
Glasübergangstemperatur.(Tg)		DSC	A	°C	185	185
Wärmezersetzungstemp.(Td)		TGA	A	°C	410	410
CTE x-Achse	A1	IPC-TM-650 2.4.24	A	ppm/° C.	14-16	14-16
Cte y-Achse					14-16	14-16
CTE Z-Achse	A1	IPC-TM-650 2.4.24	A		45	45
	A2				260	260
T288(mit Kupfer)		IPC-TM-650 2.4.24.1	A	min	>120	>120
Dielektrizitätskonstante(Dk)	12GHz	Ausgeglichener Typ Rundscheibe Resonator	C-24/23/50	－	3.4	3.6
Dissipationsfaktor(Df)					0.004	0.004
Wasseraufnahme		IPC-TM-650 2.6.2.1	D-24/23	%	0.14	0.14
Biegermodul	Füllen	Jis c 6481	A	GPA	18	19
Schälfestigkeit*	1oz(35μm)	IPC-TM-650 2.4.8	A	kN/m	0.8	0.8

5. Schlüsselmerkmale & Leistung

1. Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.

2. Excellent Thermal & Dimensionsstabilität: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.

3. High-Density Interconnect Capability: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (z.B., FPGAs, GPUs).

4. Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the mehrschichtige Leiterplatte.

5. Superior Solderability & Bindung: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.

6. Wissenschaftliche Klassifikation & Primäranwendungen

• Wissenschaftliche Klassifikation:

  • Für Schichtzahl: High Multilayer PCB (Typischerweise >10 Schichten).

  • Durch Material: Hochgeschwindigkeits-PCB / Hochfrequenz-PCB / Low-Loss PCB.

  • Nach Technologie: HDI PCB (Subject to specific design features like blind/buried vias).

  • By Rigidity: Starre PCB.

• Primäranwendungen & Anwendungsfälle:

  • High-Speed Networking Equipment: Core backplanes and motherboards for 400G/800G optical modules, high-end routers, and switches.

  • Advanced Computing & Lagerung: AI server boards, Hochleistungs-Computing (HPC) clusters, enterprise SSD controller boards.

  • Luft- und Raumfahrt & Radarsysteme: RF front-ends and signal processing units for avionics communication and phased array radar systems.

  • Advanced Test & Measurement Instruments: Mainboards within high-speed oscilloscopes, spectrum analyzers, and signal generators.

7. Production Flow Overview

UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-Schichtausrichtung & Bindung) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)

Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.

Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.

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