4-Layer Rigid-Flex PCB Manufacturer – Tg alta, 1.6mm de espesor, ENIG+Gold Plating | UGPCB

1.UGPCB 4-Layer High Tg Rigid-Flex PCB Descripción general del producto: Redefining High-Reliability Interconnectivity

In modern high-end electronic design, traditional rigid Placas de circuito impreso (PCB) are often limited by space and form factor, while Flexible PCBs (FPCS) may lack mechanical support. PCB rígido-flexible tecnología, an innovative fabricación de PCB solution, perfectly merges the stability of rigid boards with the bendability of flexible circuits. UGPCB 4-Layer High Tg Rigid-Flex PCB, with its precise lamination structure, superior material selection, and demanding surface finish, stands as the ideal PCB solution for complex 3D spatial layouts and harsh operating environments.

2. Scientific Classification & Core Parameters

• Scientific Classification: Por Normas IPC and industry norms, this product is accurately classified as a 4-Layer High Thermal Reliability Rigid-Flex Printed Circuit Board.

• Core Parameters:

  • Layer Construction: 4 capas (4L PCB rígido-flexible)

  • Grosor del tablero: 1.60milímetros (in rigid areas, including dielectrics and copper)

  • Materia prima: Panasonic RF-777 (35/50µm copper)

  • Acabado superficial: ACEPTAR (Oro de inmersión de níquel químico) 3µ” + Selective Electroplated Hard Gold 30µ”

  • Dimensiones: 126milímetros * 80milímetros

3. Design Essentials & Structure Analysis

Successful Rigid-Flex PCB design es crítico. This product is designed adhering to these key points:

1. Rigid-to-Flex Transition Zone Design: Bend areas are meticulously simulated, avoiding right and acute angles. Smooth curved traces are implemented to eliminate stress concentration points, a cornerstone of high-reliability PCB design.

2. Stack-up Symmetry: Rigid sections employ a symmetrical lamination stack-up (p.ej., copper-dielectric-core-dielectric-copper) to prevent warping under thermal stress.

3. Compatibilidad de material: The selected Panasonic RF-777 material has matched Coefficients of Thermal Expansion (CTE) in both rigid and flexible zones, ensuring robust bonding at the interfaces.

Structural Feature: The board is constructed by laminating two rigid outer sections with a multilayer structure containing flexible inner layers, enabling electrical interconnection in three-dimensional space.

Image Suggestion 2: A detailed cross-sectional diagram of the board’s layer stack-up, clearly labeling rigid areas, flex areas, materiales, and thicknesses.
Alt Tag: Cross-section diagram of a 4-Layer Rigid-Flex PCB stack-up, showing the integration of rigid FR-4 and flexible polyimide materials.

4. Materiales & Actuación

• Material central: Panasonic RF-777. This is a high-performance laminate specifically optimized for Rigid-Flex PCB fabrication.

  • High Glass Transition Temperature (tg): Provides excellent thermal stability, maintaining mechanical and electrical properties during high-temperature soldering (p.ej., lead-free reflow) and in high-temperature operating environments.

  • Low Dk (Constante dieléctrica) & df (Factor de disipación): Ensures signal integrity for PCB de alta frecuencia aplicaciones.

  • Superior Dimensional Stability & Chemical Resistance: Guarantees long-term reliability.

• Acabado superficial: ENIG 3µ” + Electroplated Hard Gold 30µ”. This combination is a key differentiator.

  • ACEPTAR: Provides a flat, highly solderable surface finish across the entire board, suitable for fine-pitch component assembly.

  • Electroplated Hard Gold: Applied selectively to connector fingers or areas subject to frequent insertion/withdrawal or friction, the 30µ” hard gold layer dramatically increases wear resistance, oxidation resistance, y confiabilidad de contacto, extending connector lifecycle.

5. Manufacturing Process Flow

UGPCB employs industry-leading PCB production processes to ensure quality:

1. Laser & Mechanical Drilling: High-precision drilling for varying hole size requirements.

2. Hole Metallization & Enchapado: Ensures interlayer connectivity.

3. Patterning & Aguafuerte: Forms precise circuit patterns.

4. Laminación & Pressing: Precisely bonds rigid and flexible layers into a single unit under high heat and pressure—the technical core of rigid-flex circuit board processing.

5. Acabado de superficies: Sequential application of ENIG and selective hard gold plating.

6. Contour Routing & Pruebas: Final outline achieved via CNC and laser routing, followed by AOI (Inspección óptica automatizada), electrical testing, and flex-cycle reliability testing.

Image Suggestion 3: An image of a modern PCB production line, focusing on a lamination press or AOI inspection station.
Alt Tag: UGPCB’s modern Rigid-Flex PCB production line featuring high-precision lamination and inspection equipment for quality assurance.

6. Ventajas clave & Características del producto

• 3D Design Freedom: Solves complex spatial layout challenges, reduces connectors and cabling, and enhances system reliability.

• Exceptional Mechanical & Rendimiento eléctrico: High-strength flex joints withstand thousands of dynamic bend cycles; shortened signal paths reduce loss.

• High Reliability Assurance: High Tg material and dual surface finish ensure stable long-term operation in harsh environments (high temperature, humedad, vibración).

• Peso & Size Reduction: Contributes to overall device miniaturization and lightweight design.

7. Aplicaciones típicas

Este 4-Layer Rigid-Flex PCB is the preferred PCB component for demanding sectors:

• Industrial & Electrónica automotriz: Vibration-resistant connections in control systems, automotive sensors, and Engine Control Units (CUBRIR).

• Dispositivos médicos: Endoscopes, portable monitors, hearing aids—devices requiring precise, confiable, and bendable interconnects.

• Aeroespacial & Defense: Avionics and military electronics where weight, espacio, and reliability are paramount.

• High-End Consumer Electronics: Camera module connections in smartphones, hinge connections in wearables, advanced digital cameras.

8. Por qué elegir UGPCB?

As a professional fabricante de PCB, UGPCB specializes in PCB rígido-flexible tecnología, offering full-spectrum capabilities from PCB design support and precision fabricación de PCB to rigorous PCB testing. We commit to:

• Expert Engineering Support: Free PCB design for manufacturing consultation for your project.

• Consistent, Reliable Quality: Every board undergoes stringent reliability testing.

• Fijación de precios competitivos & Lead Times: Optimized supply chain and production management deliver high-value PCB solutions.

Contact UGPCB today for a free prototype evaluation and quote. Let our professional fabricación de PCB services power your innovative product to market success.