22-Fabricante de PCB de nivel de servidor de capa | PCB de cobre pesado con perforación de profundidad controlada | Soluciones expertas de UGPCB

Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, inteligencia artificial, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server Placas de circuito impreso (PCB) is paramount. Leveraging deep technical expertise, UGPCB provides professional, customized, high-performance server PCB manufacturing and tarjeta de circuito impreso (Conjunto de placa de circuito impreso) one-stop solutions.

1. Descripción general del producto & Definición

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, memoria, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, integridad del poder, and thermal performance.

The specifications you provide (Grosor del tablero: 2.8mm ±10%, 22 capas, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, alta densidad, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

2. Design Essentials & Key Technologies

The success of such advanced Diseños de PCB hinges on mastering a range of cutting-edge technologies:

1. Stack-up & Control de impedancia: The complex 22-layer stack-up requires precise calculation to achieve strict control de impedancia (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of Diseño de PCB de alta velocidad.

2. Perforación trasera: This critical process removes the unused copper stub from high-speed signal vias (p.ej., for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (df) and stable dielectric constant (Dk) ensure signal purity and low latency. A high Glass Transition Temperature (tg >170°C) guarantees material reliability under the prolonged high-temperature operation of servers.

4. RTF (Reverse Treated Foil) Cobre: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (p.ej., high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. Actuación & Características estructurales

• Exceptional Electrical Performance: Extremely low signal loss and excellent impedance consistency meet the demands of high-speed protocols like PCIe 4.0/5.0 and DDR4/DDR5.

• Ultra-High Reliability: ACEPTAR (Oro de inmersión de níquel químico) surface finish provides a flat soldering surface and superior oxidation resistance, ensuring long-term connection reliability. The 10oz thick inner copper cores (combined with the 2/1oz design) offer robust current-carrying capacity and thermal pathways for power layers.

• Precision Manufacturing Capability: El 0.1/0.1 mm trace/space and a minimum finished hole diameter of 0.25mm demonstrate UGPCB’s top-tier expertise in high-precision fabricación de PCB.

• Robust Thermal Management: The 2.8mm thick board structure, combined with thick copper design, provides excellent thermal dissipation, aiding overall system cooling.

4. Proceso de producción & Control de calidad

UGPCB’s server producción de PCB follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (ACEPTAR) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, AOI (Inspección óptica automatizada), y más, ensuring every delivered PCB meets design specifications.

5. Escenarios de aplicación & Technical Classification

This high-performance server PCB is widely used in:

• Servidores AI & GPU Accelerator Cards: For processing massive parallel computing tasks.

• Cloud Computing Data Center Servers: As core compute nodes.

• High-End Storage Servers: For high-speed data storage and exchange.

• Network Switching Equipment: Core routing and switching motherboards.

Scientific Classification:

• By Layer Count: High Multi-layer Board (22 capas)

• By Technology: High-Speed/High-Frequency PCB, Back-Drilled PCB, PCB de cobre pesado, Interconexión de alta densidad (IDH) tarjeta de circuito impreso

• Por aplicación: Data Center/Server-Dedicated PCB