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Introduction to the Anylayer HDI 10Layers PCB Board
The Anylayer HDI 10Layers PCB board is a sophisticated high-density interconnect (IDH) circuit imprimé (PCB) designed for advanced communication products. This guide will cover its definition, exigences de conception, principes de travail, applications, classification, matériels, performance, structure, caractéristiques, processus de production, and typical use cases.
Exigences de définition et de conception
Modèle: Anylayer HDI 10Layers PCB Board
This model refers to a ten-layer PCB featuring anylayer IDH technologie, allowing for complex internal layer connections.
Matériel: IT180A
Le matériau de base used is IT180A, known for its excellent thermal stability, résistance mécanique, and flame resistance.
Layer Composition: 10 Layers Anylayer
This indicates a ten-layer structure with flexible internal layer connectivity, optimizing signal integrity and power distribution.
Épaisseur finie: 1.6mm
The total thickness of the finished PCB is 1.6 millimètres, ensuring durability while maintaining flexibility for various applications.
Épaisseur du cuivre: Inner 1OZ, Outer 0.5OZ
The copper traces on inner layers have a thickness of 1 ounce (once), whereas the outer layers feature a thinner 0.5 cuivre oz, balancing conductivity and space efficiency.
Working Principle and Purpose
Traitement de surface: Immersion Or + OSP
To enhance solderability and protect against oxidation, the PCB undergoes immersion gold plating on critical areas and organic solderability preservatives (OSP) on others.
Trace / espace minimum: 2.5mille / 2,5mil
The PCB supports fine pitch components with a minimum trace width and spacing of 2.5 milles (thousandths of an inch), facilitating compact designs without compromising performance.
Diamètre minimum du trou: Mechanical Hole 0.2mm, Trou laser 0,1 mm
It accommodates small components through mechanical drilling down to 0.2mm and even finer laser-drilled holes at 0.1mm, enabling high-density integration.
Application: Communication Products PCB
Primarily tailored for communication products, this PCB ensures reliable signal transmission and minimal interference, crucial for maintaining clear and consistent data flow in telecommunication devices.
Classification et matériaux
Classification: Interconnexion à haute densité (IDH) PCB
En tant que PCB HDI, it belongs to a category of boards specifically engineered for complex electronic devices that require intricate routing and component placement.
Matériel: IT180A
IT180A is a composite material widely used in Fabrication de PCB due to its balance of electrical properties, thermal resistance, et la rentabilité.
Performance and Structure
Performance: Superior Signal Integrity
With its carefully designed layer stack and use of high-quality materials, the Anylayer HDI 10Layers PCB guarantees exceptional signal integrity, reducing crosstalk and electromagnetic interference (EMI).
Structure: Multi-Layer Arrangement
The structure comprises multiple layers strategically arranged to separate power planes from signal layers, minimizing noise and enhancing overall circuit performance. The inclusion of HDI technology allows for more intricate designs within a compact form factor.
Features and Production Process
Fonctionnalités spéciales: Advanced Anylayer HDI Technology
Designed with anylayer HDI technology, this PCB offers unparalleled flexibility in internal layer connectivity, enhancing design complexity and functionality.
Processus de production: Precision Manufacturing
Manufacturing begins with material selection and continues through precision drilling, placage, and laminating processes. Each step is meticulously controlled to ensure adherence to tight tolerances and high standards of quality.
Typical Use Cases and Scenarios
Cas d'utilisation typiques: Telecommunication Equipment
Commonly employed in telecommunication equipment such as routers, commutateurs, and base stations where high-speed data transmission and reliability are essential.
Scénarios d'utilisation: High-Frequency Applications
Suitable for high-frequency applications involving wireless communication modules, including those used in modern telecommunication devices.
En conclusion, the Anylayer HDI 10Layers PCB board stands out as a sophisticated solution for demanding communication product requirements, offering unparalleled density, performance, and reliability tailored to modern telecommunication needs.
