LOGO UGPCB
Characteristics of SI10U
SI10U is characterized by its low coefficient of thermal expansion (CTE) and high modulus, which can effectively reduce the warpage of packaging substrates. It also boasts excellent heat and humidity resistance, good PCB processability, and is made from halogen-free materials.
Application Areas for SI10U
The application areas for SI10U include eMMC, DRACHME, AP, Pennsylvanie, Double cm, Empreinte digitale, and RF Module.
Specifications of SI10U
| Items | Conditions | Unité | SI10U(S) |
|---|---|---|---|
| Tg | DMA | degré Celsius | 280 |
| Td | 5% wt. perte | degré Celsius | >400 |
| CTE (Axe x / y) | Avant TG | ppm / degré Celsius | 10 |
| CTE (Axe z) | A1 / A2 | ppm / degré Celsius | 25/135 |
| Constante diélectrique (1GHz) | – | – | 2.5.5.9 |
| Facteur de dissipation (1GHz) | – | – | 2.5.5.9 |
| Résistance à l'écoulement | 1/3 once, VLP avec | N/mm | 0.80 |
| Plongeon de la soudure | @ 288 degrés Celsius | min | >=30 |
| Young’s Modulus | 50 degré Celsius | GPA | 26 |
| Young’s Modulus | 200 degré Celsius | GPA | 23 |
| Module de flexion (50 degré Celsius) | GPA | 32 | |
| Module de flexion (200 degré Celsius) | GPA | 27 | |
| Absorption d'eau (UN) | % | 0.14 | |
| Absorption d'eau (85 degré Celsius / 85% rh,168Heure) | % | 0.35 | |
| Inflammabilité | UL-94 Rating | V-0 | |
| Conductivité thermique | Avec(M.K) | 0.61 | |
| Couleur | – | Noir |
Production Capabilities
UGPCB company has matured to use SI10U to produce IC Substrate boards in batches.
