LOGO UGPCB
Introduction
Tuc TU-900 and TU-900P are high Tg 260°C halogen-free multilayer PCB materials. TU-900 serves as the Core, while TU-900P functions as the PP.
Composition and Properties
Le matériau PCB TU-900 à haute Tg260°C est fabriqué à partir d'un système de résine haute performance de type BT et d'un tissu de verre sans alcali. Il bénéficie d'une conception de PCB multicouche sans halogène, module d'élasticité élevé, haute fiabilité, DK / DF bas, et propriétés électriques à faible perte.
Design and Application
TU-900 and TU-900P multilayer PCB materials are tailored for high-reliability multi-layer PCB boards, IC substrates or SiP package substrates, radio frequency PCBs, and ultra-thin HDI PCB boards. They are suitable for PCB boards that demand strict X, Y dimensional stability, low board deformation, or operation in excessively harsh environments.
Propriétés supplémentaires
TU-900 PCB material further exhibits excellent chemical resistance, high rigidity, low thermal expansion, and outstanding long-term reliability and CAF performance.
Data Sheet
Tuc TU-900 / TU-900P PCB materials Data Sheet
Industry Certification
Tuc TU-900 and TU-900P possess industry certification IPC-4101 with model names /127, /128, /130. They have a UL name-no ANSI rating, UL file number E189572, a flammability rating of 94V-0, and a maximum operating temperature of 150°C.
Standard Availability
Tuc TU-900 and TU-900P are available in thicknesses ranging from 0.0012″ [0.03mm] to 0.062″ [1.58mm], in sheet or panel form. Copper foil cladding ranges from 1/3 à 3 ounces. Prepreg is available in roll or panel form, with Glass styles including 1017, 1027, 1037, 1067, 1078, 3313, et 2116, among others available upon request.
