12-레이어 고속 고신뢰성 PCB | 2.4mm 두께 | 난야 NY6300S | 후면 드릴링 & RTF 포일

Professional Product Overview: The 12-Layer High-Speed, High-Density PCB

In the era of high-speed data transmission and complex system integration, conventional printed circuit boards (PCB) fall short of meeting the performance demands of advanced electronics. 그만큼 12-layer high-speed, 고밀도 PCB is the engineered solution. Featuring up to 12 precisely aligned conductive layers, it enables intricate interconnections and efficient signal transmission within a compact footprint, serving as the “central nervous system” for high-end networking gear, data center servers, 고성능 컴퓨팅 (HPC), and AI hardware.

As an expert PCB 제조업체 그리고 PCB 공급업체, UGPCB leverages advanced processes to deliver reliable 12-층 PCB 보드 생산, ensuring your products maintain a competitive performance edge.

In-Depth Parameter Analysis: The Foundation of Performance

The capability of a high-quality 다층 인쇄 회로 보드 is defined by its specifications. Below is an analysis of this product’s core parameters:

• 레이어 수 & 스택업: 12 레이어. 이것 multilayer PCB design offers superior signal integrity (그리고), 전력 무결성 (PI), and EMC performance compared to boards with fewer layers. It allows for dedicated power and ground planes, providing clear return paths for high-speed signals.

• 보드 두께 & 용인: 2.4mm ±10%. This robust thickness offers excellent mechanical strength for backplanes and large-form-factor applications, ensuring reliability during mating and installation. The tight tolerance guarantees consistency in assembly.

• Finished Copper Weight: Unique distribution: 1/1/1/1/1/2/2/1/1/1/1/1 oz. This indicates that the inner layers (L6 & L7) utilize 2oz heavy copper, designed specifically for high-current power delivery. The outer and other signal layers use 1oz copper, optimized for fine-line etching. This hybrid construction is a hallmark of 높은 신뢰성 PCB 제작.

• Critical Process Capabilities:

  • Minimum Drilled Hole Size: 0.2mm. Supports high-density BGA fan-out, enhancing routing flexibility.

  • Minimum Line Width/Space: 0.076mm / 0.09mm (3밀 / 3.5밀). 달성 고밀도 상호 연결 (HDI)-level routing, essential for high-speed signal propagation.

• 표면 마감: OSP (유기 용해성 보존). Compatible with both leaded and lead-free soldering, it protects copper pads from oxidation, offers excellent surface planarity, and is cost-effective—ideal for boards with dense SMT 구성 요소.

핵심 재료 & Key Technologies: Enabling Superior Signal Integrity

1. High-Performance Laminate: Utilizes 난야 NY6300S high-speed laminate. Its high glass transition temperature (Tg >150℃) ensures dimensional stability and reliability during high-temperature reflow soldering. Its optimized dielectric constant (DK) and dissipation factor (Df) significantly reduce signal loss at high frequencies, forming the material foundation for 고주파 PCB.

2. Advanced Copper Foil: 고용 RTF (Reverse Treated Foil) 구리. Compared to standard electrodeposited (에드) foil, RTF foil features a smoother, low-profile surface on the treated side. This reduces signal loss due to the “피부 효과” at high frequencies, critically enhancing the performance of differential signals exceeding 10 Gbps.

3. Critical Process: Controlled-Depth Drilling (후면 드릴링): In 12-layer or higher 다층 PCB, the unused portion (stub) of a through-hole via can cause significant signal reflection, degrading integrity. 그만큼 back drilling process precisely removes this non-functional via stub, eliminating its negative impact—a key technology for high-speed multilayer PCB 성능.

생산 흐름 & 품질 보증

UGPCB 12-레이어 PCB 제조 공정 strictly adheres to IPC 표준 and includes 제조 가능성을위한 설계 (DFM) 검토, inner layer imaging, 라미네이션, 교련 (including back drilling), 도금, outer layer imaging, solder mask application, 표면 마감 (OSP), 라우팅, electrical testing, 및 최종 검사. Each stage is supported by precision measurement equipment (AOI, Impedance Testing, Flying Probe Test), 모든 것을 보장 회로 기판 delivered meets design specifications and our high-quality standards.

일반적인 응용 프로그램 & Product Classification

This high-performance PCB 보드 is designed for demanding electrical environments and complex systems, primarily used in:

• High-End Network & 통신 장비: Core motherboards for 400G/800G optical modules, high-end routers, and switches.

• Data Center & 클라우드 컴퓨팅: Server motherboards, accelerator cards, storage backplanes.

• 고성능 컴퓨팅: Workstation motherboards, GPU computing cards, AI accelerator hardware.

• Advanced Test & Measurement Instruments: Internal boards for instruments processing very high-frequency signals.

Scientific Product Classification:

• 레이어 수에 의해: 다층 PCB (>8 레이어)

• By Technology Type: High-Speed/High-Frequency PCB, HDI PCB, 무거운 구리 PCB (partial)

• 응용 프로그램에 의해: Telecom Infrastructure PCB, Data Center/Server PCB

Why Choose UGPCB for Your 12-Layer High-Speed PCB?

• 기술 전문 지식: Proven mastery of back drilling 그리고 RTF copper foil application to tackle high-speed design challenges.

• 정밀가공: Capable of 3/3.5 mil line/space, meeting stringent high-density interconnect requirements.

• Material Integrity: Core use of reputable 고속 라미네이트 like Nanya NY6300S ensures foundational performance.

• 설계 지원: Expert PCB 설계 그리고 DFM review services to de-risk your project from the start.

• Consistent Quality: A fully controlled PCB 생산 and inspection system delivers reliable products you can trust.

Ready to elevate your hardware? Contact UGPCB’s engineers for a free PCB quote 그리고 DFM 분석 on your next 12-layer high-speed board project.