Product positioning: UGPCB’s 6-layer 1-stage HDI PCB uses a 1+N+1 stack-up. 그것은 제공합니다 0.10 mm laser blind vias, 0.20 mm through holes, 0.20 mm BGA pitch, 그리고 3/3 mil traces. It suits compact, high-integration electronics.
1. What Is a 6-Layer 1-Stage HDI PCB?
A 6-layer 1-stage HDI PCB is a six-layer high-density interconnect printed circuit board. It uses a 1+N+1 stack-up, where N equals 4. IPC-2226 classifies this build-up approach as a Type I HDI 구조. Each side has one build-up layer. Laser microvias connect the outer layers to the next inner layer. Mechanical through holes connect the core layers.
Parameter Snapshot
| 매개 변수 | 사양 |
|---|---|
| 레이어 수 | 6 레이어 (1+N+1) |
| 기본 재료 | FR4 Tg150 |
| 보드 두께 | 1.6 mm |
| 패널 크기 | 105 × 95 mm (1-위로) |
| 외부 구리 두께 | 35 μm (1 온스) |
| 내부 구리 두께 | 30 μm |
| 최소 관통 구멍 | 0.20 mm |
| Minimum blind via | 0.10 mm |
| Minimum BGA pitch | 0.20 mm |
| Trace width/spacing | 3/3 밀 (75 µm/75 µm) |
2. Product Overview and Scientific Classification
2.1 제품개요
UGPCB’s 6-layer 1-stage HDI PCB targets high-density electronic packaging. It improves routing density over a standard 6-layer through-hole PCB. Laser-drilled blind vias make this possible. IPC-2226 defines HDI as a board with higher wiring density than 기존의 PCB. It uses conductors ≤100 µm, 비아 <150 μm, 그리고 패드 <400 μm. This product meets those thresholds. 그것은 3/3 밀 (75 μm) traces and 0.10 mm laser microvias exceed standard PCB capability.
2.2 과학적 분류
- By interconnection: HDI PCB, IPC-2226 Type I
- By stack-up: 1+N+1 first-order HDI, single build-up per side, N=4 core
- 레이어 수별: 6-층 다층 PCB
- By base material: FR4 Tg150 epoxy glass fabric
- By performance class: IPC-6012 클래스 2 또는 수업 3
- By product form: bare PCB or PCBA 조립
3. Stack-Up and Design Highlights
3.1 1+N+1 Stack-Up
1+N+1 is the most basic and mature HDI stack-up. “N” is the core. Each “1” is one build-up layer. This product is 1+4+1. The core has four layers. One build-up layer sits on each side. IPC-2226 describes this structure as having microvias that connect to adjacent inner layers. The core uses mechanical through holes. This structure balances signal integrity, 비용, and yield. Many HDI PCB designs start with this stack-up.
3.2 Key Design Points
Blind via design: The minimum blind via is 0.10 mm (100 μm). IPC-T-50M defines a microvia as a blind via ≤0.15 mm with aspect ratio ≤1:1. The blind via connects only the outer layer to the next inner layer. It frees inner-layer routing space. This helps high-density PCB layout.
Trace width and spacing: The product uses 3/3 밀 (75 µm/75 µm) 흔적. This is a core HDI PCB 능력. Standard multilayer PCBs often use 6/6 밀 (150 μm) 흔적. HDI PCBs can use 3/3 mil or finer. This doubles routing density in the same area. ~에 0.20 mm BGA pitch, 3/3 mil traces allow two routes between pads. This directly affects BGA escape routing.
BGA support: The minimum BGA pitch is 0.20 mm. At this pitch, pads are often 0.10–0.12 mm. Pad spacing is only 0.08–0.10 mm. This demands high registration accuracy and etch control in PCB manufacturing.
임피던스 제어: 와 함께 3/3 mil traces and FR4 Tg150, Dk is about 4.2–4.6 at 1 MHz. Manufacturers can control 50 Ω single-ended and 100 Ω differential impedance. This supports high-speed signal transmission.
Thermal design: The 6-layer structure uses 30 µm inner copper. Large inner copper planes spread heat away from BGA areas.
4. 작동 방식
The 6-layer 1-stage HDI PCB uses two via types:
- Laser blind via: A laser drills from the outer layer to the next inner layer. The minimum diameter is 0.10 mm. CO₂ or UV lasers form these vias.
- Mechanical through hole: This hole passes from top to bottom. It connects core layers and all layers. The minimum diameter is 0.20 mm.
Signals travel from surface components, such as BGA chips, through blind vias into inner signal layers. This avoids the space loss and signal reflection of through holes. The shorter path lowers parasitic inductance and capacitance. This benefits high-speed digital signals.
5. Core Materials and Performance
5.1 기본 재료: FR4 Tg150
This product uses FR4 Tg150 epoxy glass fabric. Tg is the glass transition temperature. IPC-TM-650 method 2.4.25 (DSC) measures this value. Tg150 material remains stable in lead-free soldering. Lead-free reflow peaks at about 245–260°C. The material withstands multiple reflow cycles without major dimensional change or delamination.
5.2 구리 두께
- Outer copper: 35 μm (1 온스). This supports current carrying and solder reliability.
- 내부 구리: 30 μm. This meets signal and power plane needs.
5.3 주요 성능 특징
- High routing density: 3/3 mil traces and 0.10 mm microvias raise density by over 50% versus standard 6-layer boards.
- Small package support: 0.20 mm BGA pitch fits CSP, QFN, and other micro packages.
- Strong signal integrity: Short blind via paths reduce parasitic effects. This helps high-speed signals.
- Reliable construction: The board can meet IPC-6012 acceptance requirements. IPC-6012 클래스 3 requires a minimum average copper thickness of 25 µm in plated holes.
6. 생산 과정
UGPCB makes 6-layer 1-stage HDI PCBs through precise steps:
- Inner-layer imaging: Expose, 개발하다, and etch inner traces on the 4-layer core.
- Inner-layer lamination: Press inner cores and prepreg into a 4-layer core.
- First drilling and plating: Drill mechanical through holes and plate copper.
- Build-up lamination: Press one dielectric layer on each side of the core.
- 레이저 드릴링: Use CO₂ or UV lasers to form 0.10 mm microvias.
- Blind via plating and filling: Plate and fill laser vias for reliable conduction.
- Outer-layer imaging: 형태 3/3 mil outer traces.
- 솔더 마스크 및 표면 마감: Apply solder mask and ENIG or OSP finish.
- Profiling and testing: Route the outline, run 플라잉 프로브 테스트, AOI, 및 최종 검사.
7. 주요 응용
The 6-layer 1-stage HDI PCB balances density, 크기, 신뢰성. It serves many markets:
- Smartphones and mobile devices: Mainboard core areas with processor BGA packages.
- 웨어러블: 스마트워치, TWS 이어버드, and other space-limited products.
- 자동차 전자 제품: ADAS sensor modules and infotainment mainboards.
- 의료 전자 장치: Portable monitors and implantable device control boards.
- 산업 통제: PLC modules and industrial IoT gateways.
- 통신 장비: 5G small-cell RF modules and optical module PCBs.
The global HDI PCB market is growing fast. The Business Research Company reports strong HDI market growth. The market will grow from USD 17.78 10 억입니다 2025 USD로 19.47 10 억입니다 2026. That is a 9.5% compound annual growth rate (cagr). The market may reach USD 28.82 10억 단위로 2030.
8. UGPCB를 선택하는 이유는 무엇입니까??
UGPCB 회로 제한 (UGPCB®) focuses on high-precision PCB R&D and manufacturing. Its factory covers 280,000 제곱 미터. 그것은 고용한다 1,300 사람들. 위에 35% are technical professionals. The company makes HDI PCBs from 1 에게 6+ 단계, 모든 레이어 HDI 보드, IC 기판, 강성 튀김 보드, 및 표준 다층 FR4 PCB.
UGPCB holds ISO9001, UL, and RoHS certifications. It follows IPC standards for production and acceptance. This ensures product quality meets customer needs and industry rules. The company serves customers in mainland China, 대만, 한국, 일본, the US, 브라질, 인도, 동남아시아, and Europe.
Get a quote today: Send your Gerber files or design parameters. The UGPCB technical team will reply within 24 시간. We will provide a custom 6-layer HDI PCB quote and a one-stop PCBA assembly solution. 당신이 필요 여부 quick prototyping or stable volume supply, we can help.
데이터 소스 설명
This article cites standards and technical data from these authorities:
- IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) 인쇄보드 — HDI structure classification and microvia definition.
- IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits — microvia terminology.
- IPC-6012, 경질 인쇄 기판의 자격 및 성능 사양 — rigid board acceptance and plated copper thickness.
- IPC-2221, 인쇄 기판 설계에 대한 일반 표준 — PCB design guidelines and trace/space practice.
- IPC-TM-650 Method 2.4.25 — glass transition temperature (Tg) 테스트 방법.
- The Business Research Company, Global High Density Interconnect (HDI) Market Report 2026 — HDI market data.
