Prezentare generală a produsului
UGPCB introduce 6‑layer 2+N+2 HDI PCB (Model: 6L 2+N+2 PCB HDI). This high‑density interconnect placa de circuit imprimat is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, şi 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, module optice, și aplicații similare.
În PCB industrie, HDI (Interconectare de înaltă densitate) technology is the core enabler for shrinking component pitches and rising signal speeds. The 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, integritatea semnalului, si costul de fabricatie.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theIPC-2226 standard and is classified asTipul III within that system.
Breaking down the term:
- The first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, Adică, two inner core layers).
- The second “2” means two sequential build‑up layers below the core.
Astfel, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
Clasificare HDI conform IPC-2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| Tip HDI | Structura | Build‑up Layers (pe fiecare parte) | Minimum BGA Pitch | Aplicații tipice |
|---|---|---|---|---|
| Tipul I | 1+N+1 | 1 strat | 0.5mm | Smartphone-uri, mid‑density designs |
| Type II/III | 2+N+2 | 2 straturi | 0.4mm | Echipamente de rețea, high‑performance computing |
| Tipul III / ELIC | 3+N+3 and above | 3+ straturi | 0.3mm and below | Smartphone-uri emblematice, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered configuratii.
Specificații tehnice de bază
| Parametru | Caietul de sarcini |
|---|---|
| Model | 6L 2+N+2 PCB HDI |
| Material | ITEQ IT150 |
| Număr de straturi | 6 straturi (2+N+2 second‑order HDI) |
| Culoarea măștii de lipit | Negru sau Alb (opțional) |
| Grosimea plăcii finisate | 1.0mm |
| Grosimea stratului interior de cupru | 1 Oz (~35μm) |
| Grosimea stratului exterior de cupru | 0.5 Oz (~17.5μm) |
| Urmă minimă / Spațiere | 2.5mil / 2.5mil (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2mm |
| Minimum Laser Drill | 0.1mm |
| Finisaj de suprafață | Aur de imersiune + OSP |
| Aplicație primară | Echipament de comunicare |
Material Deep Dive: ITEQ IT150
Material Positioning
ITEQ IT150 este o medium‑Tg, halogen‑free, multifunctional epoxy laminat. It sits between standard FR-4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (TG >150°C prin DSC), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, depozitare, and networking applications.
Parametri cheie de performanță
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| Proprietate | Metoda de testare | Valoare tipică | Unitate |
|---|---|---|---|
| Temperatura de tranziție a sticlei (TG) | DSC (IPC‑2.4.25) | 155 | ° C. |
| Temperatura de descompunere (TD, 5% pierdere în greutate) | TGA (IPC‑2.4.24.6) | 365 | ° C. |
| CTE pe axa Z (A1, sub Tg) | IPC‑2.4.24 | 35–40 | PPM/° C. |
| CTE pe axa Z (A2, deasupra Tg) | IPC‑2.4.24 | 220–240 | PPM/° C. |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | PPM/° C. |
| Constanta dielectrică (DK) @ 1GHz | IPC‑2.5.5.13 | 4.2–4,5 | - |
| Factor de disipare (Df) @ 1GHz | IPC‑2.5.5.13 | 0.010–0.018 | - |
| T288 Thermal Stress | IPC‑TM‑650 | >60 | Minutes |
| Absorbția umidității | IPC‑2.6.2.1 | 0.12 | % |
| Evaluarea inflamabilității | UL94 | V-0 | Rating |
| UL MOT (Max Operating Temp) | - | 130 | ° C. |
Avantaje materiale
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155° C.. Under lead‑free reflow peaks of260° C., this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. Rezistență CAF excelentă
Caf (Filament Anodic Conductiv) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18L / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (Cl) și brom (Br) content are each below 0.09% în greutate. Total Cl+Br is below 0.15% (1500ppm).
Ghid de proiectare
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2mm), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1mm) and fill with copper.
- Outer layer circuits – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
Acesttwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
Acest produs realizează 2.5mil/2,5 mil (~63.5μm/63.5μm) lățimea și spațierea urmei. This exceeds the Design HDI Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4mm pitch BGA breakout with ample routing channels.
- Flexible signal routing for high‑density componentă plasare.
- Reduced layer count, which lowers overall PCB cost.
Tehnologia Microvia
Acest produs folosește ahybrid drilling approach:
- Foraj mecanic – Minimum diameter 0.2mm, used for through‑holes and buried vias in the core.
- Foraj cu laser – Minimum diameter 0.1mm (4mil) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingvia‑in‑pad designs for fine‑pitch BGAs.
Principiul de funcționare
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by foraj mecanic + placare, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by foraj cu laser + placare, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
Aceststepped interconnect structure shortens signal paths and reduces parasitic via effects. Ca urmare, it preserves high‑speed signal integrity.
Avantaje de performanță
Fiabilitate termică
ITEQ IT150’sTD (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 minute without delamination. This ensures material integrity through multiple reflow cycles.
Integritatea semnalului
La 1GHz, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
Rezistență mecanică
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
Clasificarea produselor
This product is classified across multiple dimensions:
| Classification System | Categorie |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+N+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | PCB rigid |
| Număr de straturi | 6placă cu mai multe straturi |
| Sistem material | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| Finisaj de suprafață | Aur de imersiune + OSP hybrid finish |
| Domeniul aplicației | Communication‑grade PCB |
Fluxul procesului de fabricație
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
Pas 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
Pas 2: First Build‑Up
Laminare (miez + preimpregnat + folie de cupru) → First lamination → First‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
Pas 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
Pas 4: Outer Layer and Finishing
Foraj mecanic (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5mil/2,5 mil) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
Scenarii de aplicație
This product is primarily designed forEchipament de comunicare:
5G Infrastructura de comunicare
- 5G stații de bază (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- Transceiver-uri optice.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA rutare. It enables complex signal interconnects within limited board space.
De ce să alegeți UGPCB?
UGPCB brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows IPC-6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment Fabricarea PCB-urilor.
Solicitați o cotație astăzi
Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
Declarația surselor de date
The technical data cited in this document comes from the following authoritative standards and sources:
- IPC-2226 – Sectional Design Standard for High Density Interconnect (HDI) Placi imprimate
- IPC‑6012E/F – Specificații de calificare și performanță pentru plăci imprimate rigide
- IPC/JPCA‑2315 – Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- IPC‑TM‑650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, si altele)
- JPCA‑ES‑01‑2003 – Halogen‑Free Copper‑Clad Laminate Standard
- UL94 – Standard pentru siguranța inflamabilității materialelor plastice pentru piesele din dispozitive și aparate
