4-Producator de placi de substrat Layer DDR | Material HL832 de mare viteză

Lead the High-Speed Era: UGPCB’s 4-Layer DDR Substrate Board – The Superior Interconnect Solution for Your Core ICs

In the booming landscape of high-performance computing, artificial intelligence, and next-generation communication devices, every advancement in Double Data Rate (DDR) technology places stricter demands on PCB substrates. Leveraging deep expertise in high-end PCB manufacturing şi substrat IC solutions, UGPCB introduces its premium 4-Layer DDR Substrate Board. Engineered with cutting-edge materials, it is specifically designed to carry high-performance memory chips (De ex., DDR4, DDR5, LPDDR), serving as your reliable partner in the pursuit of ultimate speed and stability.

Product Overview & Definiţie

O 4-Layer DDR Substrate Board is a High-Density Interconnect (HDI) printed circuit board designed for packaging and connecting Dynamic Random-Access Memory (DDR) chips-uri. It acts as a critical bridge between the chip and the mainboard, responsible for transmitting high-speed signals, distributing power, and providing stable mechanical support. Unlike standard PCB boards, DDR substrates demand near-perfect signal integrity, Managementul termic, and dimensional accuracy. This product from UGPCB is tailor-made to meet these stringent requirements.

UGPCB's 4-Layer DDR Substrate Board

Critical Design Considerations

Precise Impedance Control: Paramount for DDR PCB design, it minimizes signal reflection and distortion during high-speed data transmission.
Power Integrity (Pi): Dedicated power and ground plane design ensures clean, stable power delivery, reducing noise interference on critical signals.
1. Integritatea semnalului (SI): Optimized routing using microstrip and stripline structures minimizes crosstalk and delay, forming the foundation for stable performance post-Ansamblu PCBA.
Managementul termic: The substrate material must exhibit excellent thermal properties to aid chip dissipation and ensure long-term reliability.

How It Works

The 4-Layer DDR Substrate connects the hundreds of micro-pins of a memory chip to the corresponding motherboard circuits via its precise internal layers. Sale “sandwich” stack-up (Signal-Ground-Power-Signal) provides clear return paths for high-speed signals, effectively suppressing Electromagnetic Interference (EMI). The soft gold surface finish ensures a reliable, low-resistance solder joint with the chip’s solder balls (De ex., in BGA packages).

Aplicații primare & Clasificare

Aplicații primare: Extensively used in servers, data center switches, high-end GPUs, AI accelerator cards, network storage devices, and any cutting-edge electronic product requiring high-speed, high-capacity memory.
Clasificare:
- By Layer Count: Beyond standard 4-layer, designs can extend to 6, 8, or more layers based on complexity.
- După Material: Can be categorized into standard FR-4, Mid-Loss, and this product’s focus – Low-Loss material substrates.

Materiale & Performance Specifications

Parametru	Caietul de sarcini	Performance Advantage
Core Material	Mitsubishi Gas Chemical HL832	Industry-recognized, de înaltă performanță, low-loss (Low Df) laminate designed for high-speed digital circuits, significantly reducing signal transmission loss.
Număr de straturi	4 Straturi	Optimal “Signal-Ground-Power-Signal” stack-up, balancing design complexity, cost, și performanță.
Grosime terminată	0.25mm	Ultra-thin profile, conforming to compact chip packaging trends for integration into miniaturized devices.
Grosime de cupru	0.5Oz (17.5μm)	Standard starting weight, suitable for fine-line etching; can be plated up for higher current needs.
Solder Mask Color	Verde (AUS308)	Provides excellent insulation protection and visual contrast for Optical Inspection (Aoi) after Ansamblu PCB.
Surface Finish	Soft Gold (De acord)	Excellent surface planarity and low hardness, ensures superior compatibility with wire bonding or BGA solder balls for reliable connections.
Minimum Drilled Hole Size	100μm	Supports high-density micro-via design for complex chip pinout interconnection.
Min. Line Width/Space	50μm / 75μm	High-precision routing capability allows more high-speed lines in limited space, meeting high-density interconnect PCB design needs.

Product Structure & Caracteristici cheie

Structura: Typical 4-layer sequential lamination: Stratul superior (Signal/Components) -> Stratul interior 1 (Solid Ground Plane) -> Stratul interior 2 (Solid Power Plane) -> Stratul de jos (Signal/Components). This structure offers optimal shielding for high-speed signals.
Caracteristici cheie:
- Superior High-Speed Performance: HL832 low-loss material ensures excellent signal integrity for high-frequency DDR signals.
- High-Density Interconnect Capability: 100μm micro-vias and 50μm line width technology support advanced chip packaging.
- Fiabilitate ridicată: ENIG surface finish offers excellent solderability and oxidation resistance for long-term stability.
- Ultra-Thin & Precise: 0.25mm overall thickness meets stringent space requirements in modern electronics.

Precision Manufacturing Process

Noastre Fabricarea PCB-urilor process adheres to the highest quality standards:
Material Prep → Inner Layer Imaging & Etching → Lamination & Drilling → Metallization & Plating → Outer Layer Imaging → Surface Finish (De acord) → Solder Mask Application → Profiling → Electrical Test & Inspecție finală.
Each stage is supported by advanced inspection equipment (De ex., Aoi, Flying Probe Test), ensuring every substrat IC delivered is flawless.

Typical Use Cases

This 4-Layer DDR Substrate is the ideal choice for:

Data Centers & Servers: Carrying CPU and memory modules for massive data processing.
AI & Machine Learning Hardware: Memory subsystems in GPU, NPU accelerator cards.
High-End Communication Equipment: High-speed memory units in 5G base stations and core network gear.
Flagship Consumer Electronics: Main memory substrates in top-tier gaming consoles and laptops.

DDR Substrate in AI Accelerator Card with Memory

Why Choose UGPCB’s 4-Layer DDR Substrate?

We are more than a Producător de PCB; we are your solution provider for high-speed design challenges. With a dedicated PCB design support team, proven capabilities in multilayer PCB prototyping and mass production, and a deep understanding of signal integrity engineering, choosing UGPCB means gaining not just a high-quality substrate, but an accelerator for your product’s success.