Producător profesional de substrat HDI IC | 30/70μm Urmă | Finisaj ENEPIG – UGPCB

Product Overview: What is an HDI IC Substrate Board?

An HDI IC Substrate Board is a critical, high-end printed circuit board engineered specifically for semiconductor package interconnection. It acts as the essential interface, providing electrical connectivity, power distribution, and mechanical support between a finely-pitched silicon die and a standard motherboard PCB. UGPCB delivers high-reliability, advanced HDI IC Substrate manufacturing, meeting the stringent demands of applications from consumer electronics to high-performance computing.

This board, built with SI10U material in a 6-strat (2+2+2) construction and a slim profile of 0.6mm, exemplifies state-of-the-art HDI tehnologie. With a 35x35mm unit size, it features a 0.1mm minimum laser via diameter, 30μm minimum trace width / 70μm minimum spacing, şi Enepic (Nichel Electroless Paladiu Imersion Aur) surface finish, making it an ideal solution for packaging high-speed, high-frequency, and highly integrated chips.

In-Depth Analysis: Proiecta, Function, and Applications

Core Definition & Principiul de lucru

The HDI IC Substrate is designed to “fan-out” the dense array of micro-bumps from a semiconductor die, redistributing the connections to a larger pitch compatible with standard Ansamblu PCB processes like BGA (Ball Grid Array) mounting.

The working principle follows this chain: Die → Microbumps → HDI IC Substrate (for signal redistribution & interconnection) → Solder Balls (BGA/CSP) → Mainboard PCB. It is pivotal for signal integrity, power delivery, si managementul termic.

Key Design Considerations

1. Stack-up & Controlul impedanței: The 6-layer (2+2+2) build-up is a classic design for high routing density. Precise impedance calculation (typically 50Ω single-ended or 100Ω differential) is crucial for signal integrity.

2. Micro-via Reliability: 0.1mm (100μm) laser-drilled micro-vias are key for interconnect density. Via shape, copper plating, and fill process must be optimized for thermal cycle reliability.

3. Fine-Line Fabrication: 30μm trace width and 70μm spacing are core metrics of process capability, directly impacting I/O density and electrical performance.

4. Thermal & Mechanical Management: The selection of SI10U material considers its Coefficient of Thermal Expansion (Cte) matching with silicon to minimize thermal stress and enhance product longevity.

Primary Materials & Caracteristici de performanță

• Core Material: SI10U. A high-performance laminate offering low dielectric constant (DK), low dissipation factor (Df), high glass transition temperature (TG), and excellent dimensional stability, ideal for high-speed, high-frequency applications.

• Masca de lipit: PSR-4000 AUS308. A high-resolution, high-reliability Liquid Photoimageable Solder Mask (LPSM) that provides precise coverage, excellent insulation, and chemical resistance.

• Surface Finish: Enepic. This finish deposits sequential layers of Nickel, Palladium, and Gold. Nickel acts as a diffusion barrier, Palladium prevents nickel corrosion, and the thin gold layer offers superior solderability and wire-bonding capability, perfect for fine-pitch pads.

• Performance Summary: High density, de mare viteză, fiabilitate ridicată, excellent thermal management, and superior signal integrity.

Clasificare & Scenarii de aplicație

HDI IC Substrates are categorized by technology and application:

• Prin tehnologie: With core (De ex., this 6L build-up) or coreless types.

• Prin cerere:

  1. Advanced Processors: CPU, GPU, AI accelerator chips requiring maximum routing density and signal speed.

  2. Mobile & RF: Smartphone Application Processors (AP) and RF modules, where miniaturization and thin profiles (0.6mm) are critical.

  3. Memory: Interface substrates for High Bandwidth Memory (HBM).

  4. Networking & Auto: High-speed switch chips and ADAS domain controllers.

UGPCB’s Manufacturing Process & Asigurarea calității

UGPCB’s production integrates leading-edge processes compliant with IPC standards:

1. Foraj cu laser: UV laser systems create precise 0.1mm micro-vias.

2. Placare & Via Fill: Advanced pulse plating ensures complete via filling for reliable interconnects.

3. Advanced Imaging: High-end exposure systems and high-resolution dry film achieve 30/70μm line definition.

4. Laminare: Precise alignment and pressing of multiple core layers and prepreg (PP).

5. Finisarea suprafeței: Application of the Enepic coating for optimal solderability.

6. Comprehensive Testing: Utilizes AOI (Inspecție optică automată), flying probe testing, and impedance testing to guarantee compliance.

Noastre one-stop PCB service capability extends from substrat IC fabricație to subsequent ansamblu SMT şi testarea, offering a complete packaging solution.

Why Choose UGPCB for Your HDI IC Substrate?

1. Advanced Process Capability: Proven expertise in 30/70μm trace/space şi 0.1mm micro-via tehnologie.

2. Materials Expertise: In-depth knowledge of advanced materials like SI10U to recommend optimal solutions.

3. Uncompromising Quality: Stringent, automotive-grade quality control throughout the entire process.

4. One-Stop Solution: We are more than a PCB fabricator; we are your PCBA partner, offering design support, fabricație, and assembly.

5. Expert Support: Dedicated engineering team provides DFM (Proiectare pentru producție) analysis and technical consultation.

Get Your Custom Solution Now

Whether you are developing the next HPC platform, 5G infrastructure, sau ADAS system, UGPCB’s professional HDI IC Substrate manufacturing şi PCBA assembly services are your foundation for success.

Contact us today for a free technical consultation and quote! Let our experts help you enhance product performance through optimized IC substrate design and reliable Fabricarea PCB proceselor.