1. Prezentare generală a produsului
În domeniul interconectare de înaltă densitate (HDI) Plăci de circuite tipărite, cel12-layer 2+N+2 board represents an important direction in advanced PCB manufacturing technology. UGPCB12-layer 2+N+2 HDI board uses ISOLA high-performance substrate material, with a finished board thickness of 2.0 mm, 1 oz copper on both outer and inner layers, a minimum via diameter of 0.1 mm, line width/spacing of 0.1 mm, BGA pad diameter of 0.15 mm, and electroless nickel/immersion gold (De acord) finisarea suprafeței.
Acest12-strat PCB is a typical high-density interconnect placă multistrat suitable for electronic products with demanding requirements for signal integrity, routing density, si fiabilitate. Ca a2+N+2 structure placa HDI, it features two buildup layers on each side, with N core layers in the middle, supporting stacked or staggered microvia structures.
2. Definiția produsului
2.1 What Is a 2+N+2 HDI Board?
O2+N+2 HDI board is a high-density interconnect printed circuit board manufactured using a sequential lamination process. The “2” in its name represents two buildup layers on each side, în timp ce “N” represents the number of core layers in the middle. For this product, the total layer count is 12, meaning a 2+8+2 structure — two buildup layers on each side and eight core layers in the middle.
AcestPCB HDI belongs to Type III (as defined by IPC-2226), a commonly used HDI stackup solution supporting medium pin-count, BGA de înaltă densitate componentă rutare. The2+N+2 PCB stackup design significantly improves routing density, supports successful routing of ultra-fine-pitch BGAs with pitches as small as 0.4 mm, reduces overall layer count, and minimizes signal attenuation.
2.2 Applicable International Standards
Designul, fabricație, and acceptance of this product strictly comply with the following IPC international standards:
- IPC-6012F –Specificații de calificare și performanță pentru plăci imprimate rigide: This is the internationally recognized performance specification for rigid printed circuit boards, covering the entire process from material selection to finished product, including quality indicators, qualification, and performance requirements for each process step.
- IPC-2221C –Standard generic pentru designul plăcii imprimate: This is the foundation design standard for all documents in the IPC-2220 series, establishing generic requirements for printed board design.
- IPC-4101E –Specificații pentru materiale de bază pentru plăci imprimate rigide și multistrat: This specification covers requirements for base materials (laminate or prepreg) used primarily for rigid or multilayer printed boards.
3. Ghid de proiectare
3.1 2+N+2 Stackup Structure Design
The12-layer 2+N+2 PCB stackup design follows the core design principles for HDI boards:
- Priority on ground planes: Ground planes are prioritized because they transmit signals in microstrip configurations.
- Low impedance and low noise: A ground-plane-based 12-layer Design PCB achieves low ground impedance and low noise.
- High-speed signal routing: Intermediate layers between planes are used for high-speed signal traces, with tight coupling between signal layers.
- Adjacent plane and signal layers: Plane layers and signal layers should be placed on adjacent layers.
- Tight plane coupling: Large-area power and ground planes should be tightly coupled together.
3.2 Design de integritate a semnalului
Conform IPC-2221C, impedance tolerance and conductor layer isolation areas are critical considerations in design PCB de mare viteză. Pentru12-layer 2+N+2 HDI board, special attention should be paid to:
- Controlul impedanței: Cu 1 oz cupru (aproximativ 35 μm) on both outer and inner layers, precise line width/spacing control is required to achieve target impedance.
- Microvia structure: The 0.1 mm minimum via diameter falls within the microvia category (≤ 0.15 mm as defined by IPC-2221 and IPC-6012).
- BGA breakout: The 0.15 mm BGA pad combined with 0.1 mm line width/spacing supports successful breakout for 0.4 mm pitch BGAs.
4. Principii de funcționare
The12-layer 2+N+2 HDI board operates based on the interconnection and signal transmission of multiple conductive layers. Its core operating mechanisms include:
4.1 Signal Transmission Paths
HDI boards achieve interlayer electrical connections through the following via types:
- Vias orb: Connect from an outer layer to a specific inner layer without penetrating the entire board thickness.
- Vias îngropat: Exist only between inner layers.
- Stacked microvias: Multiple microvias stacked vertically to form a path through multiple buildup layers.
4.2 Power Distribution and Grounding
The power distribution network (PDN) din12-strat PCB is optimized through:
- Large-area power planes tightly coupled with ground planes, forming effective decoupling capacitance.
- Ground layers serving as return paths for signals, reducing loop inductance.
- Signal layers tightly coupled with adjacent plane layers, reducing electromagnetic interference (EMI).
5. Aplicații primare și cazuri de utilizare
5.1 Target Application Areas
The12-layer 2+N+2 HDI board, with its high-density interconnect capability and excellent electrical performance, is primarily used in the following areas:
| Zona de aplicare | Typical Products | Key Requirements |
|---|---|---|
| 5G Infrastructură | 5G stații de bază, AAU, RRU | High frequency, de mare viteză, pierdere redusă |
| Centre de date | Servere, întrerupătoare, dispozitive de stocare | High-speed data transmission, fiabilitate ridicată |
| Calcul de înaltă performanță | Carduri de accelerare AI, HPC | High-density BGA, integritatea semnalului |
| Wired/Wireless Communications | Optical modules, routere, microwave equipment | High-frequency performance, low insertion loss |
| Electronică auto | ADAS, radar auto (77 GHz) | Fiabilitate ridicată, temperature resistance |
| Aerospațial și Apărare | Avionica, Sisteme radar | Extreme environment reliability |
ISOLA materials such as TerraGreen® 400G are specifically suited for next-generation 5G infrastructure, data center systems, calcul de înaltă performanță, wired/wireless communications, and AI applications, supporting extremely high data transmission rates exceeding 100 Gb/s.
5.2 Compatible Product Types
- High-end smartphone mainboards
- Communication base station RF boards
- High-performance server backplanes
- AI training/inference accelerator cards
- High-speed optical modules
- Automotive radar sensor boards
6. Clasificarea produselor
Based on standard PCB industry classification methods, acest produs poate fi clasificat științific după cum urmează:
6.1 By Product Structure
Rigid board — Manufactured using rigid substrate materials (FR4/ISOLA).
6.2 După numărul de straturi
Placă multistrat — Featuring 12 straturi conductoare, bonded by insulating dielectric materials and interconnected through vias.
6.3 By Manufacturing Process
placa HDI (placă de interconectare de înaltă densitate) — Featuring a 2+N+2 sequential lamination structure, classified as a second-order HDI board (2+C+2).
6.4 By IPC-2226 Stackup Type
Type III stackup — 2+N+2 or higher-order stacked/staggered microvia structures.
6.5 By IPC-6012 Quality Class
Available to meetClasă 2 (dedicated-service electronic products) sauClasă 3 (produse electronice de înaltă fiabilitate) requirements as per customer specifications.
7. Materiale folosite
7.1 Substrat: ISOLA Series Materials
This product uses ISOLA high-performance copper-clad laminates. ISOLA is a leading material supplier in the high-frequency, high-speed PCB sector, with its products widely used in high-speed digital, high-frequency analog, RF/microwave, and other advanced circuit designs.
Typical properties of ISOLA materials (TerraGreen® 400G as an example):
| Proprietate | Valoare tipică | Metoda de testare |
|---|---|---|
| Temperatura de tranziție a sticlei (Tg DSC) | 200° C. | IPC-TM-650 2.4.25C |
| Temperatura de tranziție a sticlei (Tg DMA) | 215° C. | IPC-TM-650 2.4.24.4 |
| Temperatura de descompunere (Td @5% weight loss) | >380° C. | IPC-TM-650 2.4.24.6 |
| Constanta dielectrică (DK) | 3.15 | IPC-TM-650 2.5.5.5 |
| Factor de disipare (Df) | 0.0017 | IPC-TM-650 2.5.5.5 |
| UL rating de inflamabilitate | Ul 94 V-0 | UL File E41625 |
ISOLA materials comply with IPC-4101/134 and offer the following advantages:
- Halogen-free and RoHS compliant
- Excelent CAF (conductive anodic filament) rezistenţă
- Absorbție scăzută a umidității
- Withstands up to 6 reflow cycles at 260°C
- FR-4 process compatible — can be processed using standard Echipamente PCB
7.2 Folie de cupru
- Inner and outer layer copper thickness: 1 Oz (aproximativ 35 μm)
- Copper foil type: HVLP3 (ultra-low profile) or RTF (tratat invers) copper foil available upon request
7.3 Grosimea plăcii
- Grosimea plăcii finisate: 2.0 mm
8. Specificații de performanță
8.1 Key Electrical Specifications
| Parametru | Caietul de sarcini | Note |
|---|---|---|
| Număr de straturi | 12 straturi | 2+N+2 structure |
| Grosimea plăcii finisate | 2.0 mm | - |
| Grosimea stratului exterior de cupru | 1 Oz (35 μm) | Cupru finisat |
| Grosimea stratului interior de cupru | 1 Oz (35 μm) | - |
| Diametrul minim de trecere | 0.1 mm | Laser-drilled microvia |
| Lățimea minimă a liniei | 0.1 mm | - |
| Spațiere minimă între linii | 0.1 mm | - |
| BGA Pad Diameter | 0.15 mm | Suport 0.4 mm pitch BGA |
| Finisaj de suprafață | De acord (Nichel electroless/aur de imersie) | IPC-4552 compliant |
8.2 Reliability Performance
Conform IPC-6012F, rigid printed boards must meet the following reliability requirements:
- Electrical performance: Rezistenta de izolare, dielectric withstanding voltage, controlul impedanței, etc.
- Mechanical performance: Coajă de rezistență, deformare, stabilitate dimensională, etc.
- Environmental performance: Ciclul termic, testarea umidității, salt spray testing, etc.
IPC-6012F has introduced several new requirements for microvia structure reliability, including copper wrap plating, intermediate target lands, microsection evaluation, inner layer plating, and dielectric spacing and reliability issues for microvia structures.
IPC-6012F has increased the minimum copper thickness requirement for plated-through hole barrel walls — raised to 28 μm for Class 3/A (previously 25 μm).
8.3 Performanta termica
ISOLA materials with Tg ≥ 200°C and Td > 380°C support lead-free soldering processes and multiple reflow cycles.
9. Structura produsului
The2+N+2 HDI board via structure includes:
- Laser blind vias: From outer layers (L1/L12) to Layer 3/Layer 10 (buildup section), 0.1 mm diameter
- Laser blind vias: From Layer 3/Layer 10 to inner core layers
- Mechanical through vias: Through the core section (Straturi 4-9)
- Stacked microvias: Blind vias can be stacked vertically for multi-layer connections
10. Caracteristicile produsului
10.1 Capacitate de interconectare de înaltă densitate
- 0.1 mm microvias: Support ultra-high-density routing
- 0.1 mm line width/spacing: Enable fine-line design
- 0.15 mm BGA pads: Sprijin 0.4 mm pitch ultra-fine-pitch BGAs
10.2 Integritate excelentă a semnalului
- ISOLA low-loss material (Df la fel de jos ca 0.0017) ensures low high-frequency signal attenuation
- 2+N+2 structure supports precise impedance control
- Ground planes tightly coupled with signal layers reduce EMI
10.3 Fiabilitate ridicată
- Complies with IPC-6012F Class 2/Class 3 cerințe
- ISOLA material with Tg ≥ 200°C and Td > 380° C.
- ENIG surface finish provides excellent solderability and oxidation resistance
10.4 Compatibilitatea proceselor
- ISOLA materials are compatible with standard FR-4 process flows
- Supports sequential lamination
- Allows multiple reflow cycles
11. Fluxul procesului de fabricație
The 12-layer 2+N+2 HDI board manufacturing process is as follows:
11.1 Core Board Manufacturing (Straturi interioare)
- Tăierea materialului: Cut ISOLA substrate per MI requirements
- Formarea circuitului stratului interior: Apply photoresist → expose → develop → etch → strip to form inner layer circuit patterns
- Stratul interior AOI: Automated optical inspection to ensure circuit quality
- Brown oxide treatment: Enhance adhesion between inner layer copper and prepreg
11.2 First Lamination
- Stivuire: Stack inner layer cores with prepreg per the stackup structure
- Laminare: Bond multiple layers into one unit under high temperature and pressure
11.3 First Drilling and Via Metallization
- Foraj cu laser: Drill 0.1 mm microvias
- Defrânjează: Remove carbonized residue from laser drilling
- Via metallization: Electroless copper deposition to form conductive layer on via walls
- Panel plating: Build up copper thickness on via walls
11.4 Buildup Layer (Stratul exterior) Fabricație
- Formarea circuitului stratului exterior: Repeat inner layer circuit formation process
- Outer layer AOI: Inspecție optică automată
11.5 Second Lamination (if required)
- Secondary lamination: Multiple sequential lamination steps may be required for 2+N+2 structures
11.6 Final Finishing
- Outer layer drilling: Mechanical through-hole drilling
- Via metallization and plating: Through-hole metallization and copper build-up plating
- Outer layer circuits: Formați modele de circuite ale stratului exterior
- Masca de lipit: Apply solder mask ink
- Finisaj de suprafață: De acord (Nichel electroless/aur de imersie) — electroless nickel (3–6 μm) + aur de imersie (0.05–0,1 μm) pentru IPC-4552
- Imprimare legenda: Silk-screen component designators and other markings
- Rutarea profilului: Dirijare, tăietură în V, etc.
- Testare electrică: Sondă zburătoare sau testarea dispozitivului
- Inspecție finală: Visual inspection and packaging
12. ENIG Surface Finish Advantages
Acest produs folosesteDe acord (Nichel electroless/aur de imersie) finisarea suprafeței, offering the following core advantages:
| Avantaj | Descriere |
|---|---|
| Planeitate excelentă a suprafeței | Ideal for fine-pitch BGA and SMT assembly |
| Superior solderability | Supports multiple reflow cycles (3+ ori) |
| Durată lungă de valabilitate | 12+ months storage life |
| Strong oxidation resistance | Gold layer protects copper from oxidation |
| Conductivitate electrică bună | Suitable for high-frequency signal transmission |
The ENIG process chemically deposits a nickel-phosphorus alloy layer (approximately 3–6 μm thickness) și un strat de aur (approximately 0.05–0.1 μm thickness) on the PCB copper surface.
13. Why Choose UGPCB’s 12-Layer 2+N+2 HDI Board?
- International standard compliance: Strictly follows IPC-6012F, IPC-2221C, IPC-4101E, și alte standarde internaționale
- Asigurare material premium: Uses ISOLA high-performance substrate for high-frequency, high-speed performance
- Capacitate avansată de producție: Precision processing for 0.1 mm microvias and 0.1 mm line width/spacing
- Comprehensive quality control: Full-process quality management from incoming material inspection to final product testing
- Professional engineering support: Provides DFM (Proiectare pentru producție) reviews and impedance design support
14. Solicitați o cotație
UGPCB is committed to providing high-qualityPCB HDI manufacturing services to customers worldwide. Whether you need a12-layer 2+N+2 HDI board or other layer counts and structures ofPCB-uri multistrat, we offer professional technical support and competitive pricing.
How to Get a Quote:
- Submit design files: Send Gerber files, pile de foraj, and stackup specifications to our sales team
- Specify technical requirements: Include impedance requirements, material preferences, finisarea suprafeței, cantitate, etc.
- Engineering review: Our engineers will perform DFM checks to ensure manufacturability
- Receive a quote: Get a competitive price and lead time quickly
Contactaţi-ne
Send yourPCB design files to our sales email or submit an inquiry through our website. Our technical team will respond within 24 ore.
Declarație sursă de date
The technical data and standard information cited in this document are sourced from the following authoritative organizations:
- IPC (Asociația Connecting Electronics Industries) — IPC-6012FSpecificații de calificare și performanță pentru plăci imprimate rigide (septembrie 2023); IPC-2221CStandard generic pentru designul plăcii imprimate (December 2023); IPC-4101ESpecificații pentru materiale de bază pentru plăci imprimate rigide și multistrat (March 2017); IPC-4552Specificații de performanță pentru nichel electroless/aur de imersie (De acord) Placare pentru plăci imprimate
- Grupul izola — TerraGreen® 400G Product Data Sheet
- Ul (Laboratoarele Underwriters) — UL 94 V-0 Evaluarea inflamabilității, UL File Number E41625
- Literatură tehnică de industrie — HDI PCB stackup design and 2+N+2 structure technical documentation
