ЛОГОТИП УГКПБ
Hybrid PCB is commonly used in microwave RF series products
С быстрой разработкой электронных коммуникационных технологий, in order to achieve high-speed and high-fidelity signal transmission, more and more microwave radio frequency PCBs are used in communication equipment. Диэлектрические материалы, используемые в высокочастотных гибридных пласках, обладают отличными электрическими свойствами и хорошей химической стабильностью, which are mainly manifested in the following four aspects.
1. Hybrid PCB has the characteristics of low signal transmission loss, Короткое время задержки передачи, and low signal transmission distortion.
2. Отличные диэлектрические свойства (в основном относится к низкой относительной диэлектрической постоянной DK, Низкий диэлектрический коэффициент потери DF). Кроме того, Диэлектрические свойства (ДК, Дф) remain stable under environmental changes such as frequency, humidity and temperature.
3. High-precision characteristic impedance control.
4. Гибридная печатная плата имеет отличную теплостойкость (Тг), processability and adaptability.
Microwave high-frequency hybrid PCBs are widely used in communication equipment such as wireless antennas, base station receiving antennas, усилители мощности, радиолокационные системы, navigation systems, и т. д..
Based on one or more factors such as cost saving, improving bending strength and controlling electromagnetic interference, high-frequency lamination design must use high-frequency prepreg with low resin flow and FR-4 substrate with smooth dielectric surface. High-frequency composite laminate. В этом случае, there is a great risk of product adhesion control during the pressing process.
Microwave high-frequency hybrid PCB stacking method and characteristics
1. A high-frequency hybrid PCB controllable depth composite lamination structure, Высокочастотная гибридная печатная плата включает в себя медный слой L1 (высокочастотный лист), L2 Медный слой (ПП лист), L3 Медный слой (Эпоксидная смоляная подложка), L4 copper layer in sequence; L2, L3, L4 copper layers are provided with slots of the same size at the same position; L4 copper layer is arranged with three-in-one buffer material from inside to outside, and steel plate and kraft paper are stacked from outside to outside in sequence; aluminum plate, steel plate, and kraft paper are stacked on L1 copper layer from inside to outside.
2. According to the first feature, the three-in-one buffer material is a buffer material sandwiched between two layers of release film.
3. According to the first feature, the laminated structure of the high-frequency board controlled deep hybrid board of the present invention is characterized in that the high-frequency sheet is a polytetrafluoroethylene board.
The expansion and contraction characteristics of the high-frequency hybrid PCB composite board are different from those of the ordinary epoxy resin substrate, so the warping and shrinkage of the board are difficult to control, and the processing method of first grooving and then pressing will cause the problem of metal dents on the board. The three-in-one buffer material is set on one side of the groove, and the buffer material can be filled into the groove hole during pressing to avoid the problem of dents. Kraft paper buffer pressure is set on both sides of the cardboard to balance the heat transfer uniformly, and the steel plate is set to ensure uniform heat conduction during pressing, so that the pressing is flat, and the heat and pressure during the pressing process are balanced, so as to better control the curvature and expansion of the board.
С быстрой разработкой коммуникационных технологий 5G, higher frequency requirements are put forward for communication equipment. There are many microwave high-frequency hybrid PCBs on the market. Технология производства этих микроволновых высокочастотных гибридных ПХБ также выдвигает более высокие требования. We have been specialized in UGPCB processing for more than 10 years and can provide multi-layer hybrid PCB manufacturing services. We have all the equipment required for the entire process of multi-layer hybrid PCB production, comply with the ISO9001-2000 international standard management system, and have passed the iatf16949 and ISO 14001 Системная сертификация. Our products have passed UL certification and comply with IPC-A-600G and IPC-6012A standards. We can provide high-quality, high-stability, and high-adaptability microwave high-frequency hybrid PCB samples and batch services.
