58-Die Schicht lastete die Lastplatte laden

Introduction to the 58-Layer ATE Load PCB

The 58-layer ATE (Automated Test Equipment) Load PCB is a high-density, multilayer Leiterplatte engineered for precision signal transmission and durability in demanding testing environments. Designed with advanced parameters, it ensures optimal performance in high-frequency and high-power applications.

Key Specifications

• Schichten: 58

• Dimensions: 17.2″ x 17.8″

• Dicke: 230 Mil

• Material: FR4 Tg185

• Minimum Hole Size: 5 Mil

• BGA Spacing: 0.8 mm

• Seitenverhältnis: 23.4:1

• Drill-to-Copper Distance: 7 Mil

• POFV (Plated Over Filled Via): Ja

• Back Drilling: NEIN

• Surface Finish: ENEG+TG+ENIG

Design and Structural Features

Critical Design Considerations

1. High Layer Count: The 58-layer structure supports complex routing for high-density interconnects (HDI), minimizing signal loss.

2. Materialauswahl: FR4 Tg185 ensures thermal stability (up to 185°C glass transition temperature), critical for high-power applications.

3. Precision Drilling: A 5 mil minimum hole size and 23.4:1 aspect ratio enable reliable microvia formation, essential for BGA (0.8 mm pitch) component integration.

4. Signalintegrität: Controlled impedance and 7 mil drill-to-copper spacing reduce crosstalk and electromagnetic interference (EMI).

Unique Structural Advantages

• POFV Technology: Enhances via reliability by filling and plating vias, improving thermal and mechanical performance.

• ENEG+TG+ENIG Surface Finish: Combines electroless nickel electroless gold (ENEG) and immersion gold (ZUSTIMMEN) for superior corrosion resistance and solderability.

Performance and Applications

Operational Principles

The PCB facilitates precise electrical signal routing across 58 Schichten, leveraging FR4 Tg185’s dielectric properties to maintain signal integrity. POFV ensures robust connections in high-stress environments, while the optimized aspect ratio supports stable high-frequency operations.

Key Performance Metrics

• Thermal Resistance: Withstands temperatures up to 185°C.

• Mechanical Stability: High Tg material prevents delamination under thermal cycling.

• Signal Speed: Low-loss dielectric material minimizes latency.

Primary Use Cases

• Automated Test Equipment (ATE): Used in semiconductor testing systems for validating ICs and microprocessors.

• Luft- und Raumfahrt und Verteidigung: Deployed in radar and communication systems requiring high reliability.

• Telekommunikation: Supports 5G infrastructure and high-speed data transmission.

• Kfz -Elektronik: Integrated into ADAS (Advanced Driver Assistance Systems) and EV power modules.

Production Process and Quality Assurance

Manufacturing Workflow

1. Materialvorbereitung: FR4 Tg185 laminates are cut to 17.2″ x 17.8″ dimensions.

2. Laserbohren: Creates 5 mil microvias with a 23.4:1 aspect ratio.

3. Plating and Filling: POFV technology applies copper plating to filled vias.

4. Layer Stackup: 58 layers are aligned and bonded under high pressure.

5. Surface Finishing: ENEG+TG+ENIG coating is applied for corrosion protection.

6. Testen: Electrical continuity, Impedanz, and thermal stress tests are performed.

Quality Control Standards

• IPC-6012 Class 3: Ensures reliability for harsh environments.

• Impedanzkontrolle: ±10% tolerance maintained.

Summary of Advantages

• High-Density Design: Supports complex circuitry in compact spaces.

• Thermal Resilience: FR4 Tg185 ensures stability under extreme conditions.

• Precision Engineering: 5 mil holes and 0.8mm BGA spacing enable miniaturized component integration.

• Versatile Applications: From semiconductor testing to 5G infrastructure.

This PCB combines cutting-edge design, rigorous manufacturing standards, and robust materials to meet the needs of mission-critical industries.