Zuverlässiger Hersteller von 2-lagigen industriellen starren Leiterplatten | FR-4 TG150, 1.6mm, Bleifreies HASL

Einführung

UGPCB‘s 2-Layer Rigid PCB is a fundamental, Hochzuverlässige Leiterplatte solution engineered for demanding applications. Built on a robust FR-4 TG150-Substrat with a standard 1.60mm thickness, it delivers an optimal balance of performance, Haltbarkeit, und Wirtschaftlichkeit. The board features a reliable lead-free Hot Air Solder Leveling (Bluten) Oberflächenbeschaffung, a protective black solder mask, and clear white silkscreen legends for identification.

Produktübersicht & Einstufung

This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a Starre PCB (by construction), A 2-Layer or Double-Sided Board (by layer count), and is rated for Industriequalität (IPC-Klasse 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.

Design & Funktionsprinzip

Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (z.B., 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: Die FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, Die Lötmaske is a protective coating, und die Seidenbildschirm provides navigation.

Konstruktion, Materialien & Leistung

The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:

• Kern: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.

• Kupfer: Standard 1oz (35µm) electrodeposited copper foil.

• Oberflächen: Black LPI solder mask and white epoxy silkscreen.

• Oberflächenbeschaffung: Lead-Free HASL for excellent solderability.

This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.

Herstellungsprozess & Qualitätskontrolle

Our production follows IPC -Standards, encompassing CAM engineering, precision drilling, elektroplierend, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and Automatisierte optische Inspektion (AOI) to meet stringent quality criteria.

Anwendungen

This versatile PCB is ideal for:

• Industrial Control Systems: PLCs, motorische Antriebe, sensor interfaces.

• Leistungselektronik: Switch-mode power supplies (SMPS), UPS boards, LED drivers.

• Automobil & Unterhaltungselektronik: Auxiliary control modules, Audioverstärker, appliance controllers.

Key Specifications Table