2-Schichtstarre Leiterplatte 1,6 mm | FR-4 TG150 bleifreies HASL | UGPBC-Herstellung

UGPCB Standard 2-Layer Rigid PCB: Reliable 1.6mm FR-4 Circuit Boards for Demanding Applications

At the heart of modern electronics, Die Leiterplatte (Leiterplatte) acts as the foundational platform, interconnecting components and routing signals with precision. UGPCB Standard 2-Layer Rigid PCB, built with a robust 1.60mm Dicke and high-performance FR-4 TG150-Material, represents the optimal balance of durability, elektrische Leistung, and cost-effectiveness for a wide range of applications. Das doppelseitige Leiterplatte is a proven solution for prototypes and medium-complexity electronic devices.

Product Definition & Einstufung

Technische Klassifizierung:

• Für Schichtzahl: Double-Sided PCB / Two Layer PCB

• By Substrate Rigidity: Starre PCB

• Nach Basismaterial: Glass Epoxy (FR-4) Leiterplatte

• By Flammability Rating: UL94 V-0 (inherent to FR-4)

• By Assembly Compatibility: Durchloch-Technologie (Tht) and Surface-Mount Technology (SMT) capable PCB.

This product is a double sided circuit board constructed with copper clad laminate on both sides of an insulating FR-4 core. Electrical connection between layers is achieved via plated through-holes (PTH). Der 1.60mm (etwa 1/16 Zoll) Brettdicke is an industry-standard, offering excellent mechanical stability.

Konstruktion & Materialspezifikationen

Layer Stack-Up:

Das 2 layer rigid PCB structure is as follows (top to bottom):

1. Top Solder Mask (Weiß): Insulating layer to prevent solder bridges.

2. Top Copper Layer (1 oz, ~35µm): Etched to form conductive traces and pads.

3. Insulating Core Substrate (FR-4, Tg150): Provides mechanical support and electrical insulation.

4. Bottom Copper Layer (1 oz, ~35µm): Etched to form bottom-layer circuitry.

5. Bottom Solder Mask (Weiß): Insulating protective layer.

6. Silkscreen Legend (Schwarz): Component designators, logos, and markings.

Key Materials:

• Basislaminat: FR-4 TG150. This denotes a flame-retardant glass-reinforced epoxy laminate with a Glass Transition Temperature (Tg) of 150°C. It offers superior mechanical strength, elektrische Isolierung, and thermal reliability for a rigid printed circuit board, making it the industry’s most cost-effective choice.

• Kupferfolie: Standard 1-ounce (oz) Electro-Deposited copper for optimal conductivity and current carrying capacity.

• Oberflächenbeschaffung: Lead-Free Hot Air Solder Leveling (Bluten). A cost-effective and reliable PCB surface finish that provides excellent solderability, good shelf life, and robust protection against oxidation.

• Inks: High-quality photo-imageable white solder mask ink and durable black epoxy silkscreen ink.

(Image Suggestion: Cross-sectional diagram of the PCB stack-up)
Alt Tag: Detailed cross-sectional diagram of a 2 layer rigid PCB showing copper, FR-4 core, and solder mask layers.

Entwurfsrichtlinien & Funktionsprinzip

Überlegungen zum kritischen Design:

1. Via Design: Maximize the routing space of your double sided PCB-Design by strategically placing Plated Through-Holes (PTHS) for inter-layer connections.

2. Spurenbreite/Abstand: For 1oz copper, a standard minimum trace/space is 6mil/6mil (~0.15mm) to ensure reliable manufacturability and current capacity.

3. Unterlage & Hole Annular Ring: Ensure adequate pad size relative to the drill hole to guarantee a strong connection for Leiterplattenbestückung und Zuverlässigkeit.

4. Lötmaske & Siebdruck: White solder mask aids visual inspection during SMT -Baugruppe, while clear black silkscreen is crucial for PCB -Prototyping and repair.

Funktionsprinzip:

A PCB does not generate function but enables it through its predefined conductive pathways. The etched copper traces replace discrete wiring, providing electrical connections between components. The insulating FR-4 substrate prevents short circuits. Durchlöcher plattiert (PTHS) serve as vertical conduits, connecting the top and bottom PCB copper layers, thereby doubling the available routing area compared to a single-sided board and increasing design flexibility.

Leistungseigenschaften & Vorteile

• Hohe Zuverlässigkeit: Der FR-4 TG150 substrate ensures stable performance in environments below its Tg, offering excellent thermal and mechanical stability for a rigid circuit board.

• Excellent Electrical Properties: Low dielectric constant and dissipation factor support the signal integrity requirements of most digital and analog circuits.

• High Manufacturability: Der 1.6mm standard PCB Dicke Und Bleifreies HASL process are mature, ensuring high yield, cost control, and fast lead times.

• Superior Solderability: The HASL finish offers a flat, wettable surface ideal for both through-hole soldering Und SMT soldering processes.

• Klare Identifikation: High-contrast white solder mask with black legend facilitates efficient Leiterplatte Inspektion, Testen, and rework.

• Environmental Compliance: Lead-Free HASL finish complies with RoHS and other environmental directives.

Standard Manufacturing Process Flow

UGPCB adheres to IPC standards throughout our PCB fabrication process:
Panelization → Drilling → Electroless Copper Deposition → Dry Film Lamination & Imaging → Copper Plating → Etching → Solder Mask Application & Curing → Silkscreen Printing → Surface Finish (Bleifreies HASL) → Profiling/Routing → Electrical Testing (Fliegende Sonde) → Final Automated Optical Inspection (AOI) → Packaging & Shipment.

Primäranwendungen & Anwendungsfälle

This versatile two layer rigid PCB is widely used in industries that demand a balance of reliability and value:

• Industriekontrollen: PLC interfaces, sensor modules, motor drives, HMI controller boards.

• Unterhaltungselektronik: Smart appliance controllers, audio amplifiers, Netzteile, educational kits.

• Telekommunikation: Router/switch peripheral boards, RF antenna modules, network monitoring units.

• Kfz -Elektronik: Infotainment systems, lighting control modules, body control modules (non-safety critical).

• Power Electronics: Smart meter PCBs, UPS control boards, solar inverter circuitry.

• Test & Measurement: Data acquisition cards, instrument control panels, handheld tester boards.

 

Why Choose UGPCB for Your 2-Layer PCB Needs?

Choosing UGPCB means partnering with a reliable Leiterplattenhersteller committed to quality. We specialize in PCB-Prototyp and medium-volume production, implementing rigorous Electrical Testing and IPC-A-600 based inspection on every board. From simple 2 Schichtplatten to complex multi-layer designs, Wir bieten Experten PCB design for manufacturing (DFM) support and a streamlined supply chain.

Contact us today for a competitive quote and swift lead time on your 1.6mm FR-4 2-Layer PCB project!

(Image Suggestion: Gallery of finished PCBs with different designs)
Alt Tag: Gallery of various 2 layer rigid PCB examples manufactured by UGPCB with white solder mask.