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Produktübersicht
UGPCB stellt die vor Robotermotorsteuerungsplatine, a high-reliability double-sided Leiterplatte engineered specifically for robotic motion control systems. This product uses Kingboard KB6160A copper-clad epoxy glass fabric laminate and strictly follows the IPC-4101E/21 specification requirements. The material delivers excellent thermal resistance, mechanische Stärke, und elektrische Leistung. These qualities provide a solid hardware foundation for robotic motor drive and control applications.
Dasrobot motor control circuit board measures 96.83 × 30.6 mm with a 1.6 mm board thickness. It features a double-sided wiring structure (2 Schichten) that meets the space requirements of compact robotic control systems. The product offers a minimum aperture of 0.27 mm, trace width/spacing of 0.32/0.382 mm, and copper foil thickness of 35/35 μm (1 oz copper on both sides). The surface treatment uses OSP (Bio -Lötbarkeitskonservierungsmittel) antioxidant finish. The solder mask comes in blue, and the legend appears in white.
Product Definition and Standards Compliance
DerRobotermotorsteuerungsplatine is a specialized printed circuit board for robotic joint drives, servo motor control, motion control cards, and similar applications. This PCB transmits motor drive signals, distributes power, and executes control logic. It functions as a critical component in the robot’s “Nervensystem.”
This product undergoes manufacturing and design in strict accordance with the following international standards:
- IPC-4101E/21 (Specification for Base Materials for Rigid and Multilayer Printed Boards): The KB6160A laminate meets this specification.
- IPC-6012E (Qualifikations- und Leistungsspezifikation für starre Leiterplatten): This covers qualification and performance requirements for double-sided boards.
- IPC-A-600K (Acceptability of Printed Boards): This serves as the illustrated acceptance standard.
- IPC-4555 (Performance Specification for High Temperature Organic Solderability Preservatives for Printed Boards): This governs the OSP surface finish process.
- UL 94 V-0 (Flammability Standard): This represents the highest flame retardancy rating.
Datenquelle: The standard information above comes from IPC (Verband zur Verbindung der Elektronikindustrie) official standard documents and UL (Underwriters Laboratories) safety standards.
Design -Highlights
Material Selection – The Core Advantages of KB6160A
KB6160A is a conventional FR-4 epoxy glass fabric copper-clad laminate from Kingboard Laminates Holdings. Key performance parameters appear below:
| Eigentum | Test Method (IPC-TM-650) | Spezifikation | Typischer Wert |
|---|---|---|---|
| Glasübergangstemperatur (Tg) | 2.4.25 (DSC) | ≥130℃ | 135℃ |
| Wärmespannung (288℃ Solder Float) | 2.4.13.1 | ≥10 s | ≥180 s |
| CTE (A1) Z-Achse | 2.4.24 (Tma) | - | 58 ppm/℃ |
| CTE (A2) Z-Achse | 2.4.24 (Tma) | - | 286 ppm/℃ |
| Temperaturtemperatur thermische Zersetzung (Td) | 2.4.24.6 (TGA) | - | 305℃ |
| Entflammbarkeit (Flame Rating) | UL 94 | V-0 | V-0 |
| Oberflächenwiderstand | 2.5.17.1 | ≥1.0×10⁴ MΩ | 1.0×10⁶ MΩ |
| Volumenwiderstand | 2.5.17.1 | ≥1.0×10⁶ MΩ·cm | 1.0×10⁸ MΩ·cm |
| Dielektrizitätskonstante (@1 MHz) | 2.5.5.2 | ≤5.4 | 4.58 |
| Dissipationsfaktor (@1 MHz) | 2.5.5.2 | ≤0.035 | 0.022 |
| Copper Peel Strength (125℃) | 2.4.8 | ≥0.70 N/mm | 1.70 N/mm |
| Biegerstärke (Warp) | 2.4.4 | ≥415 N/mm² | 565 N/mm² |
Datenquelle: The data above comes from Kingboard Laminates Holdings official product technical documentation and IPC-TM-650 test method standards.
KB6160A laminate offers these core features:
- UVB blocking and AOI compatibility: The material supports UV light blocking and automatic optical inspection (AOI). This improves PCB production efficiency and accuracy.
- Excellent dimensional stability: Typical warpage values reach only 0.17%/0.35%, well below the IPC standard requirement of ≤1.0%.
- Superior thermal performance: Tg ≥130℃ (typical 135℃) with thermal stress resistance of ≥180 seconds at 288℃ solder float.
- Outstanding mechanical properties: Typical flexural strength reaches 565 N/mm².
Trace Width/Spacing and Aperture Design
This product features a minimum aperture of0.27 mm and trace width/spacing of0.32/0.382 mm. Gemäß IPC-2221, the foundation design standard for all documents in the IPC-2220 series, the conductor current-carrying capacity follows this formula:
I = k × ΔT^0,44 × A^0,725
Where I represents current-carrying capacity (A), k is the correction factor (0.024 für Innenschichten, 0.048 für Außenschichten), ΔT is the temperature rise (℃), and A is the conductor cross-sectional area (mil²). For outer layer conductors at a 10℃ temperature rise, A 0.32 mm trace width (etwa 12.6 Mil) mit 35 μm (1 oz) copper thickness delivers approximately1.2 A current capacity. This design fully supports signal transmission and moderate current drive requirements for robotic motor control applications.
Board Thickness and Layer Stackup
Der 1.6 mm board thickness represents the standard thickness for rigid Leiterplatten. It balances mechanical strength with electrical performance. Der doppelseitig (2-Schicht) wiring structure enables effective power and signal layer partitioning within a limited space. This meets the functional partition principles of robotic motor control circuits, clearly separating motor drive, main controller, sensor interface, and power management modules.
Funktionsprinzip
DerRobotermotorsteuerungsplatine functions as the “neuronales Zentrum” within robotic systems. Its operating principle can be understood through several layers:
Signalübertragung: Copper traces on the PCB form electrical networks that precisely transmit control signals from the main MCU (microcontroller) to motor driver chips such as gate drivers and pre-drivers. Der 0.32 mm trace width ensures signal integrity. Der 0.27 mm minimum aperture supports high-density component packages including QFN and BGA.
Power Drive: Doppelseitig 1 oz (35 μm) copper provides ample current-carrying capacity for transient high currents required by motor drives. High-power components are placed near board edges to facilitate heat dissipation.
Elektromagnetische Kompatibilität (EMC): Proper grounding design and routing strategies effectively suppress electromagnetic interference (EMI) generated during motor commutation. This ensures clean control signals throughout the system.
Product Applications
Dasrobot motor control circuit board serves the following applications:
- Industrial robot joint drive control: Servo motor control for multi-axis robotic arms
- Service robot motion control: Chassis drive and wheel speed feedback for delivery robots and guide robots
- Educational robot platforms: Control boards for teaching and laboratory robotics
- UAV flight control systems: Motor speed regulation and control
- Smart home automation: Motor drive control for electric curtains and smart locks
- Office automation equipment: Motor control for printers and copiers
- Communications equipment: Cooling fan motor control for base stations and switches
Produktklassifizierung
This product can be scientifically classified across multiple dimensions according to international printed circuit board standards:
| Classification Dimension | Kategorie | Governing Standard |
|---|---|---|
| Base Material Type | Rigid FR-4 Printed Board | IPC-4101E/21 |
| Conductive Layer Count | Doppelseitiges Brett (2-Schicht) | IPC-6012E |
| Via Type | Plated-Through Hole (PTH) Doppelseitiges Brett | IPC-6012E |
| Flammenhemmung | UL 94 V-0 Rated | UL 94 |
| Oberflächenbeschaffung | OSP (Bio -Lötbarkeitskonservierungsmittel) | IPC-4555 |
| Application Domain | Robotics/Industrial Control PCB | - |
Datenquelle: Classification standards are based on IPC-4101E, IPC-6012E, IPC-4555, und UL 94 international specifications.
Materialien verwendet
Base Material – KB6160A Copper-Clad Epoxy Glass Fabric Laminate
KB6160A belongs to theFR-4 epoxy glass fabric copper-clad laminate family. Its material composition includes:
- Reinforcement: Electronic grade E-glass fabric
- Binder: Flame-retardant epoxy resin
- Kupferfolie: Electro-deposited (Ed) Kupfer, 35 μm (1 oz) Dicke
- Flame Retardant System: UL 94 V-0 compliant flame retardant additives
Surface Finish – OSP (Bio -Lötbarkeitskonservierungsmittel)
OSP is a thin organic coating applied to bare copper surfaces. It prevents copper oxidation and preserves solderability. According to IPC-4555, the shelf life of OSP coatings isa minimum of six months.
Advantages of OSP surface finish:
- Cost-effective: More economical than ENIG (Elektrololes Nickel -Eintauchgold) or HASL (Heißluftlötes Leveling)
- Environmentally friendly: Fully compatible with lead-free soldering processes
- Good solderability: Suitable for products with short to medium lifecycles or benign environments
Solder Mask and Legend
- Lötmaske: Blue ink providing insulation protection and preventing solder bridging
- Legende: White ink for component identification and assembly guidance
Performance Parameters Summary
| Parameter | Spezifikation |
|---|---|
| Laminattyp | KB6160A (Kingboard FR-4) |
| Brettdicke | 1.6 mm |
| Schichtzahl | 2 Schichten (Doppelseitig) |
| Brettgröße | 96.83 × 30.6 mm |
| Minimale Blende | 0.27 mm |
| Mindestspurenbreite | 0.32 mm |
| Minimum Trace Spacing | 0.382 mm |
| Dicke der Kupferfolie | 35/35 μm (1 oz both sides) |
| Oberflächenbeschaffung | OSP Antioxidant |
| Farbe der Lötmaske | Blau |
| Legend Color | Weiß |
| Tg (Glasübergangstemperatur) | ≥130℃ (Typical 135℃) |
| Flame Rating | UL 94 V-0 |
| Wärmespannung (288℃) | ≥10 s (Typical ≥180 s) |
Strukturelle Merkmale
- Double-sided routing: Both top and bottom layers carry circuits, effectively increasing routing density
- Plated-through hole (PTH) Design: Enables electrical interconnection between layers
- OSP surface protection: Copper surface oxidation protection ensures soldering reliability
- Blue solder mask with white legend: Clear visual contrast facilitates assembly and inspection
- 1.6 mm standard board thickness: Balances mechanical strength with standardized manufacturing
Herstellungsprozess
UGPCB manufactures theRobotermotorsteuerungsplatine through this standardized process flow:
- Material cutting: Large KB6160A copper-clad panels are cut to production panel sizes
- Bohren: CNC numerical control drilling achieves the 0.27 mm minimum aperture
- Electroless copper/panel plating: Chemical copper deposition followed by panel electroplating for hole metallization
- Outer layer pattern transfer: Lamination → exposure → development creates the circuit pattern
- Pattern plating: Copper and tin-lead resist are electroplated onto the circuit pattern
- Radierung: Exposed copper foil is removed to form the final circuits
- Tin stripping: The tin-lead resist is removed
- OSP surface treatment: OSP organic solderability preservative is applied per IPC-4555
- Solder mask printing: Blue solder mask ink is applied, exposed, and developed
- Legend printing: White identification characters are screen-printed
- Profile routing: CNC routing forms the final 96.83 × 30.6 mm dimensions
- Electrical testing: Flying probe or universal testing verifies open/short conditions
- Final inspection: Visual and dimensional inspection per IPC-A-600K
- Packaging and shipping: Vacuum packaging with moisture barrier
Anwendungsszenarien
Szenario 1: Industrial Robot Servo Drive Control
In six-axis industrial robots, DasLeiterplatte serves as the servo driver control board. It receives motion commands from the host computer. PWM control signals travel through 0.32 mm traces to IGBT or MOSFET driver stages, achieving precise torque and speed control of servo motors.
Szenario 2: Service Robot Chassis Drive
In delivery robots and AGVs (Automated Guided Vehicles), DasLeiterplatte functions as the core for dual-motor independent drive control. It independently controls left and right drive wheel speeds and steering, enabling straight-line travel and in-place rotation.
Szenario 3: Educational Robot Development Platforms
In university robotics laboratories and maker spaces, Dasrobot motor control PCB serves as the core board for robotic control systems. It supports student development and verification of motor drive algorithms including FOC (Field-Oriented Control) and PID speed regulation.
Szenario 4: UAV Motor Speed Control
In quadcopters, this PCB can function as the ESC (Electronic Speed Controller) control board. It converts flight controller commands into motor drive signals, achieving high-speed response control of brushless motors.
Why Choose UGPCB’s Robot Motor Control PCB?
- Full international standards compliance: Products are designed and manufactured per IPC-4101E/21, IPC-6012E, IPC-A-600K, IPC-4555, und UL 94 V-0
- Premium material assurance: Kingboard KB6160A FR-4 laminate with Tg ≥130℃, UL 94 V-0 Flammenbewertung, and ≥180 seconds thermal stress resistance
- High-precision manufacturing: 0.27 mm minimum aperture and 0.32 mm minimum trace width meet high-density routing requirements
- One-stop service: Full-chain support from PCB design optimization and component sourcing to SMT/DIP assembly and functional testing
- 10+ jahrelange Erfahrung in der Branche: Serving over 3,000 enterprise customers globally
UGPCB is a world-leading provider of PCB design, Herstellung, und PCBA -Assemblerdienste. Gegründet in 2014, the company is committed to providing high-precision and highly reliable PCB solutions for customers worldwide.
Get a Quote and Samples Today
UGPCB supports yourRobotermotorsteuerungsplatine project with:
- ✅ Free DFM (Design für die Fertigung) reports
- ✅ Rapid prototyping with 24-Stunde delivery available
- ✅ Volume production with 20%+ above-industry-average yield rates
- ✅ Professional engineering team providing technical support
📧Contact us for a free quote: Visit the UGPCB website to submit your Gerber files and BOM. Receive an industry-leading automated quote.
📞Hotline: Reach us through our website’s online chat or email.
Data Source Declaration
All technical data and standard information cited in this article come from the following authoritative sources:
- Kingboard Laminates Holdings Ltd. — KB-6160A product technical documentation (KB Technical Information)
- IPC (Verband zur Verbindung der Elektronikindustrie) — IPC-4101E/21 Specification for Base Materials for Rigid and Multilayer Printed Boards, IPC-6012E Qualification and Performance Specification for Rigid Printed Boards, IPC-A-600K Acceptability of Printed Boards, IPC-4555 Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards, IPC-TM-650 Test Methods Manual, IPC-2221 Generic Standard on Printed Board Design
- UL (Underwriters Laboratories) — UL 94 Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances
- PCBWay Material Database — KB-6160/6160A/6160C technical parameters
- OSHPark Technical Documentation — KB6160A substrate specification sheet
Haftungsausschluss: Typical values above are laboratory test data provided for reference only. Actual product performance may vary depending on manufacturing processes and application environments.
