6 Layer Rigid-Flex PCB Manufacturing | High-Reliability Adhesive-Free Design – UGPCB

UGPCB 6-Layer Adhesive-Free Rigid-Flex PCB Descripción general del producto & Definición

A 6-Layer Rigid-Flex PCB is an advanced placa de circuito impreso technology that integrally combines rigid board stability with flexible circuit dynamic bending capability. This product from UGPCB utilizes a premium adhesive-free lamination proceso, resulting in a final board thickness of 1.50milímetros, dimensions of 120x80mm, and features an ACEPTAR (Oro de inmersión de níquel químico, 3metro”) acabado superficial. It represents a cutting-edge solution for Interconexión de alta densidad (IDH) and three-dimensional electronic packaging, solving complex spatial and mechanical challenges in modern electronics.

Scientific Product Classification

According to IPC-6013D standards and product construction, this board is accurately classified as:

• By Construction: Rigid-Flex Printed Board (Tipo 4)

• Por recuento de capas: Six-Layer Board (combining rigid and flexible layers)

• By Technology: Adhesive-less (Adhesive-Free) Flexible Material Rigid-Flex PCB

• Por aplicación: High-Reliability, High-Flex-Cycle Industrial & Medical Grade PCB

Core Structure & Materiales

The exceptional performance is rooted in its sophisticated layered structure and top-tier materials:

• Core Flex Material: Características Shengyi’s 18/50/18 μm adhesive-free double-sided substrate. “18/50/18” denotes a structure of 1 onz (18μm) cobre / 50μm Polyimide (PI) dielectric / 1 onz (18μm) cobre. El adhesive-free construction bonds copper to PI chemically, eliminating adhesive layers, which significantly enhances thermal resistance, chemical resistance, y flex circuit fiabilidad.

• Rigid Section Material: Uses 25/25 preparar for lamination in rigid areas, providing robust mechanical support.

• Acabado superficial: The entire board employs ACEPTAR (3metro”). This 3-microinch gold layer offers excellent flatness, oxidation resistance, and solderability for PCB pads, making it ideal for assembling fine-pitch components like BGAs.

Design Key Considerations & Principio de trabajo

Rigid-flex PCB design is critical for success. The board operates by routing electrical signals through flexible polyimide areas for dynamic movement, while using rigid FR-4 sections for component mounting and structural support.

Essential Design Guidelines Include:

1. Bend Area Definition: Clearly distinguish between static (one-time install) y dynamic (repeated operation) bend zones. Design the bend radius accordingly. A dynamic bend radius should be at least 10x the flex area thickness (for this board, ≥15mm is recommended).

2. Transition Zone Reinforcement: The rigid-to-flex junction is a stress point. Use teardrop pads, curved traces, y stiffeners to prevent delamination and cracking.

3. Control de impedancia: For high-speed signals (p.ej., differential pairs) crossing flex areas, precisely calculate trace width and dielectric thickness to maintain consistent impedancia característica (p.ej., 50Ω single-ended, 100Ω differential).

4. Flex Routing Rules: In flexible areas, route conductors perpendicular to the bend axis. Use curved or staggered traces to distribute stress evenly.

Características de rendimiento & Ventajas

Compared to traditional adhesive-based rigid-flex PCBs or rigid-board+connector assemblies, this UGPCB product offers distinct PCB advantages:

• Confiabilidad mejorada: The adhesive-free structure prevents delamination risks from adhesive aging or moisture absorption, increasing flex life by up to 10x and withstands over 100,000 dynamic bend cycles.

• Superior Electrical Performance: Uniform PI dielectric with stable dielectric constant (Dk~3.4) ensures signal integrity for high-frequency applications and reduces loss.

• Lightweight & Alta densidad: Eliminates connectors, cables, and solder joints, enabling 3D assembly. Can reduce system weight by up to 60% and save over 50% espacio.

• Excellent Durability: Resists extreme temperatures (-55°C to +125°C) and chemical exposure, adecuado para entornos hostiles.

• Simplified Assembly: A single integrated component reduces assembly steps, potential failure points, and improves final product yield.

Production Process Overview

UGPCB rigid-flex PCB manufacturing combines advanced rigid PCB fabrication y flexible circuit production procesos:

1. Inner Layer Fabrication: Separate etching of rigid FR-4 and flexible PI core layers.

2. Laminación: Precise alignment and high-temperature/pressure bonding of rigid layers, adhesive-free flex cores, and prepreg into a monolithic structure—a critical step in PCB multicapa tratamiento.

3. Perforación & Enchapado: Mechanical and laser drilling (if needed) followed by copper deposition and plating to create Agujeros pasantes chapados (PTH) for interlayer connection.

4. Outer Layer Imaging & Aguafuerte: Pattern formation for outer layer circuits.

5. Surface Finish Application: ENIG chemical deposition.

6. Coverlay & Profiling: Application of protective film (coverlay) on flex areas. Precise enrutamiento y laser cutting define the board outline and flex section openings.

7. Prueba eléctrica & Inspección final: 100% sonda voladora or fixture testing for electrical continuity, followed by rigorous visual and dimensional inspection.

Aplicaciones primarias & Casos de uso

Este 6-layer high-reliability PCB is the ideal choice for demanding applications:

• Aeroespacial & Defense: Satellite deployment mechanisms, guidance systems, avionics sensors requiring utmost reliability and weight reduction.

• Advanced Medical Devices: Endoscopes, ultrasound probes, wearable monitors needing complex motion and signal transmission in minimal space.

• Industrial Robotics: Robot joints, internal robotic arm assemblies for seamless power/signal transmission across moving parts.

• Precision Instruments & Electrónica de Consumo: Advanced camera modules, foldable display hinges, drone gimbals pursuing slimness and durability.

• Electrónica automotriz: Automated parking sensors, foldable dash displays, in-vehicle camera modules resistant to vibration and thermal cycling.

Ready to integrate superior reliability into your design? Contact UGPCB engineers today for a free design review and quote on your custom 6-Layer Rigid-Flex PCB solution.