Capacités de fabrication de PCB standard

Precision Circuit Imaging & Etching Technology

UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:

• Imagerie directe laser (ILD) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
• Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
• Expertise in handling various copper thicknesses (1oz-6oz) with minimized side-etching

High-Precision Drilling & Hole Metallization

Our drilling capabilities cover:

• Mechanical drilling for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
• Forage laser down to 0.1mm microvias
• Hole metallization réalisation >20μm uniform copper plating through advanced chemical deposition and electroplating
• Special processes for 8:1 à 10:1 aspect ratio requirements

Multilayer Lamination & Interlayer Alignment

• Up to 100-layer PCB fabrication using FR-4 Grade A materials
• Precision lamination with ±0.05mm layer-to-layer alignment
• Temperature/pressure/time-controlled processes preventing delamination
• Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm

Masque de soudure & Surface Finish Options

• Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
• Finitions de surface:
  1. HASL (Nivellement de la soudure à air chaud)
  2. ACCEPTER (Electroless Nickel Immersion Gold)
  3. Immersion Tin/Silver
  4. OSP (Conservateur de soudabilité organique)

Comprehensive QC & Testing Systems

• Inspection AOI: High-resolution defect detection for line/space, coussinets, shorts/opens
• Contrôle de l'impédance: ±10% tolerance for high-speed/RF applications
• Tests électriques: Sonde volante & fixture-based continuity verification
• Reliability Testing: Choc thermique, humidity resistance, flexural testing

Process Capability & Stabilité

• Cpk >1.33 (4un) across critical processes, reaching 1.67 (5un) in key areas
• Line width control within ±15% (vs industry 20% standard)
• Statistical process control (CPS) ensuring consistent production quality

PCBA One-Stop Services

• Assemblage SMT: 01005 component handling with ±0.03mm placement accuracy
• Emballage avancé: BGA/Micro BGA/PoP support with X-ray inspection
• DFM Support: Impedance calculation, stack-up design, manufacturability analysis

Applications de l'industrie & Contact

Serving consumer electronics, industrial controls, télécommunications, dispositifs médicaux, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.