PCB HDI (2+N+2) Caractéristiques
Advanced BGA Capabilities
- For BGAs with smaller ball pitch and higher I/O count
High Routing Density
- Increase routing density in complex designs
Capacité de feuille
- Capacité de feuille (Further details may be needed to elaborate on this feature)
Superior Signal Transmission
- Lower Dk/Df material for better signal transmission performance
Enhanced Connectivity
- Copper filled vias
Applications
Electronique grand public
- Téléphones portables
- PDA (Personal Digital Assistants)
- UMPCS (Ultra-Mobile Personal Computers)
- Portable game consoles
- Digital cameras
- Caméscopes