Présentation du produit
L'UGPCB présente le 6‑layer 2+N+2 HDI PCB (Modèle: 6L 2+N+2 HDI PCB). This high‑density interconnect circuit imprimé is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, et 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, optical modules, et applications similaires.
Dans le PCB industrie, IDH (Interconnexion à haute densité) technology is the core enabler for shrinking component pitches and rising signal speeds. Le 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, Intégrité du signal, et coût de fabrication.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theIPC‑2226 standard and is classified asType III within that system.
Breaking down the term:
- Le first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, c'est-à-dire, two inner core layers).
- Le second “2” means two sequential build‑up layers below the core.
Ainsi, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
HDI Classification per IPC‑2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| HDI Type | Structure | Build‑up Layers (per side) | Minimum BGA Pitch | Applications typiques |
|---|---|---|---|---|
| Type I | 1+N + 1 | 1 couche | 0.5mm | Smartphones, mid‑density designs |
| Type II/III | 2+N+2 | 2 couches | 0.4mm | Équipement réseau, high‑performance computing |
| Type III / Élic | 3+N+3 and above | 3+ couches | 0.3mm and below | Flagship smartphones, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered configurations.
Spécifications techniques de base
| Paramètre | Spécification |
|---|---|
| Modèle | 6L 2+N+2 HDI PCB |
| Matériel | ITEQ IT150 |
| Nombre de couches | 6 couches (2+N+2 second‑order HDI) |
| Couleur du masque de soudure | Black or White (facultatif) |
| Épaisseur du panneau fini | 1.0mm |
| Épaisseur de cuivre de la couche intérieure | 1 once (~35μm) |
| Épaisseur de cuivre de la couche externe | 0.5 once (~17.5μm) |
| Trace minimale / Espacement | 2.5mil / 2.5mil (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2mm |
| Minimum Laser Drill | 0.1mm |
| Finition de surface | Immersion Or + OSP |
| Demande principale | Équipement de communication |
Material Deep Dive: ITEQ IT150
Material Positioning
ITEQ IT150 is a medium‑Tg, halogen‑free, multifunctional epoxy stratifié. It sits between standard FR‑4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (Tg >150° C par DSC), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, stockage, and networking applications.
Paramètres de performance clés
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| Propriété | Méthode d'essai | Valeur typique | Unité |
|---|---|---|---|
| Température de transition du verre (Tg) | DSC (IPC‑2.4.25) | 155 | ° C |
| Température de décomposition (Td, 5% perte de poids) | TGA (IPC‑2.4.24.6) | 365 | ° C |
| CTE sur l'axe Z (a1, below Tg) | IPC‑2.4.24 | 35–40 | ppm/°C |
| CTE sur l'axe Z (a2, above Tg) | IPC‑2.4.24 | 220–240 | ppm/°C |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | ppm/°C |
| Constante diélectrique (Ne sait pas) @ 1GHz | IPC‑2.5.5.13 | 4.2–4,5 | - |
| Facteur de dissipation (Df) @ 1GHz | IPC‑2.5.5.13 | 0.010–0.018 | - |
| T288 Thermal Stress | IPC‑TM‑650 | >60 | Minutes |
| Absorption d'humidité | IPC‑2.6.2.1 | 0.12 | % |
| Cote d'inflammabilité | UL94 | V‑0 | Notation |
| UL MOT (Max Operating Temp) | - | 130 | ° C |
Avantages matériels
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155° C. Under lead‑free reflow peaks of260° C, this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. Excellente résistance au CAF
FAC (Filament anodique conducteur) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18L / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (CL) et du brome (Br) content are each below 0.09% en poids. Total Cl+Br is below 0.15% (1500ppm).
Directives de conception
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2mm), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1mm) and fill with copper.
- Circuits de couche externe – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
Cetwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
Ce produit réalise 2.5mille / 2,5mil (~63.5μm/63.5μm) largeur et espacement des traces. This exceeds the Conception HDI Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4mm pas BGA breakout with ample routing channels.
- Flexible signal routing for high‑density composant placement.
- Reduced layer count, which lowers overall PCB cost.
Technologie microvia
Ce produit utilise unhybrid drilling approach:
- Forage mécanique – Minimum diameter 0.2mm, used for through‑holes and buried vias in the core.
- Forage laser – Minimum diameter 0.1mm (4mil) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingvia‑in‑pad designs for fine‑pitch BGAs.
Principe de fonctionnement
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by forage mécanique + placage, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by perçage au laser + placage, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
Cestepped interconnect structure shortens signal paths and reduces parasitic via effects. Par conséquent, it preserves high‑speed signal integrity.
Avantages en termes de performances
Fiabilité thermique
ITEQ IT150’sTd (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 minutes without delamination. This ensures material integrity through multiple reflow cycles.
Intégrité du signal
À 1 GHz, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
Résistance mécanique
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
Classement du produit
This product is classified across multiple dimensions:
| Classification System | Catégorie |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+N+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | PCB rigide |
| Nombre de couches | 6panneau multicouche à plusieurs couches |
| Material System | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| Finition de surface | Immersion Or + OSP hybrid finish |
| Domaine d'application | Communication‑grade PCB |
Flux de processus de fabrication
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
Étape 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
Étape 2: First Build‑Up
Laminage (cœur + préampe + feuille de cuivre) → First lamination → First‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
Étape 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
Étape 4: Outer Layer and Finishing
Forage mécanique (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5mille / 2,5mil) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
Scénarios d'application
This product is primarily designed foréquipement de communication:
5G infrastructure de communication
- 5Bornes de base G (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- Émetteurs-récepteurs optiques.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA routage. It enables complex signal interconnects within limited board space.
Pourquoi choisir UGPCB?
UGPCB brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows IPC‑6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment Fabrication de PCB.
Demandez un devis aujourd'hui
Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
Déclaration de source de données
The technical data cited in this document comes from the following authoritative standards and sources:
- IPC‑2226 - Sectional Design Standard for High Density Interconnect (IDH) Cartes imprimées
- IPC‑6012E/F - Qualification et spécifications de performances pour les cartes imprimées rigides
- IPC/JPCA‑2315 - Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- IPC‑TM‑650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, et d'autres)
- JPCA‑ES‑01‑2003 - Halogen‑Free Copper‑Clad Laminate Standard
- UL94 - Norme de sécurité d'inflammabilité des matériaux plastiques pour les pièces des dispositifs et appareils
