4-Fabricant de cartes de substrat DDR en couches | Matériau HL832 haute vitesse | UGPCB

Lead the High-Speed Era: UGPCB’s 4-Layer DDR Substrate Board – The Superior Interconnect Solution for Your Core ICs

In the booming landscape of high-performance computing, intelligence artificielle, and next-generation communication devices, every advancement in Double Data Rate (DDR) technology places stricter demands on PCB substrates. Leveraging deep expertise in high-end PCB manufacturing et Substrat IC solutions, UGPCB introduces its premium 4-Layer DDR Substrate Board. Engineered with cutting-edge materials, it is specifically designed to carry high-performance memory chips (par ex., DDR4, DDR5, LPDDR), serving as your reliable partner in the pursuit of ultimate speed and stability.

Présentation du produit & Définition

UN 4-Layer DDR Substrate Board is a High-Density Interconnect (IDH) printed circuit board designed for packaging and connecting Dynamic Random-Access Memory (DDR) puces. It acts as a critical bridge between the chip and the mainboard, responsible for transmitting high-speed signals, distributing power, and providing stable mechanical support. Unlike standard PCB boards, DDR substrates demand near-perfect signal integrity, gestion thermique, and dimensional accuracy. This product from UGPCB is tailor-made to meet these stringent requirements.

Critical Design Considerations

1. Precise Impedance Control: Paramount for DDR PCB design, it minimizes signal reflection and distortion during high-speed data transmission.

2. Intégrité de puissance (PI): Dedicated power and ground plane design ensures clean, stable power delivery, reducing noise interference on critical signals.

   1. Intégrité du signal (ET): Optimized routing using microstrip and stripline structures minimizes crosstalk and delay, forming the foundation for stable performance post-Assemblage PCBA.

3. Gestion thermique: The substrate material must exhibit excellent thermal properties to aid chip dissipation and ensure long-term reliability.

How It Works

The 4-Layer DDR Substrate connects the hundreds of micro-pins of a memory chip to the corresponding motherboard circuits via its precise internal layers. C'est “sandwich” stack-up (Signal-Ground-Power-Signal) provides clear return paths for high-speed signals, effectively suppressing Electromagnetic Interference (EMI). The soft gold surface finish ensures a reliable, low-resistance solder joint with the chip’s solder balls (par ex., in BGA packages).

Applications principales & Classification

• Applications principales: Extensively used in servers, data center switches, high-end GPUs, AI accelerator cards, network storage devices, and any cutting-edge electronic product requiring high-speed, high-capacity memory.

• Classification:

  • Par nombre de couches: Beyond standard 4-layer, designs can extend to 6, 8, or more layers based on complexity.

  • Par matériau: Can be categorized into standard FR-4, Mid-Loss, and this product’s focus – Low-Loss material substrates.

Matériels & Spécifications de performance

Product Structure & Caractéristiques clés

• Structure: Typical 4-layer sequential lamination: Couche supérieure (Signal/Components) -> Inner Layer 1 (Solid Ground Plane) -> Inner Layer 2 (Solid Power Plane) -> Couche inférieure (Signal/Components). This structure offers optimal shielding for high-speed signals.

• Caractéristiques clés:

  • Superior High-Speed Performance: HL832 low-loss material ensures excellent signal integrity for high-frequency DDR signals.

  • High-Density Interconnect Capability: 100μm micro-vias and 50μm line width technology support advanced chip packaging.

  • Haute fiabilité: ENIG surface finish offers excellent solderability and oxidation resistance for long-term stability.

  • Ultra-Thin & Precise: 0.25mm overall thickness meets stringent space requirements in modern electronics.

Precision Manufacturing Process

Notre Fabrication de PCB process adheres to the highest quality standards:
Material Prep → Inner Layer Imaging & Etching → Lamination & Drilling → Metallization & Plating → Outer Layer Imaging → Surface Finish (ACCEPTER) → Solder Mask Application → Profiling → Electrical Test & Inspection finale.
Each stage is supported by advanced inspection equipment (par ex., Zone d'intérêt, Test de sonde volante), ensuring every Substrat IC delivered is flawless.

Cas d'utilisation typiques

This 4-Layer DDR Substrate is the ideal choice for:

• Data Centers & Serveurs: Carrying CPU and memory modules for massive data processing.

• IA & Machine Learning Hardware: Memory subsystems in GPU, NPU accelerator cards.

• High-End Communication Equipment: High-speed memory units in 5G base stations and core network gear.

• Flagship Consumer Electronics: Main memory substrates in top-tier gaming consoles and laptops.

Why Choose UGPCB’s 4-Layer DDR Substrate?

We are more than a Fabricant de PCB; we are your solution provider for high-speed design challenges. With a dedicated PCB design support team, proven capabilities in multilayer PCB prototyping and mass production, and a deep understanding of signal integrity engineering, choosing UGPCB means gaining not just a high-quality substrate, but an accelerator for your product’s success.

Contact our expert team today for a project-specific quote and technical consultation. Power up your high-speed design with UGPCB!