62-layer ATE load PCB board

Overview of the 62-Layer ATE Load PCB

The 62-Layer ATE Load PCB is a high-performance, ultra-high-density circuit imprimé engineered for Automated Test Equipment (ATE) systèmes. Designed to handle complex signal routing and high-power loads, it meets rigorous testing requirements in semiconductor manufacturing and advanced electronics validation.

Key Definition

An ATE Load PCB is a specialized circuit board that simulates real-world operating conditions for testing integrated circuits (ICS) et electronic components. The 62-layer configuration supports intricate signal paths, power distribution, and thermal management in compact designs.

Critical Design Parameters

• Nombre de couches: 62 layers for multi-domain signal isolation and power plane optimization.

• Dimensions: 16.9″ × 22.9″ (large format for multi-device integration).

• Épaisseur: 250 mil (balances rigidity and thermal dissipation).

• Matériel: FR4 HTg (high-temperature glass epoxy for stability up to 180°C).

• Minimum Hole Size: 8 mil (supports high-density interconnects).

• BGA Pitch: 0.65mm (enables fine-pitch component mounting).

• Aspect Ratio: 32:1 (ensures reliable plating in microvias).

• Drill-to-Copper: 7 mil (prevents short circuits).

• POFV & Back-Drilling: Eliminates signal distortion in high-frequency applications.

• Finition de surface: ENEG (Electroless Nickel Electroless Gold for corrosion resistance).

Core Functionality

Le PCB routes test signals between ATE systems and devices under test (DUTs), ensuring accurate voltage/current measurements. Back-drilling removes unused via stubs to minimize signal reflections, while POFV (Plated Over Filled Vias) enhances thermal conductivity and structural integrity.

Primary Applications

• Semiconductor Testing: Validates ICs, Processeurs, and memory modules.

• Aérospatial & Defense: Mission-critical avionics and radar systems.

• Telecom Infrastructure: High-speed data transmission equipment.

• Dispositifs médicaux: Precision diagnostic and imaging tools.

Material Advantages

FR4 HTg provides:

• Thermal Resilience: Stable performance under cyclic thermal stress.

• Faible perte diélectrique: Critical for high-frequency signal integrity.

• Mechanical Strength: Resists warping during multilayer lamination.

Caractéristiques structurelles

• Hybrid Stackup: Combines high-speed, pouvoir, and ground layers.

• Microvia Technology: Laser-drilled microvias (8 mil) enable dense interlayer connections.

• Controlled Impedance Traces: Minimizes crosstalk in 0.65mm BGA layouts.

Performance Highlights

• Signal Integrity: <3% insertion loss at 10 GHz.

• Power Handling: Supports 20A per power plane.

• Gestion thermique: 1.2 W/mK thermal conductivity via POFV.

Manufacturing Workflow

1. Material Prep: Cut FR4 HTg cores and prepreg sheets.

2. Forage au laser: Create 8-mil microvias with ±1 mil tolerance.

3. Placage & POFV: Electroplate vias and fill with conductive epoxy.

4. Back-Drilling: Remove excess via stubs using depth-controlled drills.

5. Laminage: Press 62 layers under high temperature/pressure.

6. Finition de surface: Apply ENEG for solderability and oxidation resistance.

7. Essai: Validate impedance, continuity, and thermal cycling.

Ideal Use Cases

• High-Frequency ATE Systems: Tests 5G RF components and millimeter-wave devices.

• Multi-Site Testing: Parallel validation of 16+ DUTs on a single board.

• Environnements durs: Oil/gas exploration sensors and automotive ECU testing.