1.6mm High-Thermal FR-4 Aluminum Base PCB | Single-Side ENIG 2u” | LED Heat Sink Board – UGPCB

High-Thermal FR-4 Single-Side Aluminum Base PCB Product Overview & Définition

In today’s high-power, high-density electronic devices, le thermal management capability of a Circuit imprimé (PCB) is critical for product reliability and longevity. UGPCB 1.6mm Single-Side Aluminum Base PCB (1 Layer Aluminum Core PCB) is an innovative solution that combines a high-Tg FR-4 laminate with an integrated thermal management structure. This design achieves an optimal balance between the excellent electrical properties of FR-4, rentabilité, and heat dissipation performance comparable to dedicated PCB de noyau métallique (MCPCBs). Ce Thermal Management PCB is specifically engineered to solve cooling challenges in applications like LED lighting and power conversion modules.

Spécifications de base & Technical Classification

• Nombre de couches: 1 Couche (Single-Sided PCB)

• Épaisseur du panneau: 1.6mm (Standard, robust)

• Base Laminate Material: FR-4, Température de transition du verre (Tg) ≥ 150°C (High Tg FR-4 PCB)

• Thermal Structure: Integrated Aluminum Base Layer/Block (Metal Core PCB)

• Finition de surface: Or par immersion au nickel autocatalytique (ACCEPTER), 2 micro-inches Gold Thickness (approx. 0.05µm)

• Legend/Silkscreen: White LPI Solder Mask, Black Text (High contrast for clear identification)

Scientific Classification:

1. Par nombre de couches: Single-Sided Board.

2. By Substrate Type: Rigid Composite Metal Core Printed Circuit Board.

3. By Thermal Performance: High Thermal Conductivity PCB.

4. By Primary Application: High-Power LED Heat Sink Board, Power Supply Cooling Board.

Directives de conception & Principe de fonctionnement

Key Design Considerations:

1. Heat Source Placement: High-heat-dissipation components (par ex., LED chips, power MOSFETs) should be placed on pads directly connected to or in close proximity to the aluminum base thermal pad area to ensure the shortest thermal path.

2. Electrical Isolation: Although it features a metal base, electrical isolation between the circuit and the metal core is maintained through the FR-4 dielectric layer et un thermally conductive insulating layer. Design must ensure the required insulation withstand voltage (typiquement >2kv) is met.

3. Copper Weight Selection: Choose appropriate copper foil thickness (standard 1oz/2oz) based on current-carrying requirements. Widen traces or use copper pours for high-current paths.

4. ENIG Finish Advantage: Le 2toi” ENIG surface finish provides excellent flatness and solderability, ideal for fine-pitch SMT components and connectors subject to repeated mating cycles.

Principe de fonctionnement:

The core functionality of this Carte PCB is to utilize the high thermal conductivity of aluminum (approx. 200 W / m · k) to rapidly absorb and spread heat generated by components on the circuit layer. The heat is then dissipated into the environment via the chassis or an external heatsink attached to the board. The structure acts as a “thermal highway,” conducting heat from localized hotspots across the entire metal base area, significantly lowering junction temperatures and enhancing system stability.

Matériels, Construction & Caractéristiques clés

Matériaux utilisés:

• Couche de circuits: Electro-Deposited (Élégant) Feuille de cuivre

• Dielectric/Insulating Layer: High-Tg FR-4 Epoxy Glass Laminate (Tg 150)

• Thermal Core Layer: Aluminum Alloy Plate (Typiquement 5052 ou 6061)

• Finition de surface: Or par immersion au nickel autocatalytique (C'est soit/ou)

• Legend Ink: High-Temperature Resistant White LPI Solder Mask, Black Legend Ink

Board Construction:

The stack-up, from top to bottom, est: White Solder Mask Layer (with Black Legend) -> 2u” ENIG Pads/Traces Layer -> FR-4 Dielectric Insulation Layer -> Aluminum Metal Substrate. Ce “sandwich” construction ensures optimal electrical performance alongside superior thermal management.

Core Performance & Caractéristiques:

1. Superior Heat Dissipation: Integrated aluminum core provides thermal conductivity far exceeding standard FR-4 PCB boards, effectively reducing component operating temperatures by 20%-40%.

2. Haute fiabilité: Le FR-4 TG150 material offers enhanced thermal endurance, maintaining mechanical stability in high-temperature environments and minimizing solder joint fatigue from CTE mismatch.

3. Excellente soudabilité: Le Or par immersion au nickel autocatalytique (ACCEPTER) finish provides a flat, oxidation-resistant, and highly solderable surface, adapté aux composants à pas fin.

4. Mechanical Robustness: The 1.6mm overall thickness combined with the metal core results in a Carte PCB with higher mechanical strength, resisting bending and vibration.

5. Clear Identification: The white-on-black legend printing offers excellent readability during assembly and servicing.

6. Cost-Effective Solution: Compared to full ceramic substrates or high-end pure aluminum PCBs, this solution provides superior thermal performance while maintaining a competitive Fabrication de PCB coût.

Processus de fabrication & Key Techniques

UGPCB strictly adheres to Normes IPC. The core manufacturing workflow is as follows:

1. Panelization & Prep: Cutting the FR-4 and aluminum core laminate material.

2. Imagerie & Pattern Transfer: Transferring the circuit pattern onto the copper layer via photolithography.

3. Gravure: Forming precise copper traces.

4. Forage (if required): For mounting holes or thermal vias.

5. Masque de soudure & Legend Application: Coating with white LPI solder mask, followed by exposure, développement, and printing of black legend.

6. Finition de surface: Applying a precisely controlled Electroless Nickel Immersion Gold process to create nickel and gold layers on exposed pads, ensuring a consistent gold thickness of 2 micro-inches.

7. Routing & Profiling: Board outline routing or V-scoring.

8. Test électrique & Inspection finale: 100% Flying Probe or Fixture testing to ensure circuit continuity and electrical isolation.

Applications principales & Cas d'utilisation

Ce High-Thermal Single-Side Aluminum Core PCB is the ideal choice for a wide range of medium-to-high power electronic applications requiring efficient cooling:

• Éclairage LED: LED Heat Sink Boards (PCB MCPCBs) for high-power LED street lights, industrial lamps, and automotive lighting, significantly extending LED lifespan by mitigating lumen depreciation.

• Modules d'alimentation: Switching Mode Power Supplies (SMPS), DC-DC converters, and power sections of motor drivers.

• Électronique automobile: Power management systems and LED controller boards in new energy vehicles.

• Electronique grand public: High-end audio amplifiers, power amplifier modules in routers.

• Commandes industrielles: IGBT heatsink substrates in variable frequency drives and servo drives.

Why Choose UGPCB’s Aluminum Base PCB Solution?

As a professional Fabricant de PCB, UGPCB not only supplies standard products but also offers customization based on your specific thermal requirements (par ex., locally thickened aluminum base), electrical insulation needs, and mechanical form factors. We are committed to supporting your project from initial design review through to volume production, garantissant Carte PCB quality and on-time delivery.

Contact us today for a free quote and technical consultation on your High-Power Thermal Management PCB Solution. Let our expert design and manufacturing capabilities enhance the reliability and performance of your products.