Heavy Copper PCB 2OZ to 6OZ | High Current & Fiabilité thermique | UGPCB

Heavy Copper PCB Overview

The Heavy Copper PCB is a specialized type of circuit imprimé designed to handle high current applications. It features an increased copper thickness compared to standard PCBs, making it ideal for power-intensive electronics. Below is a detailed introduction to this advanced PCB technologie.

Classification

Heavy Copper PCBs are primarily classified based on their copper thickness. Common classifications include 2OZ, 3once, 4once, up to 6OZ (or 70um and above). Le modèle introduit ici, PCB en cuivre lourd, offers copper thicknesses of 2OZ and 6OZ, tailored to meet various high-power requirements.

Composition des matériaux

The Heavy Copper PCB utilizes Et s1141 as its base material, a high-quality substrate known for its electrical and mechanical properties. The PCB is constructed with 6 couches, ensuring robust performance and reliability.

Caractéristiques de performance

Heavy Copper PCBs excel in handling high currents due to their thick copper layers. They also offer excellent thermal conductivity, which helps in dissipating heat efficiently. The surface technology used, Immersion Or (1-3U), provides a protective coating that enhances corrosion resistance and improves solderability.

Conception structurelle

Structurellement, the Heavy Copper PCB features a board thickness of 2.8mm, providing a sturdy base for composants. The green solder mask color not only enhances visual appeal but also provides insulation and protection against environmental factors. The white silk screen adds to the board’s readability by clearly marking component locations and other essential information.

Caractéristiques distinctives

The defining feature of Heavy Copper PCBs is their ability to carry high currents without overheating or experiencing excessive voltage drop. This is achieved through the use of thick copper layers, which also contribute to the board’s overall durability. En plus, the immersion gold surface finish ensures long-term reliability and ease of soldering.

Processus de production

The production of Heavy Copper PCBs involves several precision steps:

1. Base Material Preparation: The SY S1141 substrate is prepared and cut to size.
2. Laminage de cuivre: Thick copper foil is laminated to the substrate using advanced bonding techniques.
3. Modèle de circuit: The desired circuit patterns are etched onto the copper foil.
4. Empilement de calques et stratification: Multiple layers are stacked and laminated together to form the final PCB structure.
5. Forage et placage: Les trous sont forés pour le montage des composants et l'interconnexion, suivi d'un placage pour améliorer la conductivité.
6. Soldermask Application: A green soldermask is applied to protect the circuits and provide insulation.
7. Silk Screen Printing: White silk screen ink is used to print component labels and other markings.
8. Application de finition de surface: The immersion gold coating is applied to the PCB surface.
9. Inspection et test finaux: The PCB undergoes rigorous inspection and testing to ensure quality and performance.

Scénarios d'application

Heavy Copper PCBs are widely used in power converter applications due to their ability to handle high currents and dissipate heat efficiently. They are also suitable for other high-power electronics, such as inverters, motor controllers, and battery management systems. Dans ces applications, Heavy Copper PCBs ensure reliable performance and extended product lifespan.