1. Présentation du produit
UNserver power backplane PCB is a critical interconnect component in server power systems. It distributes electrical energy from power supply modules to server motherboards, hard drive backplanes, and expansion cards. This board does not have onboard storage or processing power. Les planches avec des machines à sous sont appelées bassin versant plutôt que sur des panneaux mères.
UGPCB offers this server power backplane PCB with the Kingboard KB6167F high-Tg lead-free laminate. The board has a 1.6mm thickness, 2 couches (double face), and a compact 78.26×61.3mm form factor. It meets IPC-6012 Class 2 exigences de performance. The product uses Lead-Free Hot Air Solder Leveling (HASL) comme finition de surface.
2. Classement du produit
Ce server PCB falls into the following categories per Normes IPC:
| Classification | Catégorie |
|---|---|
| Par structure | Rigid Double-Sided PCB (2-couche) |
| Par candidature | Server Power Backplane – Computer & Peripheral Equipment |
| Par classe de performances | Classe IPC-6012 2 – Dedicated Service Electronic Products |
| By Substrate | FR-4 Flame-Retardant Epoxy Glass Cloth Laminate (UL 94 V-0) |
| Par finition de surface | Nivellement de soudure à air chaud sans plomb (HASL sans plomb) |
| By Solder Mask / Légende | Green Solder Mask with White Silkscreen |
3. Principales spécifications techniques
3.1 Substrat: Kingboard KB6167F High-Tg Lead-Free Laminate
KB6167F is a high-performance FR-4 laminate from Kingboard Holdings Limited. It belongs to the high-Tg lead-free epoxy copper clad laminate series.
| Paramètre | Valeur typique | Norme d'essai |
|---|---|---|
| Température de transition du verre (Tg) | ≥170°C (Méthode DSC) | IPC-TM-650 |
| Température de décomposition thermique (Td) | >340° C | IPC-TM-650 |
| Cote d'inflammabilité | UL 94 V-0 | Norme UL |
| Primary Specification | IPC-4101/126 | CIB-4101 |
LeTg of ≥170°C allows the material to withstand lead-free reflow soldering at peak temperatures of260° C. Standard Tg materials (130–140°C) risk delamination during multiple reflow cycles. KB6167F also offerslow Z-axis CTE and excellentRésistance CAF.
3.2 Épaisseur du panneau: 1.6mm
The 1.6mm thickness provides adequate mechanical strength for connector insertion. It also enables mature, stable processing with high yield rates.
3.3 Nombre de couches: 2 Calques (Double face)
Power backplanes focus on power distribution rather than high-speed signal routing. The 2-layer design delivers lower cost, shorter lead times, and higher reliability compared to multilayer boards.
3.4 Dimensions: 78.26 × 61.3mm
This compact size fits standard 1U or 2U server chassis spaces. UGPCB offers flexible customization for different chassis configurations.
3.5 Diamètre minimum du trou: 0.281mm
The aspect ratio determines plated through-hole reliability:
Rapport d'aspect = épaisseur de la planche / Minimum Hole Diameter = 1.6mm / 0.281mm ≈ 5.69:1
This ratio is well below the industry standard10:1 upper limit. UGPCB applies70 minutes of pattern plating to achieve hole copper thickness of18–22μm. Classe IPC-6012 2 requires a minimum of20µm on plated through-hole walls.
3.6 Largeur de ligne / Espacement des lignes: 0.21 × 0.186mm
The minimum line width of0.21mm (environ. 8.3 milles) and minimum spacing of0.186mm (environ. 7.3 milles) meet precision circuitry requirements per IPC-2221C.
3.7 Épaisseur de la feuille de cuivre: 1/1 once
Both layers have1 once (environ. 35µm) feuille de cuivre. A 0.21mm-wide trace on 1OZ copper carries approximately1.5–2A at 10°C temperature rise per IPC-2221 calculations.
3.8 Finition de surface: Nivellement de soudure à air chaud sans plomb
Lead-Free HASL usesSAC305 alloy (Sn-3.0Ag-0.5Cu). Les principaux avantages comprennent:
- RoHS compliance
- Excellente soudabilité
- Extended shelf life (>12 months)
- Cost-effective for high-volume production
This finish complies withIPC-4554.
3.9 Masque de soudure / Légende: Green Oil / White Character
Green solder mask provides excellent insulation and high-temperature resistance. White silkscreen ensures clear component identification for PCBA assembly and maintenance.
4. Considérations de conception
4.1 Power Integrity Design
Power integrity is the primary design focus for aserver power backplane PCB. Key elements include:
- Low-impedance Power Distribution Network (RPD) with large power and ground planes
- Adequate current-carrying capacity based on server power module output
- Voltage drop control from input to output ports
4.2 Gestion thermique
High-current transmission generates significant heat. The design addresses this through:
- High-Tg material selection (KB6167F Tg≥170°C)
- Optimized heat dissipation paths with strategic copper layouts and thermal vias
4.3 Conception de la fabrication (DFM)
Per IPC-2221 and IPC-2222:
- Rapport hauteur/largeur 5.69:1 – well below the 10:1 industry limit
- Minimum line width 0.21mm – mature etching process for 1OZ copper
- Dimensional tolerances: CNC routing ±0.15mm (6 milles), steel die punching ±0.10mm (4 milles)
5. Principe de fonctionnement
Leserver power backplane PCB operates through three functional layers:
Power Input Layer: Power supply modules deliver DC power (typically 12V or 48V) through input connectors.
Power Transmission Layer: Electrical energy travels through carefully designed copper traces (power and ground layers). Épaisseur du cuivre (1once) and trace widths ensure safe temperature rise at rated currents.
Power Output Layer: Distributed power reaches output connectors that supply the server motherboard, hard drive backplanes, cartes d'extension, and other functional modules.
6. Applications et cas d'utilisation
| Application | Description |
|---|---|
| Serveurs de centre de données | Rack-mount and blade server power backplanes |
| AI Compute Servers | GPU servers and AI training cluster power distribution |
| Télécommunications | Switches and routers power backplanes |
| Commandes industrielles | Industrial PCs and PLC control cabinet power modules |
Ceserver PCB is ideal for distributing power from redundant modules to server motherboards. It also provides stable power to hard drive backplanes and expansion cards. The board enables hot-swap power and redundant switching functions.
7. Processus de fabrication
UGPCB manufactures thisserver power backplane PCB in full compliance with IPC-6012:
| Étape | Process Description |
|---|---|
| 1. Inspection entrante | Verify KB6167F laminate meets IPC-4101/126 |
| 2. Coupe | Cut large panels to production workboard size |
| 3. Forage | CNC drilling of 0.281mm minimum holes |
| 4. Désenduire / Cuivre chimique | Chemical deposition of conductive layer; backlight test per IPC-TM-650 |
| 5. Placage de panneaux | Full-board copper plating |
| 6. Transfert d'images | Stratifié, exposer, develop circuit patterns |
| 7. Placage de motifs | 70 minutes plating time; cross-section analysis verifies 18–22μm hole copper |
| 8. Gravure | Remove excess copper to form final circuits |
| 9. Inspection AOI | Automated Optical Inspection scans for opens, shorts, and thin lines |
| 10. Masque de soudure | Apply green solder mask with LED parallel exposure |
| 11. Impression de légende | High-precision laser legend printing for clear white characters |
| 12. Finition de surface | Lead-Free HASL per IPC-4554 |
| 13. Routage | CNC routing or steel die punching to final dimensions |
| 14. Test électrique | Grande vitesse test de sonde volante ensures electrical integrity |
| 15. FQC | Final Quality Control per IPC-6012 Class 2 critères d'acceptation |
8. Résumé des performances
8.1 Avantages de base en matière de performances
- Haute résistance à la chaleur: KB6167F Tg≥170°C, Td>340°C – withstands 260° C lead-free reflow peak temperatures
- Fabrication de précision: 0.281mm diamètre minimum du trou, 0.21mm minimum line width – aspect ratio only 5.69:1
- Conformité environnementale: Lead-Free HASL meets RoHS and REACH requirements
- UL safety certification: UL 94 V-0 cote d'inflammabilité
- IPC standard compliance: Full IPC-4101, CIB-2221, IPC-6012 compliance
8.2 Caractéristiques du produit
- Double-sided routing with simple 2-layer structure
- High-reliability Kingboard KB6167F substrate
- Mature Lead-Free HASL surface finish
- Strict quality control with AOI, analyse des coupes transversales, and flying probe testing
- Compact 78.26×61.3mm form factor for standard server chassis
9. Pourquoi choisir UGPCB?
UGPCB brings years of experience in server power backplane PCB et PCB fabrication:
- Full IPC process control – from material selection (KB6167F per IPC-4101/126) to final inspection (Classe IPC-6012 2)
- Precision manufacturing capability – supports minimum hole diameters of 0.2mm and minimum line widths of 3 milles (0.076mm)
- Grade A materials – Kingboard A-grade laminates, Taiyo/Guangxin brand inks
- Comprehensive quality system – AOI, analyse des coupes transversales, test de sonde volante
10. Demandez un devis aujourd'hui
UGPCB offers one-stop services from Conception de circuits imprimés and engineering prototyping to volume production. Whether you need standard server power backplane PCBs or custom sizes, specialized materials, or differentiated surface finishes for your PCBA requirements, our technical team is ready to support you.
Contact UGPCB today for a quote and technical consultation!
11. Déclaration de source de données
The technical standards and data cited in this article come from the following authoritative organizations:
- IPC (Association reliant les industries électroniques): IPC-6012F Qualification et spécifications de performances pour les cartes imprimées rigides (2023); IPC-2221C Norme générique sur la conception des cartes imprimées (2023); IPC-4101E Spécification des matériaux de base pour les cartes imprimées rigides et multicouches; IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards; IPC-TM-650 Manuel des méthodes d'essai.
- UL (Laboratoires souterrains): UL 94 Norme pour les tests d'inflammabilité des matériaux plastiques pour les pièces d'appareils et d'appareils –V-0 notation.
- Kingboard Holdings Limited: KB-6167F High-Tg Lead-Free Copper Clad Laminate product technical datasheet.
UGPCB – Your Professional Partner for Server Power Backplane PCBs.
Data in this article is sourced from publicly available technical standards and product specifications published by IPC, UL, and Kingboard Holdings Limited.
