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UGPCB Factory’s VCP Equipment: Innovation and Technological Breakthroughs in Vertical Continuous Plating
Introduction: Core Equipment Innovation in PCB Manufacturing
Driven by industries such as 5G communication, intelligence artificielle, and new energy vehicles, PCB (Circuit imprimé) technology is advancing toward high-density interconnect (IDH), any layer interconnection, and other high-end fields. As the core equipment in PCB electroplating processes, Vertical Continuous Plating (PCV) technology has become a key indicator of manufacturers’ technological capabilities. UGPCB’s heavily invested modern, intelligent VCP equipment is redefining production standards in the PCB electroplating industry through its precision transmission system, high electroplating efficiency, and environmentally friendly process design.
1. VCP Equipment Structure and Operating Principles
1.1 Core Equipment Structure Analysis
UGPCB’s VCP system primarily consists of three integrated components:
- Plating Tank Array: Modular design with vertically arranged independent units, each equipped with precision fluid control systems. Tank bodies use PP/PVC composite materials ensuring corrosion resistance and chemical compatibility.
- Transmission Mechanical Arm System: Servo motor-driven chain transmission mechanism enables precise PCB board transfer between tanks. Titanium alloy arms resist acid/alkali corrosion with positioning accuracy of ±0.05mm.
- Intelligent Control Center: Integrates PLC and industrial IoT technology for real-time monitoring of parameters like current density (3.0-3.5ASD), plating duration (20-40min), and transmission speed (0.5-2m/min). Supports MES system integration.
1.2 Electrochemical Copper Plating Principles
VCP follows Faraday’s laws of electrolysis (Formule: M=K⋅I⋅t) through anode dissolution and cathode deposition. Technological innovations include:
- Flow Field Optimization: Dual-tank design with upper tank jet flow creating uniform eddy currents and lower tank achieving 6m³/h chemical circulation filtration, ensuring plating uniformity (R value ≤5μm).
- Energy-Saving Performance: Compared to traditional龙门式 equipment, VCP reduces copper consumption by 13%, water usage by 60%, and power consumption by 30%, complying with EU RoHS and REACH regulations.
2. Technological Advantages and Industry Applications
2.1 Key Performance Metrics
| Paramètre | Spécification | Industry Comparison |
|---|---|---|
| Current Density | 1.5-4.0ASD | Traditional ≤2.5ASD |
| Plating Efficiency | 92%-94% (at 3.5ASD) | Industry Average 85%-90% |
| Layer Uniformity (R.) | ≤5μm (25μm copper) | Competitors ≥7μm |
| Via Fill Rate (T/P) | ≥95% at 10:1 | International Standard ≥85% |
2.2 Scénarios d'application typiques
- 5G Base Station PCBs: Handles high-frequency materials (par ex., Rogers 4350b) with 0.08mm microvia plating, meeting 5G RF module signal integrity requirements.
- Automotive Electronics HDI: Withstands -40℃~125℃ thermal cycling for 0.3mm ultra-thin boards, ensuring ADAS system reliability.
- Semiconductor Package Substrates: Enables 30μm/30μm line/space fabrication using SAP (Semi-Additive Process) with VCP.
3. Technological Innovations and Environmental Practices
3.1 Key Breakthroughs
- Dynamic Current Compensation: AI algorithms adjust anode current distribution to eliminate edge effects and improve layer density.
- Chemical Management System: Integrated online sensors (pH, copper ion concentration) automate additive replenishment, reducing manual intervention.
3.2 Fabrication durable
- Closed-Loop System: 98% plating solution recovery rate reduces hazardous waste by 200 tons/year per unit.
- Energy Efficiency: High-frequency switching power supplies with ≥0.95 power factor achieve 30% energy savings over traditional systems.
4. Industry Impact and Future Outlook
Prismark projects the global VCP equipment market will reach $1.23 milliards 2025 avec 18.7% TCAC. UGPCB’s modern equipment provides competitive advantages in:
- High-End Server PCBs: Supports ≥8-layer HDI blind via filling for AI server upgrades.
- Flexible Electronics FPC: Roll-to-roll (R2R) VCP enables 0.05mm ultra-thin PI substrate plating.
Conclusion
UGPCB’s VCP equipment represents the pinnacle of modern PCB electroplating technology. Through modular design, intelligent control, and eco-friendly processes, it provides replicable green manufacturing solutions for the PCB industry. As AI infrastructure and electric vehicles evolve, VCP will play an increasingly critical role in advanced PCB production.
