36-Layer High TG Backplane PCB – High-Density & High-Temperature Resistant Solution

Overview of the 36-Layer High TG Backplane PCB

The 36-Layer High TG Backplane PCB is a high-density, multilayer printed circuit board (PCB) designed for backplane applications. This PCB is ideal for complex electronic systems that need to manage high power and signal integrity.

What is a 36-Layer High TG Backplane PCB?

A 36-Layer High TG Backplane PCB is a printed circuit board (PCB) cu 36 layers of conductive material separated by insulating layers, specifically designed for backplane applications. The term “High TG” refers to the glass transition temperature, indicating the PCB’s ability to withstand high temperatures without losing its mechanical and electrical properties.

Cerințe de proiectare

The design requirements for a 36-Layer High TG Backplane PCB are stringent to ensure its performance and reliability:

• Material: High TG FR4, chosen for its excellent electrical and thermal properties.
• Număr de straturi: 36 layers to accommodate complex and dense circuit designs.
• Culoare: Green/White for easy identification and aesthetic appeal.
• Grosime terminată: 2.4mm to provide structural integrity and durability.
• Grosime de cupru: 1OZ to ensure adequate conductivity and heat dissipation.
• Tratament de suprafață: Aur de imersiune pentru a spori lipirea și rezistența la coroziune.
• Urmare minimă și spațiu: 4mil(0.1mm) Pentru a susține modelele de circuit fine.
• Caracteristică: High multilayer, Panasonic M6 PCB material, known for its high reliability and performance.

Cum funcționează?

The 36-Layer High TG Backplane PCB works by providing a platform for various electronic components to be interconnected through conductive pathways. Aceste căi, sau urme, sunt confecționate din cupru și sunt gravate pe tablă. The high TG FR4 material ensures that the PCB can withstand high temperatures without losing its mechanical and electrical properties, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

Aplicații

The primary application of the 36-Layer High TG Backplane PCB is in backplane applications where it manages and regulates the flow of electrical signals. Aceasta include:

• Data communication devices
• Networking equipment
• Industrial control systems
• Telecommunication infrastructure

Clasificare

Pe baza caracteristicilor și aplicațiilor sale, the 36-Layer High TG Backplane PCB can be classified as a high-speed digital PCB designed for backplane applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

Compoziție materială

The core material used in the 36-Layer High TG Backplane PCB is High TG FR4, a high-performance composite material known for its excellent mechanical, termic, și proprietăți electrice. This material ensures that the PCB can withstand the demands of backplane applications.

Caracteristici de performanță

The performance characteristics of the 36-Layer High TG Backplane PCB include:

• High signal integrity
• Low signal loss
• Management termic superior
• Rezistență mecanică robustă
• Stabilitatea pe termen lung

Detalii structurale

The structural details of the 36-Layer High TG Backplane PCB are as follows:

• Număr de straturi: 36 straturi
• Grosime terminată: 2.4mm
• Grosime de cupru: 1Oz
• Tratament de suprafață: Aur de imersiune
• Urmare minimă și spațiu: 4mil(0.1mm)
• Caracteristică: High multilayer, Panasonic M6 PCB material

Caracteristici și beneficii

The key features and benefits of the 36-Layer High TG Backplane PCB include:

• Interconectivitate de înaltă densitate
• Integritate excelentă a semnalului
• Construcție mecanică robustă
• Performanță fiabilă pe termen lung
• Opțiuni estetice de culoare (Verde/alb)

Proces de producție

The production process of the 36-Layer High TG Backplane PCB involves several steps including:

1. Selectarea materialelor: Choosing high-quality High TG FR4 material.
2. Stivuirea stratului: Aranjând 36 straturi cu precizie.
3. Gravură: Înlăturarea excesului de cupru pentru a forma modelele dorite.
4. Aplicație de mască de lipit: Applying a solder mask layer to protect the copper traces.
5. Placare: Aplicarea tratamentului de suprafață a aurului de imersiune.
6. Asamblare: Încorporarea PTH -urilor și VIA -urilor pentru interconectări de straturi.
7. Testare: Asigurarea că PCB îndeplinește toate specificațiile de performanță.

Cazuri de utilizare

The 36-Layer High TG Backplane PCB is used in various scenarios such as:

• Backplane applications in data centers
• High-speed networking equipment
• Industrial automation systems
• Telecommunication infrastructure