6-1-ступенчатая печатная плата HDI уровня (1+N+1) | UGPCB High-Density Interconnect Manufacturing

Product positioning: UGPCB’s 6-layer 1-stage HDI PCB uses a 1+N+1 stack-up. Он предлагает 0.10 mm laser blind vias, 0.20 mm through holes, 0.20 mm BGA pitch, и 3/3 mil traces. It suits compact, high-integration electronics.

1. What Is a 6-Layer 1-Stage HDI PCB?

A 6-layer 1-stage HDI PCB is a six-layer high-density interconnect printed circuit board. It uses a 1+N+1 stack-up, where N equals 4. IPC-2226 classifies this build-up approach as a Type I ИЧР структура. Each side has one build-up layer. Laser microvias connect the outer layers to the next inner layer. Mechanical through holes connect the core layers.

Parameter Snapshot

Параметр	Спецификация
Количество слоев	6 слои (1+N+1)
Базовый материал	FR4 TG150
Толщина доски	1.6 мм
Размер панели	105 × 95 мм (1-вверх)
Внешняя толщина меди	35 мкм (1 унция)
Внутренняя толщина меди	30 мкм
Минимум через отверстие	0.20 мм
Minimum blind via	0.10 мм
Minimum BGA pitch	0.20 мм
Trace width/spacing	3/3 мил (75 µm/75 µm)

2. Product Overview and Scientific Classification

2.1 Обзор продукта

UGPCB’s 6-layer 1-stage HDI PCB targets high-density electronic packaging. It improves routing density over a standard 6-layer through-hole PCB. Laser-drilled blind vias make this possible. IPC-2226 defines HDI as a board with higher wiring density than обычные печатные платы. It uses conductors ≤100 µm, переходные отверстия <150 мкм, и подушечки <400 мкм. This product meets those thresholds. Его 3/3 мил (75 мкм) traces and 0.10 mm laser microvias exceed standard PCB capability.

2.2 Научная классификация

• By interconnection: HDI печатная плата, IPC-2226 Type I
• By stack-up: 1+N+1 first-order HDI, single build-up per side, N=4 core
• По количеству слоев: 6-слой многослойная печатная плата
• By base material: FR4 Tg150 epoxy glass fabric
• По классу производительности: IPC-6012 Класс 2 или класс 3
• By product form: bare PCB or Сборка печатной платы

3. Stack-Up and Design Highlights

3.1 1+N+1 Stack-Up

1+N+1 is the most basic and mature HDI stack-up. “Н” is the core. Each “1” is one build-up layer. This product is 1+4+1. The core has four layers. One build-up layer sits on each side. IPC-2226 describes this structure as having microvias that connect to adjacent inner layers. The core uses mechanical through holes. This structure balances signal integrity, расходы, and yield. Many HDI PCB designs start with this stack-up.


3.2 Key Design Points

Blind via design: The minimum blind via is 0.10 мм (100 мкм). IPC-T-50M defines a microvia as a blind via ≤0.15 mm with aspect ratio ≤1:1. The blind via connects only the outer layer to the next inner layer. It frees inner-layer routing space. This helps high-density PCB layout.

Trace width and spacing: The product uses 3/3 мил (75 µm/75 µm) следы. This is a core HDI печатная плата способность. Standard multilayer PCBs often use 6/6 мил (150 мкм) следы. HDI PCBs can use 3/3 mil or finer. This doubles routing density in the same area. В 0.20 mm BGA pitch, 3/3 mil traces allow two routes between pads. This directly affects BGA escape routing.

BGA support: The minimum BGA pitch is 0.20 мм. At this pitch, pads are often 0.10–0.12 mm. Pad spacing is only 0.08–0.10 mm. This demands high registration accuracy and etch control in PCB manufacturing.

Контроль импеданса: С 3/3 mil traces and FR4 Tg150, Dk is about 4.2–4.6 at 1 МГц. Manufacturers can control 50 Ω single-ended and 100 Ω differential impedance. This supports high-speed signal transmission.

Thermal design: The 6-layer structure uses 30 µm inner copper. Large inner copper planes spread heat away from BGA areas.

4. Как это работает

The 6-layer 1-stage HDI PCB uses two via types:

• Laser blind via: A laser drills from the outer layer to the next inner layer. The minimum diameter is 0.10 мм. CO₂ or UV lasers form these vias.
• Mechanical through hole: This hole passes from top to bottom. It connects core layers and all layers. The minimum diameter is 0.20 мм.

Signals travel from surface components, such as BGA chips, through blind vias into inner signal layers. This avoids the space loss and signal reflection of through holes. The shorter path lowers parasitic inductance and capacitance. This benefits high-speed digital signals.

5. Core Materials and Performance

5.1 Базовый материал: FR4 TG150

This product uses FR4 Tg150 epoxy glass fabric. Tg is the glass transition temperature. IPC-TM-650 method 2.4.25 (ДСК) measures this value. Tg150 material remains stable in lead-free soldering. Lead-free reflow peaks at about 245–260°C. The material withstands multiple reflow cycles without major dimensional change or delamination.

5.2 Толщина меди

• Outer copper: 35 мкм (1 унция). This supports current carrying and solder reliability.
• Внутренняя медь: 30 мкм. This meets signal and power plane needs.

5.3 Ключевые характеристики производительности

• High routing density: 3/3 mil traces and 0.10 mm microvias raise density by over 50% versus standard 6-layer boards.
• Small package support: 0.20 mm BGA pitch fits CSP, QFN, and other micro packages.
• Strong signal integrity: Short blind via paths reduce parasitic effects. This helps high-speed signals.
• Reliable construction: The board can meet IPC-6012 acceptance requirements. IPC-6012 Класс 3 requires a minimum average copper thickness of 25 µm in plated holes.

6. Производственный процесс

UGPCB makes 6-layer 1-stage HDI PCBs through precise steps:

1. Inner-layer imaging: Expose, развивать, and etch inner traces on the 4-layer core.
2. Inner-layer lamination: Press inner cores and prepreg into a 4-layer core.
3. First drilling and plating: Drill mechanical through holes and plate copper.
4. Build-up lamination: Press one dielectric layer on each side of the core.
5. Лазерное бурение: Use CO₂ or UV lasers to form 0.10 ММ Микровия.
6. Blind via plating and filling: Plate and fill laser vias for reliable conduction.
7. Outer-layer imaging: Форма 3/3 mil outer traces.
8. Паяльная маска и обработка поверхности: Apply solder mask and ENIG or OSP finish.
9. Profiling and testing: Route the outline, run испытание летающего зонда, АОИ, и окончательная проверка.

7. Основные приложения

The 6-layer 1-stage HDI PCB balances density, размер, и надежность. It serves many markets:

• Smartphones and mobile devices: Mainboard core areas with processor BGA packages.
• Носимые устройства: Умные часы, TWS-наушники, and other space-limited products.
• Автомобильная электроника: ADAS sensor modules and infotainment mainboards.
• Медицинская электроника: Portable monitors and implantable device control boards.
• Промышленный контроль: PLC modules and industrial IoT gateways.
• Коммуникационное оборудование: 5G small-cell RF modules and optical module PCBs.

The global HDI PCB market is growing fast. The Business Research Company reports strong HDI market growth. The market will grow from USD 17.78 миллиард в 2025 в доллары США 19.47 миллиард в 2026. That is a 9.5% compound annual growth rate (Кагр). The market may reach USD 28.82 миллиард за 2030.

8. Почему выбирают UGPCB?

УГКПБ Circuits Limited (UGPCB®) focuses on high-precision PCB R&D and manufacturing. Its factory covers 280,000 квадратные метры. В нем работают 1,300 люди. Над 35% are technical professionals. The company makes HDI PCBs from 1 к 6+ этапы, Anylayer HDI Boards, Подложки ИС, жесткие платы, и стандартные многослойные печатные платы FR4.

UGPCB holds ISO9001, UL, and RoHS certifications. It follows IPC standards for production and acceptance. This ensures product quality meets customer needs and industry rules. The company serves customers in mainland China, Тайвань, Корея, Япония, the US, Бразилия, Индия, Юго -Восточная Азия, and Europe.

Get a quote today: Send your Gerber files or design parameters. The UGPCB technical team will reply within 24 часы. We will provide a custom 6-layer HDI PCB quote and a one-stop PCBA assembly solution. Нужен ли вам quick prototyping or stable volume supply, we can help.

Заявление об источнике данных

This article cites standards and technical data from these authorities:

1. IPC-2226, Sectional Design Standard for High Density Interconnect (ИЧР) Printed Boards — HDI structure classification and microvia definition.
2. IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits — microvia terminology.
3. МПК-6012, Квалификационные и эксплуатационные характеристики жестких печатных плат — rigid board acceptance and plated copper thickness.
4. МПК-2221, Общий стандарт проектирования печатных плат — PCB design guidelines and trace/space practice.
5. IPC-TM-650 Method 2.4.25 — glass transition temperature (Тг) Метод испытаний.
6. The Business Research Company, Global High Density Interconnect (ИЧР) Market Report 2026 — HDI market data.