Die 8-lagige 1+N+1-HDI-Leiterplatte von UGPCB: Hochdichte Verbindung für fortschrittliche Mikroelektronik

Die 8-lagige 1+N+1-HDI-Leiterplatte von UGPCB: A Comprehensive Guide

In the relentless pursuit of miniaturization and enhanced performance in electronics, Hochdichte Interconnect (HDI) Leiterplatten have become the cornerstone. UGPCB’s 8-Layer 1+N+1 HDI product represents a sophisticated solution for designers pushing the boundaries of what’s possible. This article provides a detailed look at this advanced Leiterplatte Technologie.

What is an 8-Layer 1+N+1 HDI PCB?

An 8-Layer 1+N+1 HDI PCB is a specific type of high-density interconnect board. The nomenclature “1+N+1” describes its microvia build-up structure.

• The First and Last ‘1’: These represent a single layer of high-density microvias on the top and bottom surfaces of the board. These microvias are typically created using laser drilling.

• The ‘N’: This represents the core of the board, which in this case is a standard 6-layer mehrschichtige Leiterplatte (making the total 8 Schichten). The core contains through-holes or buried vias that connect the internal layers.

This structure allows for a very high number of interconnections in a compact space, making it ideal for complex, space-constrained PCB -Designs essential for modern microelectronic products.

Key Design Features and Specifications

UGPCB manufactures this HDI PCB with precision, adhering to the following critical specifications:

• Material: High-Tg FR-4, a robust and reliable laminate offering excellent thermal and mechanical stability.

• Brettdicke: A finished thickness of 0.8mm, supporting slim product profiles.

• Copper Weight: 1 oz (35µm) for inner layers and 0.5 oz (17.5µm) for outer layers. This balance ensures good current carrying capacity while allowing for finer outer layer trace etching.

• Oberflächenbeschaffung: Immersionsgold (ZUSTIMMEN) over an OSP (Bio -Lötlichkeitsschutz) foundation. This combination provides a flat, durable surface for soldering and excellent shelf life.

• Minimum Trace/Space: 3 Mil (0.075 mm), enabling high-density circuitry.

• Mindestlochgröße: 0.2mm for mechanical drills and an ultra-fine 0.1mm for laser-drilled microvias.

How This HDI PCB Structure Works

Der “1+N+1” architecture functions by creating a more efficient routing pathway. Instead of using large through-holes that consume valuable real estate on every layer, this HDI PCB design utilizes microvias. These tiny laser-drilled holes connect only adjacent layers (z.B., L1 to L2, or L8 to L7). Das “stacked” oder “staggered” via approach frees up routing channels on the inner layers, allowing for a much greater component density and more efficient signal paths, which is crucial for high-speed PCBA-Montage.

Primary Applications and Use Cases

The primary application for this advanced HDI PCB is in sophisticated microelectronic products. Specific use cases include:

• Tragbare Technologie: Smartwatches, fitness trackers, and medical monitors.

• Advanced Mobile Devices: Smartphones, Tabletten, and ultra-portable laptops.

• High-Density Medical Equipment: Miniaturized medical imaging and diagnostic devices.

• Aerospace and Defense Avionics: Where reliability and size are paramount.

The Material Composition: FR-4 Laminate

The choice of FR-4 material is strategic. It provides an excellent balance of performance, kosten, and manufacturability. For this 0.8mm thick HDI PCB, a high-grade FR-4 with a high glass transition temperature (Tg) is used to withstand the thermal stress of multiple lamination cycles and lead-free Leiterplatte soldering processes.

Performance and Structural Advantages

The structure of the 1+N+1 HDI board directly translates to significant performance benefits:

• Verbesserte Signalintegrität: Shorter interconnection paths reduce signal loss and propagation delay.

• Improved Thermal Management: The dense via structure aids in heat dissipation.

• Superior Reliability: The use of microvias reduces the risk of solder joint failure during thermal cycling.

• Reduced Size and Weight: The core advantage of HDI technology, enabling smaller end products.

A Simplified Overview of the Production Process

The manufacturing of this HDI PCB is a multi-step, precision process:

1. Core Fabrication: The inner ‘N’ Kern (6 Schichten) is produced first.

2. Laminierung: Outer dielectric layers are laminated onto the core.

3. Laserbohren: Microvias are drilled with a laser into the outer layers.

4. Plating and Patterning: The microvias are plated shut, and the outer layer circuits are etched.

5. Oberflächenbeschaffung: The Immersion Gold and OSP are applied.

6. Elektrische Tests: 100% electrical testing ensures the integrity of all connections.

Why Choose UGPCB for Your HDI PCB and PCBA Needs?

UGPCB’s expertise in manufacturing 8-Layer HDI PCBs offers distinct advantages for your project. Their capability to reliably produce boards with 3/3 mil lines and 0.1mm microvias positions them as a leader for complex PCB manufacturing. This makes them an ideal partner not just for Leiterplattenfertigung but also for a full turnkey PCBA service, ensuring a seamless transition from design to a finished, assembled product.