4-Hersteller von Layer-DDR-Substratplatinen | Hochgeschwindigkeits-HL832-Material | UGPCB

Lead the High-Speed Era: UGPCB’s 4-Layer DDR Substrate Board – The Superior Interconnect Solution for Your Core ICs

In the booming landscape of high-performance computing, künstliche Intelligenz, and next-generation communication devices, every advancement in Double Data Rate (DDR) technology places stricter demands on PCB substrates. Leveraging deep expertise in high-end PCB manufacturing Und IC-Substrat Lösungen, UGPCB introduces its premium 4-Layer DDR Substrate Board. Engineered with cutting-edge materials, it is specifically designed to carry high-performance memory chips (z.B., DDR4, DDR5, LPDDR), serving as your reliable partner in the pursuit of ultimate speed and stability.

Produktübersicht & Definition

A 4-Layer DDR Substrate Board is a High-Density Interconnect (HDI) printed circuit board designed for packaging and connecting Dynamic Random-Access Memory (DDR) Chips. It acts as a critical bridge between the chip and the mainboard, responsible for transmitting high-speed signals, distributing power, and providing stable mechanical support. Unlike standard Leiterplatten, DDR substrates demand near-perfect signal integrity, Thermalmanagement, and dimensional accuracy. This product from UGPCB is tailor-made to meet these stringent requirements.

Überlegungen zum kritischen Design

1. Precise Impedance Control: Paramount for DDR PCB design, it minimizes signal reflection and distortion during high-speed data transmission.

2. Kraftintegrität (PI): Dedicated power and ground plane design ensures clean, stable power delivery, reducing noise interference on critical signals.

   1. Signalintegrität (UND): Optimized routing using microstrip and stripline structures minimizes crosstalk and delay, forming the foundation for stable performance post-PCBA-Montage.

3. Thermalmanagement: The substrate material must exhibit excellent thermal properties to aid chip dissipation and ensure long-term reliability.

Wie es funktioniert

The 4-Layer DDR Substrate connects the hundreds of micro-pins of a memory chip to the corresponding motherboard circuits via its precise internal layers. Es ist “Sandwich” stack-up (Signal-Ground-Power-Signal) provides clear return paths for high-speed signals, effectively suppressing Electromagnetic Interference (EMI). The soft gold surface finish ensures a reliable, low-resistance solder joint with the chip’s solder balls (z.B., in BGA packages).

Primäranwendungen & Einstufung

• Primäranwendungen: Extensively used in servers, data center switches, high-end GPUs, KI-Beschleunigerkarten, network storage devices, and any cutting-edge electronic product requiring high-speed, high-capacity memory.

• Einstufung:

  • Für Schichtzahl: Beyond standard 4-layer, designs can extend to 6, 8, or more layers based on complexity.

  • Durch Material: Can be categorized into standard FR-4, Mid-Loss, and this product’s focus – Low-Loss material substrates.

Materialien & Leistungsspezifikationen

Product Structure & Schlüsselmerkmale

• Struktur: Typical 4-layer sequential lamination: Oberschicht (Signal/Components) -> Innenschicht 1 (Solid Ground Plane) -> Innenschicht 2 (Solid Power Plane) -> Untere Schicht (Signal/Components). This structure offers optimal shielding for high-speed signals.

• Schlüsselmerkmale:

  • Superior High-Speed Performance: HL832 low-loss material ensures excellent signal integrity for high-frequency DDR signals.

  • High-Density Interconnect Capability: 100μm micro-vias and 50μm line width technology support advanced chip packaging.

  • Hohe Zuverlässigkeit: ENIG surface finish offers excellent solderability and oxidation resistance for long-term stability.

  • Ultra-Thin & Precise: 0.25mm overall thickness meets stringent space requirements in modern electronics.

Precision Manufacturing Process

Unser Leiterplattenherstellung process adheres to the highest quality standards:
Material Prep → Inner Layer Imaging & Etching → Lamination & Drilling → Metallization & Plating → Outer Layer Imaging → Surface Finish (ZUSTIMMEN) → Solder Mask Application → Profiling → Electrical Test & Endinspektion.
Each stage is supported by advanced inspection equipment (z.B., AOI, Flying Probe Test), Gewährleistung aller IC-Substrat delivered is flawless.

Typical Use Cases

This 4-Layer DDR Substrate is the ideal choice for:

• Rechenzentren & Server: Carrying CPU and memory modules for massive data processing.

• KI & Machine Learning Hardware: Memory subsystems in GPU, NPU accelerator cards.

• High-End Communication Equipment: High-speed memory units in 5G base stations and core network gear.

• Flaggschiff -Unterhaltungselektronik: Main memory substrates in top-tier gaming consoles and laptops.

Why Choose UGPCB’s 4-Layer DDR Substrate?

We are more than a Leiterplattenhersteller; we are your solution provider for high-speed design challenges. With a dedicated PCB design support team, proven capabilities in multilayer PCB prototyping and mass production, and a deep understanding of signal integrity engineering, choosing UGPCB means gaining not just a high-quality substrate, but an accelerator for your product’s success.

Contact our expert team today for a project-specific quote and technical consultation. Power up your high-speed design with UGPCB!