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F4BMX-1/2 Teflon PCB Overview
F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, lower dielectric loss tangent, increased resistance, and more stable performance. The use of imported woven glass fabric ensures consistency in the properties of the laminate.
F4BMX-1/2 Technical Specifications
Aussehen
Meets the specification requirements for microwave PCB laminates according to national and military standards.
Typen
- F4BMX217
- F4BMX220
- F4BMX245
- F4BMX255
- F4BMX265
- F4BMX275
- F4BMX285
- F4BMX294
- F4BMX300
Dielektrizitätskonstante
- F4BMX217: 2.17
- F4BMX220: 2.20
- F4BMX245: 2.45
- F4BMX255: 2.55
- F4BMX265: 2.65
- F4BMX275: 2.75
- F4BMX285: 2.85
- F4BMX294: 2.94
- F4BMX300: 3.0
Dimensions (mm)
- Standard dimensions available: 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 15001000, 18001000
- Customized dimensions are also available.
Dicke und Toleranz (mm)
| Laminatdicke | Toleranz |
|---|---|
| 0.25 | ± 0,025 |
| 0.5 | ± 0,05 |
| 0.8 | ± 0,05 |
| 1.0 | ± 0,05 |
| 1.5 | ±0.075 |
| 2.0 | ± 0,09 |
| 3.0 | ±0.1 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 8.0 | ±0.15 |
| 10.0 | ±0.18 |
| 12.0 | ± 0,2 |
Notiz: Die Laminatdicke umfasst die Kupferdicke. Customized laminates are available for special dimensions.
Mechanische Stärke
| Dicke(mm) | Maximale Warp | Original Board | Einzelseite | Doppelseite |
|---|---|---|---|---|
| 0.25～ 0,5 | 0.030 | 0.050 | 0.025 | 0.020 |
| 0.8～ 1.0 | 0.025 | 0.030 | 0.020 | 0.020 |
| 1.5～ 2.0 | 0.020 | 0.025 | 0.015 | 0.015 |
| 3.0～ 5.0 | 0.015 | 0.020 | 0.010 | 0.010 |
Kraft schneiden/Stanzstärke:
- For thickness <1mm, no burrs after cutting; minimum space between two punching holes is 0.55mm, Keine Delaminierung.
- For thickness >1mm, no burrs after cutting; minimum space between two punching holes is 1.10mm, Keine Delaminierung.
Schälfestigkeit (for 1oz copper):
- Normaler Zustand: ≥18N/cm; No bubble or delamination peel strength: ≥ 15n/cm (in constant humidity and temperature, and kept in molten solder at 260 degree Celsius±2 degree Celsius for 20 Sekunden).
Chemical Property
The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.
Electrical Property
| Name | Testbedingung | Einheit | Wert |
|---|---|---|---|
| Dichte | Normaler Zustand | g/cm³ | 2.1～2.35 |
| Feuchtigkeitsabsorption | Dip in distilled water at 20±2°C for 24 Std. | % | ≤0.08 |
| Betriebstemperatur | High-Low-Temperaturkammer | Grad Celsius | -50°C～+260°C |
| Wärmeleitfähigkeit | W/m/k | 0.3~0.5 | |
| CTE | Typical (εr :2.1~2.3) | ppm/° C. | X: 24(X), Y: 34(y), Z: 235(z) |
| CTE | Typical (εr :2.3~2.9) | ppm/° C. | X: 16(X), Y: 20(y), Z: 168(z) |
| CTE | Typical (εr :2.9~3.38) | ppm/° C. | X: 12(X), Y: 15(y), Z: 92(z) |
| Schrumpfungsfaktor | 2 Stunden im kochenden Wasser | % | < 0.0002 |
| Oberflächenwiderstand | DC, 500V, Normaler Zustand | Mω | ≥2*10^5 |
| Under constant humidity and temperature | ≥8*10^4 | ||
| Volumenwiderstand | Normaler Zustand | Mω · cm | ≥8*10^6 |
| Under constant humidity and temperature | ≥2*10^5 | ||
| Surface dielectric strength | Normaler Zustand | d = 1mm(KV/mm) | ≥ 1,2 |
| Under constant humidity and temperature | ≥ 1,1 | ||
| Dielektrizitätskonstante | 10GHz, εr | (± 2%) | See table below |
| Dissipationsfaktor | 10GHz tgδ | See table below |
Dielectric Constant and Dissipation Factor at 10GHz
| Typ | Dielektrizitätskonstante (εr) | Dissipationsfaktor (Tgside) |
|---|---|---|
| F4BMX217 | 2.17 | – |
| F4BMX220 | 2.20 | – |
| F4BMX245 | 2.45 | – |
| F4BMX255 | 2.55 | – |
| F4BMX265 | 2.65 | – |
| F4BMX275 | 2.75 | – |
| F4BMX285 | 2.85 | – |
| F4BMX294 | 2.94 | – |
| F4BMX300 | 3.0 | – |
UGPCB Products and Services
UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, BGA, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, HDI, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, elektroplierend, und mehr. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.
