PCB 설계, 조작, PCB, PECVD, 원 스톱 서비스를 사용한 구성 요소 선택

다운로드 | 에 대한 | 연락하다 | 사이트맵

UAV Rigid-Flex PCB | UGPCB 4-Layer Rigid + 2-Layer Flex FR-4 & PI Immersion Gold - UGPCB

리지드 플렉스 PCB/

UGPCB Custom UAV Rigid-Flex PCB: 가벼운 중량, 튼튼한, and Precision-Engineered for Drones

모델 : 무인 항공기(무인항공기) 리지드 플렉스 PCB(R-FPCB)

재료 :FR-4 + PI

층 :리지드 4L / 플렉스 2L

색상 :녹색/백색

완성된 두께 :1.0mm +0.15mm

구리 두께 :1OZ Surface

Treatment : 이머젼 골드

최소 추적 / 공간 :4밀/4밀

애플리케이션 :무인 항공기(무인항공기) 리지드 플렉스 PCB

  • 제품 세부정보

As unmanned aerial vehicles (uavs) evolve, every gram impacts flight time, and every signal determines flight safety. Traditional rigid PCBs cannot fit into compact, folded drone frames, while flexible PCBs alone lack structural support. UGPCB solves this challenge with the unmanned aerial vehicle rigid-flex PCB—a specialized circuit board designed for high-vibration, space-constrained aerospace applications.

This article explains the design, 재료, and manufacturing standards behind this advanced 리지드 플렉스 PCB. You will learn why it is the preferred interconnect solution for modern drone electronics.

UGPCB Custom UAV Rigid-Flex PCB

1. Product Overview and Definition

에이 UAV rigid-flex PCB combines rigid circuit board sections with flexible circuit board sections into a single, unified structure. The rigid areas (made of FR-4) support heavy components like processors and connectors. The flexible areas (made of polyimide, or PI) allow bending and folding. This design removes the need for connectors and wiring harnesses.

UGPCB에, we define a high-quality rigid-flex printed circuit board as one that maintains signal integrity under drone-specific stresses, including high vibration, tight folding, and wide temperature variation. Our model is tailored for flight control systems, video transmission modules, and gimbal assemblies.

2. Key Specifications and Structure

The table below lists the core specifications for this UGPCB model.

매개 변수 사양
모델 UAV Rigid-Flex PCB
재료 FR-4 (엄격한) + PI (flex)
레이어 스택 업 엄격한: 4 레이어 / Flex: 2 레이어
완성된 두께 Rigid area: 1.0mm / Flex area: 0.15mm
구리 두께 1 온스 (internal and external layers)
표면 마감 이머젼 골드 (동의하다)
최소. 추적하다 / 공간 4 밀 / 4 밀
솔더 마스크 색상 녹색 (엄격한) / White coverlay (flex)

3. How It Works and Key Design Considerations

작동 방식

이것 리지드 플렉스 PCB acts as the central nervous system of a drone. The 4-layer rigid section provides a stable platform for soldering core components such as the main processor, 자이로 스코프, and power management ICs. The 2-layer flexible section connects moving parts—like motors and gimbal cameras—without mechanical connectors. This allows free movement and folding without breaking the electrical path.

디자인 고려 사항

  1. Transition Zone Protection: The junction between rigid and flexible areas is the most stress-prone point. UGPCB reinforces this area using teardrop pads and tapered trace widths. This prevents circuit breaks caused by continuous drone vibration.

  2. 임피던스 제어: For high-frequency video transmission signals (typically 50Ω or 100Ω differential), we use the 4 mil trace width and spacing to maintain consistent impedance across both rigid and flex sections.

4. 재료 선택: FR-4 and PI

Why does UGPCB use FR-4 and PI for this unmanned aerial vehicle rigid-flex PCB?

  • 엄격한 지역 (FR-4): We select high-Tg (glass transition temperature) FR-4. This ensures the board does not soften or warp during high-power drone flights, preventing solder joint failure.

  • Flex Areas (PI – 폴리이미드): The flexible sections use high-grade polyimide. This material withstands repeated bending and extreme temperatures ranging from -40°C to +150°C. The asymmetric thickness (1.0mm rigid vs. 0.15mm flex) balances mechanical strength with the thinness required for tight folding.

5. 성능 기능

The combination of 1 온스 구리, 침수 금, 그리고 4 Mil Trace/Space delivers measurable performance benefits.

  • 높은 신뢰성: 이머젼 골드 (동의하다) creates a flat, oxidation-resistant surface. This supports fine-pitch BGA soldering and eliminates the risk of solder balls common with HASL finishes.

  • 신호 무결성: 그만큼 4 mil trace width allows designers to route differential pairs in tight spaces. This reduces electromagnetic interference (EMI), which is critical for sensitive GPS and video signals.

  • Weight Reduction: Replacing a “rigid board + 커넥터 + cable” assembly with a single rigid-flex board can reduce total interconnect weight by up to 40%. This weight saving extends drone flight time.

  • 열 성능: The white coverlay on the flexible section reflects more heat than traditional yellow coverlay. This helps manage temperatures during prolonged drone hovering.

6. Industry Classification

Based on IPC and industry standards, this product falls under:

  • Primary Category: Flexible and Rigid-Flex Printed Boards

  • Secondary Category: Multi-layer Rigid-Flex with Asymmetric Construction

  • Application Class: Aerospace and Unmanned Aerial Vehicle Electronics

7. 제조공정 (IPC-6013 & UL Compliance)

UGPCB follows a controlled process to meet IPC-6013 (Flexible/Rigid-Flex Board Qualification) and UL 94 다섯-0 flammability standards. The key steps for this 4-layer rigid + 2-layer flex design are:

  1. 재료 준비: FR-4 and PI base materials are cleaned and prepared.

  2. Coverlay and Lamination: The flexible areas receive precision coverlay openings. 그만큼 4 rigid layers and 2 flex layers are then laminated together under high temperature and vacuum. This step requires precise adhesive flow control to prevent voids at the rigid-flex boundary.

  3. 시추 및 도금: Laser drilling is used for microvias in the flexible areas. Copper is then plated to achieve 1 oz thickness in all vias.

  4. Outer Layer Imaging and Plating: The outer layer circuits are formed, and final copper plating completes the 1 oz specification.

  5. 표면 마감 (이머젼 골드): ENIG is applied to all exposed copper pads.

  6. Profiling and Electrical Test: The board is routed to final shape. Every board undergoes 100% 비행 프로브 테스트 to verify electrical integrity.

8. 일반적인 응용 프로그램

이것 unmanned aerial vehicle rigid-flex PCB is suitable for the following applications:

  • Foldable Consumer Drones: Used in hinge areas that require thousands of folds over the product lifespan.

  • FPV (First-Person View) Racing Drones: Eliminates connectors to reduce weight and improve thrust-to-weight ratio.

  • Camera Gimbals: Connects motors to the main board with fine flexible circuits that ensure zero signal lag during rapid movement.

  • Tethered Drones: 그만큼 1 oz copper in rigid sections handles high current and dissipates heat effectively during long-duration operations.

UGPCB UAV Rigid-Flex PCB: Application in Folding Drones

9. UGPCB를 선택하는 이유는 무엇입니까??

UGPCB 전문 리지드 플렉스 인쇄 회로 기판 with complex stackups. We have proven experience manufacturing fine-line designs (4 mil/4 mil) and asymmetric structures (1.0mm rigid + 0.15mm flex). Our commitment includes:

  • Exact Specification Match: We build strictly to your Gerber files and stackup requirements.

  • Fast Prototyping: 우리는 제공합니다 5- to 7-day expedited service for drone developers who need rapid iteration.

  • 설계 지원: Our engineering team reviews your files to optimize rigid-flex transitions and minimize manufacturing risks.

10. Request a Quote

Are you developing a drone and need a UAV rigid-flex PCB that balances weight, 내구성, 신호 무결성? UGPCB supports projects from prototype to mass production. Contact our sales team for a competitive quote based on your 4-layer rigid, 2-layer flex requirements.

Click “Inquire Now” to let UGPCB support your next-generation drone design.

이전:

다음:

답장을 남겨주세요

메시지를 남겨주세요