UGPCB 심층 분석: 6-레이어 리지드 + 4-레이어 플렉서블 옐로우 솔더마스크 리지드 플렉스 보드 - 고밀도 상호 연결의 새로운 시대를 열다

In today’s rapid evolution toward lightweight, 얇은, 짧은, and compact electronic devices, 그만큼 리지드 플렉스 PCB has become indispensable in high-precision fields such as telecommunications, medical instruments, 항공 우주. Its unique combination of rigid support and three-dimensional flexibility makes it a critical interconnect component.

전문가로서 PCB 제조업체, UGPCB introduces its high-performance Yellow Soldermask Rigid-Flex PCB (R-FPCB) . This article explores this advanced board, 으로 구축 FR-4 + PI materials 그리고 a 6-layer rigid plus 4-layer flexible 구조. We will examine its design principles, 제조 공정, and applications, showing how it enables more stable signal transmission and a more compact system layout.

1. 제품 정의 및 개요

UGPCBYellow Soldermask Rigid-Flex Board integrates a rigid PCB and a flexible circuit board into a single interconnect solution through a lamination process.

주요 사양:

• 레이어 스택 업: 6 레이어 (6엘) in rigid sections / 4 레이어 (4엘) in flexible sections

• Material Combination: FR-4 (rigid areas) + PI (폴리이미드, flexible areas)

• Surface Color: Yellow soldermask (엄격한) / White coverlay (flex)

• 완성된 두께: 0.4mm (rigid sections) / 0.2mm (flex sections)

This design retains the structural support and component-carrying capacity of rigid areas while utilizing the bendability of flexible sections. It achieves a true rigid-flex integration, eliminating the need for traditional connectors and ribbon cables.

2. Design Principles and Technology

에이. 작동 원리

The core of rigid-flex technology lies in seamless interconnection. UGPCB laminates flexible PI layers with rigid FR-4 layers under high temperature and pressure. In flexible zones, FR-4 material is removed, leaving the PI base with a coverlay to allow bending. In rigid zones, FR-4 remains to support 구성 요소. This structure eliminates physical contact points from connectors, significantly enhancing 신호 무결성 (그리고) and vibration resistance.

비. 디자인 고려 사항

• 임피던스 제어: For high-frequency communication PCBs, strict control of 3.5mil trace width and spacing ensures consistent differential impedance (예를 들어, 100오).

• Transition Zone Protection: The junction between rigid and flexible sections (the stub) is a stress point. UGPCB’s design uses rounded transitions and tapered trace widths to prevent cracking during bending.

• Stackup Matching: Uniform 1OZ copper thickness is maintained to prevent fatigue failure in the flexible sections during dynamic flexing.

3. Material and Performance Analysis

에이. 핵심 재료

• FR-4 (엄격한 지역): A fiberglass-reinforced epoxy laminate. It offers high mechanical strength, 내열, and insulation, providing a stable platform for mounting heavy components like chips and connectors.

• PI (유연한 지역): Polyimide film. It provides excellent high-temperature resistance (operating >150°C), a low dielectric loss factor (Df), and a high flex life.

• 표면 마감: 이머젼 골드 (동의하다). This chemical process deposits a nickel-gold layer over copper.

  • 장점: High surface flatness suitable for fine-pitch circuits (3.5mil spacing), strong oxidation resistance, and good solderability along with aluminum wire bonding capability.

비. Key Performance Specifications

4. Structural Classification and Features

에이. Structural Classification

이 제품은 asymmetric structure (6-layer rigid + 4-layer flexible) within the category of multi-layer rigid-flex boards. 일반적으로, rigid-flex boards are classified as:

• Layered Type: Flexible layers extend out independently, as seen in this product.

• Non-layered Type: The entire board uses flexible material, with stiffeners added to specific areas.

비. 제품 기능

• 높은 신뢰성: The immersion gold finish combined with PI material ensures stable electrical performance even in harsh environments (high temperature and humidity).

• 높은 정밀도: Manufacturing capabilities for 3.5mil fine lines and 0.1mm micro vias solve high-density interconnect challenges.

• 공간 최적화: Replaces connectors, reducing installation volume by over 60% and lowering overall product weight.

• Visual Differentiation: The yellow soldermask provides a unique appearance and offers clearer contrast during SMT assembly, facilitating optical inspection.

5. Manufacturing Process and Quality Control

To ensure the reliability of this complex 6L+4L structure, UGPCB follows a rigorous production flow:

1. Inner Layer Circuit (Flex Area): Fine 3.5mil circuits are formed on the PI base material using laser or photolithography.

2. Coverlay Lamination: A protective film is laminated onto the flexible circuit, leaving only the pad areas exposed.

3. 라미네이션: Rigid and flexible layers are aligned and laminated under vacuum. Key controls are the temperature profile and resin flow to prevent voids.

4. 교련 & 도금: 0.1mm micro vias are drilled. Electroless copper deposition creates interlayer connections.

5. 외층 & 솔더 마스크: Yellow soldermask is applied to rigid areas; white coverlay remains on flexible areas.

6. 표면 마감: 이머젼 골드 (동의하다) is applied with controlled thickness: 0.05-0.1μm Au / 3-5μm Ni.

7. 프로파일링 & 전기 테스트: Laser routing or die punching defines the final shape. 100% AOI and 비행 프로브 testing verify electrical integrity.

6. 응용

This product is primarily targeted at the통신 PCB sector. Key applications include:

• 5G Communication Base Stations: Used for flexing connections in RF modules, solving compact interconnect needs between antennas and mainboards.

• 스마트폰 & 웨어러블: The 0.2mm flexible section enables dynamic bending in foldable phone hinges.

• 의료 전자 장치: Used in devices like ultrasonic endoscope probes, leveraging PI’s biocompatibility and high-density routing.

• 자동차 전자: ADAS camera modules that must withstand constant vibration and thermal shock.

7. UGPCB를 선택하는 이유는 무엇입니까??

Engineers often face challenges with low yields and long lead times for complex rigid-flex designs. UGPCB is a reliable supply chain partner offering:

• 제조 능력: Mass production capability for 3.5mil trace/space, overcoming high-density interconnect barriers.

• 재료 소싱: Uses high-quality materials from suppliers like Shengyi/ITEQ for FR-4 and DuPont/Tayoho for PI, ensuring quality from the source.

• Engineering Support: Provides free DFM (제조 가능성을위한 설계) checks to help optimize designs, especially in the rigid-flex transition zone.

Are you designing a circuit board that must both carry complex ICs and flex within a tight space?

UGPCB now offers prototyping and mass production services for this6-layer rigid + 4-layer flexible yellow soldermask rigid-flex PCB.

👉 Get a Quick Quote Today

Send your Gerber files and technical requirements to [sales@ugpcb.com] or click the online chat. Our engineering team will provide a professional DFM report and a competitive quote within 24 시간.