Декодирование платежных чертеж: Комплексное руководство по слоям файла Гербера

Введение: Gerber Files – The DNA of PCB Manufacturing

В Высокоскоростной дизайн печатной платы, Gerber files encapsulate over 90% of manufacturing data. According to IPC-2581 standards, 85% of global Производители печатной платы rely on Gerber as primary production documentation. Как “industrial blueprint” of electronics, Gerber files precisely describe a circuit board’s physical structure through layered encoding. This guide decodes each layer’s engineering significance to help you master Изготовление печатной платы.

Раздел 1: Complete Gerber File Export Workflow

1.1 Pre-Export Verification

• DRC Validation: Ensure spacing compliance with IPC-2221 standards (Мин. trace/space = 0.1mm @ 6-layer печатные платы)

• Stackup Confirmation: Impedance control must satisfy:

  

  Где ЧАС = dielectric thickness, Вт = trace width, Т = copper thickness (1 oz = 35µm).

1.2 Export Mode Comparison

Раздел 2: Gerber Layer Structure Deep Dive

2.1 Conductive Layers Explained

Copper Layers:

• Top/Bottom Layer: Surface routing (Typ. 1 Оз меди)

• Inner Layers: 6-слой PCB Stackup: Top-GND-Signal-Power-Signal-Bottom

Drill Layers:

2.2 Process-Supporting Layers

Solder Mask Layer:

• Negative image output (Exposes copper openings)

• Мин. прозрачный: 0.07мм (Prevents solder mask bridging failure)

Paste Mask Layer:

• Stencil aperture = Pad size × 90%

• QFN packages require cross-bridge anti-solder bead design

Шелкостный слой:

• Text height ≥0.8mm, line width ≥0.15mm

• Bottom layer silkscreen requires mirroring

Раздел 3: Gerber Features in Multilayer PCBs

3.1 Layer Count vs. Gerber Files

3.2 Advanced Process Implementation

Виппо (Via-in-Pad):

• Hole diameter ≤0.15mm, pad size ≥0.3mm

• Label as “μVia” in drill layers

Stepped Slot Design:

• MechanicalLayer annotation:
  SLOT:3.0x1.2mm @ Layer2-4

Раздел 4: DFM Rules Driven by Gerber Data

4.1 Manufacturability Checks

4.2 High-Speed Design Markers

• Дифференциальные пары: IMPEDANCE:100Ω±10%

• RF traces: NO_SOLDERMASK (Reduces Dk variation)

Раздел 5: From Layout Engineer to PCB Architect

True PCBA design experts master:

5.1 Целостность сигнала (И)

• Delay control: ΔL ≤ 0.05√ε_r (ps/inch)

• Crosstalk prevention: 3W rule (Spacing ≥ 3×trace width)

5.2 Power Integrity (ПИ)

• Target импеданс:

  

• Decoupling capacitor layout: Radial placement by capacitance

5.3 Тепловое управление

• Copper current capacity:
  I=0.048⋅ΔT0.44⋅A0.725
  (ΔT = temperature rise, A = cross-section)

Заключение: The Engineering Philosophy of Gerber Files

When exporting Gerber data, remember: These “cold” layers represent precision dialogues between electronics and materials science. From 0.05mm laser drills to 10μm solder mask tolerances, each Gerber layer narrates the engineering philosophy of signal isolation and conductive pathways.

Industry data reveals: Using Gerber+ODB++ dual-file delivery increases first-pass yield by 40%. In the 5G/AI era, mastering Gerber semantics means controlling the core of intelligent hardware manufacturing.