UGPCB 18-Layer Server PCB Solution | High-Performance Computing PCB for Data Centers

UGPCB 18-Layer Server PCB: Engineered for High-Performance Computing & Центры обработки данных

In the era of data centers and cloud computing, server stability and performance are critical to digital business operations. As the fundamental hardware carrier, the precision design and exceptional quality of Server печатные платы (Печатные платы) are paramount. Leveraging deep industry expertise and cutting-edge technology, УГКПБ provides high-performance, highly reliable 18-layer server PCBs to meet the most demanding requirements of next-generation data center applications.

Обзор продукта & Определение

A server PCB is the core component of server motherboards, storage backplanes, and various functional daughter cards. It hosts critical components like CPUs, память, and chipsets, facilitating high-speed signal transmission, Распределение энергии, and system interconnection. Designed specifically for high-performance application servers, this UGPCB product utilizes an 18-layer high multilayer structure and an enhanced board thickness of 2.4mm ±10%, serving as a robust hardware foundation for processing massive datasets and supporting high-speed computations.

Core Design Highlights & Технический анализ

To address server platforms’ extreme demands for signal integrity, целостность власти, и тепловое управление, this product integrates several key technologies:

1. Advanced Stack-up & Материалы:

   • Ламинат: Utilizes ITEQ IT968G high-speed, low-loss material. Its high Tg (Температура стеклянного перехода) ensures dimensional stability and consistent electrical performance under prolonged high-temperature server operation, effectively reducing signal transmission loss.

   • Слои & Copper Weight: An 18-layer complex stack-up with a meticulously designed hybrid copper weight scheme (featuring 2Oz thick copper foil on select inner layers). This optimizes the current-carrying capacity and thermal performance of power planes while enabling fine-line routing on high-speed signal layers.

2. Precision Routing & Interconnection:

   • Line Capability: Achieves ultra-fine line width/space of 0.1mm/0.1mm, meeting the fan-out and interconnection requirements for high-density BGA packages (например, Процессор, Графический процессор, ПЛИС).

   • Технология микровий: Supports a minimum mechanical drill diameter of 0.20mm, enhancing routing density and space utilization.

3. Key Technologies for Signal Integrity:

   • Back-Drilling: For high-speed differential signals (например, PCIE, Сас, Ethernet), the back-drilling process removes unused copper stubs from through-holes, significantly reducing signal reflection and attenuation. This is a core process for ensuring signal quality in Высокоскоростные печатные платы.

   • RTF Copper Foil: Uses Reverse Treated Foil, which provides a smoother copper surface. This effectively reduces skin effect loss for high-frequency signals, improving signal transmission efficiency.

4. Reliable Surface Finish:

   • Химическое никель, иммерсионное золото (СОГЛАШАТЬСЯ) is applied as the final surface treatment. ENIG provides a flat surface, excellent solderability, a reliable contact interface, and long-term oxidation resistance, making it ideal for soldering dense, fine-pitch компоненты on server PCBs.

Особенности продукта & Преимущества

• Exceptional Electrical Performance: High-speed IT968G laminate combined with back-drilling and RTF foil ensures low-loss, low-latency transmission of high-frequency signals, making it an ideal choice for высокочастотные печатные платы и Высокоскоростные печатные платы.

• Superior Power Handling & Тепловое управление: 2Oz inner-layer copper and the 2.4mm board design enhance current-carrying capacity, overall structural rigidity, and thermal conductivity.

• Высокая плотность & Надежность: The 18-layer routing space coupled with 0.1/0.1mm line width/space supports the most complex designs. Strict process control and high-Tg materials ensure long-term reliability for 24/7 uninterrupted operation.

• End-to-End Service Support: UGPCB offers not only top-tier Производство печатных плат but also a one-stop solution from design review to production, accelerating your time-to-market.

Production Process Overview

Our manufacturing adheres to stringent Стандарты IPC and a quality management system:
Engineering Review → Material Preparation → Inner Layer Imaging → Lamination → Drilling & Back-Drilling → Hole Metallization → Outer Layer Imaging → Plating (for hybrid copper weight) → Solder Mask Application (Pre-ENIG) → ENIG → Routing / Profiling → Electrical Test & Заключительная проверка

https://via.placeholder.com/800×450.png?text=18-Layer+PCB+Cross-Section
Alt Text: Cross-sectional view of an 18-layer server PCB board, detailing precise lamination and back-drilled via structures for high-speed signal transmission.

Приложения & Классификация

This high-performance PCB is widely used in:

• Enterprise & Cloud Server Motherboards

• Data Center AI Computing Acceleration Cards

• High-Performance Storage Servers & Западные планы

• Network Switch & Communication Equipment Core Boards

Technical Classification:

• По количеству слоев: Высокий Многослойная печатная плата (18 Слои)

• По технологиям: High-Speed/High-Frequency PCB, Back-Drilled PCB, Тяжелая медная печатная плата

• По приложению: Server/Data Center PCB

• По отделке поверхности: СОГЛАШАТЬСЯ (Химическое никель, иммерсионное золото) печатная плата

Выберите UGPCB, and you select more than just a high-quality server PCB board; you gain a trusted partner in advanced PCB manufacturing. We are dedicated to translating complex technical details into reliable advantages for your products, empowering your next-generation data center solutions.

Contact our expert team today for a customized PCB solution quote and technical consultation!