Обзор продукта
УГКПБ представляет 6‑layer 2+N+2 HDI PCB (Модель: 6L 2+N+2 HDI PCB). This high‑density interconnect печатная плата is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, и 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, оптические модули, и подобные приложения.
В печатная плата промышленность, ИЧР (Взаимодействие высокой плотности) technology is the core enabler for shrinking component pitches and rising signal speeds. The 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, целостность сигнала, и стоимость изготовления.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theМПК‑2226 standard and is classified asТип III within that system.
Breaking down the term:
- The first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, то есть, two inner core layers).
- The second “2” means two sequential build‑up layers below the core.
Таким образом, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
Классификация ИЧР согласно IPC‑2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| Тип ИЧР | Структура | Build‑up Layers (на сторону) | Minimum BGA Pitch | Типичные приложения |
|---|---|---|---|---|
| Тип i | 1+N+1 | 1 слой | 0.5мм | Смартфоны, mid‑density designs |
| Type II/III | 2+Н+2 | 2 слои | 0.4мм | Сетевое оборудование, high‑performance computing |
| Тип III / ЭЛИК | 3+N+3 and above | 3+ слои | 0.3mm and below | Флагманские смартфоны, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered конфигурации.
Основные технические характеристики
| Параметр | Спецификация |
|---|---|
| Модель | 6L 2+N+2 HDI PCB |
| Материал | ITEQ IT150 |
| Количество слоев | 6 слои (2+N+2 second‑order HDI) |
| Спорная маска цвет | Черный или белый (необязательный) |
| Толщина готовой доски | 1.0мм |
| Толщина меди внутреннего слоя | 1 ОЗ (~35μm) |
| Толщина меди внешнего слоя | 0.5 ОЗ (~17.5μm) |
| Минимальный след / Расстояние | 2.5мил / 2.5мил (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2мм |
| Minimum Laser Drill | 0.1мм |
| Поверхностная отделка | Погружение Золото + ОСП |
| Основное приложение | Коммуникационное оборудование |
Material Deep Dive: ITEQ IT150
Material Positioning
ITEQ IT150 это medium‑Tg, halogen‑free, multifunctional epoxy ламинат. It sits between standard ФР‑4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (Тг >150° C по DSC), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, хранилище, and networking applications.
Ключевые параметры производительности
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| Свойство | Метод испытания | Типичное значение | Единица |
|---|---|---|---|
| Температура стеклянного перехода (Тг) | ДСК (IPC‑2.4.25) | 155 | °С |
| Температура разложения (Тд, 5% потеря веса) | ТГА (IPC‑2.4.24.6) | 365 | °С |
| CTE по оси Z (А1, ниже Тс) | IPC‑2.4.24 | 35–40 | ppm/° C. |
| CTE по оси Z (A2, выше Тс) | IPC‑2.4.24 | 220–240 | ppm/° C. |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | ppm/° C. |
| Диэлектрическая проницаемость (Дк) @ 1 ГГц | IPC‑2.5.5.13 | 4.2–4,5 | - |
| Коэффициент рассеяния (Дф) @ 1 ГГц | IPC‑2.5.5.13 | 0.010–0.018 | - |
| T288 Thermal Stress | IPC‑TM‑650 | >60 | Minutes |
| Влажно -поглощение | IPC‑2.6.2.1 | 0.12 | % |
| Рейтинг воспламеняемости | UL94 | В‑0 | Рейтинг |
| UL MOT (Max Operating Temp) | - | 130 | °С |
Преимущества материала
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155°С. Under lead‑free reflow peaks of260°С, this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. Отличное сопротивление CAF
Каф (Проводящая анодная нить) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18л / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (кл) и Бром (Бренд) content are each below 0.09% по весу. Total Cl+Br is below 0.15% (1500ppm).
Рекомендации по проектированию
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2мм), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1мм) and fill with copper.
- Схемы внешнего слоя – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
Этотtwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
Этот продукт достигает 2.5мил/2,5 мил (~63.5μm/63.5μm) trace width and spacing. This exceeds the HDI-дизайн Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4мм шаг BGA breakout with ample routing channels.
- Flexible signal routing for high‑density компонент размещение.
- Reduced layer count, which lowers overall PCB cost.
Технология микровий
В этом продукте используетсяhybrid drilling approach:
- Механическое бурение – Minimum diameter 0.2мм, used for through‑holes and buried vias in the core.
- Лазерное бурение – Minimum diameter 0.1мм (4мил) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingчерез-in-pad designs for fine‑pitch BGAs.
Принцип работы
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by механическое бурение + покрытие, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by лазерное бурение + покрытие, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
Этотstepped interconnect structure shortens signal paths and reduces parasitic via effects. Как результат, it preserves high‑speed signal integrity.
Преимущества производительности
Тепловая надежность
ITEQ IT150’sТд (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 минуты without delamination. This ensures material integrity through multiple reflow cycles.
Целостность сигнала
В 1 ГГц, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
Механическая прочность
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
Классификация продуктов
This product is classified across multiple dimensions:
| Classification System | Категория |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+Н+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | Жесткая печатная плата |
| Количество слоев | 6‑слойная многослойная плата |
| Система материалов | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| Поверхностная отделка | Погружение Золото + OSP hybrid finish |
| Домен приложения | Communication‑grade PCB |
Схема производственного процесса
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
Шаг 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
Шаг 2: First Build‑Up
Ламинирование (основной + препарат + медная фольга) → First lamination → First‑order laser drilling (0.1мм) → Desmear → Electroless copper + plating → Circuit patterning
Шаг 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1мм) → Desmear → Electroless copper + plating → Circuit patterning
Шаг 4: Outer Layer and Finishing
Механическое бурение (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5мил/2,5 мил) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
Сценарии приложения
This product is primarily designed forоборудование связи:
5G Коммуникационная инфраструктура
- 5G Базовые станции (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- Оптические приемопередатчики.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA маршрутизация. It enables complex signal interconnects within limited board space.
Почему выбирают UGPCB?
УГКПБ brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows МПК‑6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment Производство печатных плат.
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Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
Декларация источника данных
The technical data cited in this document comes from the following authoritative standards and sources:
- МПК‑2226 – Sectional Design Standard for High Density Interconnect (ИЧР) Printed Boards
- IPC‑6012E/F – Квалификационные и эксплуатационные характеристики жестких печатных плат
- IPC/JPCA‑2315 – Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- IPC‑TM‑650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, и другие)
- JPCA‑ES‑01‑2003 – Halogen‑Free Copper‑Clad Laminate Standard
- UL94 – Стандарт на безопасность воспламеняемости пластмассовых материалов для деталей устройств и приборов
