22-Layer Server-Grade PCB Manufacturer | Heavy Copper PCB with Controlled Depth Drilling | UGPCB Expert Solutions

Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, искусственный интеллект, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server Печатные платы (печатные платы) is paramount. Leveraging deep technical expertise, UGPCB предоставляет профессионал, customized, high-performance server PCB manufacturing and печатная плата (Печатная плата в сборе) one-stop solutions.

1. Обзор продукта & Определение

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, память, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, целостность власти, and thermal performance.

The specifications you provide (Толщина доски: 2.8mm ±10%, 22 Слои, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, высокая плотность, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

2. Design Essentials & Key Technologies

The success of such advanced Проекты печатных плат hinges on mastering a range of cutting-edge technologies:

1. Stack-up & Контроль импеданса: The complex 22-layer stack-up requires precise calculation to achieve strict контроль импеданса (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of Высокоскоростной дизайн печатной платы.

2. Назад бурение: This critical process removes the unused copper stub from high-speed signal vias (например, for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (Дф) and stable dielectric constant (Дк) ensure signal purity and low latency. A high Glass Transition Temperature (Тг >170°С) guarantees material reliability under the prolonged high-temperature operation of servers.

4. РТФ (Reverse Treated Foil) Медь: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (например, high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. Производительность & Структурные особенности

• Exceptional Electrical Performance: Extremely low signal loss and excellent impedance consistency meet the demands of high-speed protocols like PCIe 4.0/5.0 and DDR4/DDR5.

• Ultra-High Reliability: СОГЛАШАТЬСЯ (Химическое никель, иммерсионное золото) surface finish provides a flat soldering surface and superior oxidation resistance, ensuring long-term connection reliability. The 10oz thick inner copper cores (combined with the 2/1oz design) offer robust current-carrying capacity and thermal pathways for power layers.

• Precision Manufacturing Capability: The 0.1/0.1 mm trace/space and a minimum finished hole diameter of 0.25mm demonstrate UGPCB’s top-tier expertise in high-precision Изготовление печатной платы.

• Robust Thermal Management: The 2.8mm thick board structure, combined with thick copper design, provides excellent thermal dissipation, aiding overall system cooling.

4. Производственный процесс & Контроль качества

UGPCB’s server Производство печатных плат follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (СОГЛАШАТЬСЯ) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, АОИ (Автоматическая оптическая проверка), и еще, ensuring every delivered PCB meets design specifications.

5. Сценарии приложения & Technical Classification

This high-performance server PCB is widely used in:

• Серверы ИИ & GPU Accelerator Cards: For processing massive parallel computing tasks.

• Cloud Computing Data Center Servers: As core compute nodes.

• High-End Storage Servers: For high-speed data storage and exchange.

• Network Switching Equipment: Core routing and switching motherboards.

Scientific Classification:

• По количеству слоев: High Multi-layer Board (22 Слои)

• По технологиям: High-Speed/High-Frequency PCB, Back-Drilled PCB, Тяжелая медная печатная плата, Взаимодействие высокой плотности (ИЧР) печатная плата

• По приложению: Data Center/Server-Dedicated PCB