УГКПБ

22-Layer Производитель печатных плат серверного уровня | Печатная плата из тяжелой меди со сверлением с контролируемой глубиной | Экспертные решения УГКПБ

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Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, искусственный интеллект, и облачные вычисления, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server Печатные платы (печатные платы) имеет первостепенное значение. Leveraging deep technical expertise, UGPCB предоставляет профессионал, customized, high-performance server PCB manufacturing and печатная плата (Печатная плата в сборе) one-stop solutions.

1. Обзор продукта & Определение

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, память, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, целостность власти, and thermal performance.

The specifications you provide (Толщина доски: 2.8мм ±10%, 22 Слои, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, высокая плотность, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, карты-ускорители, and backplanes.

High-layer-count server PCB manufactured by UGPCB, installed inside a high-performance data center server

2. Design Essentials & Ключевые технологии

The success of such advanced Проекты печатных плат hinges on mastering a range of cutting-edge technologies:

  1. Стек-ап & Контроль импеданса: The complex 22-layer stack-up requires precise calculation to achieve strict контроль импеданса (typically 50Ω single-ended, 100Ом дифференциал), forming the cornerstone of Высокоскоростной дизайн печатной платы.

  2. Назад бурение: This critical process removes the unused copper stub from high-speed signal vias (например, for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

  3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (Дф) and stable dielectric constant (Дк) ensure signal purity and low latency. A high Glass Transition Temperature (Тг >170°С) guarantees material reliability under the prolonged high-temperature operation of servers.

  4. РТФ (Фольга с обратной обработкой) Медь: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

  5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (например, high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. Производительность & Структурные особенности

4. Производственный процесс & Контроль качества

UGPCB’s server Производство печатных плат follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (СОГЛАШАТЬСЯ) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, АОИ (Автоматическая оптическая проверка), и еще, ensuring every delivered PCB meets design specifications.

5. Сценарии приложения & Technical Classification

This high-performance server PCB is widely used in:

Scientific Classification:

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